{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831215","patent":{"patent_number":"US-9831215","title":"Semiconductor package and forming method thereof","assignee":null,"inventors":[],"filing_date":"2016-08-03T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor package includes at least one first semiconductor device, a first molding compound, a dielectric layer, at least one conductive feature and at least one compensating structure. The first molding compound is present on at least one sidewall of the first semiconductor device. The dielectric layer is present on the first molding compound and the first semiconductor device. The conductive feature present is at least partially in the dielectric layer and electrically connected to the first semiconductor device. The compensating structure is present at least partially in the dielectric layer. The compensating structure is monolithically connected to the first molding compound."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and forming method thereof","description":"A semiconductor package includes at least one first semiconductor device, a first molding compound, a dielectric layer, at least one conductive feature and at least one compensating structure. The fir","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831215","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831215","citation_suggestion":"Patentable. \"Semiconductor package and forming method thereof\" (US-9831215). https://patentable.app/patents/US-9831215","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831215","json":"https://patentable.app/api/llm-context/US-9831215","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:22:51.569Z"}