{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831216","patent":{"patent_number":"US-9831216","title":"Chip packaging module","assignee":null,"inventors":[],"filing_date":"2016-12-07T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","G06F","G06V","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":9,"abstract":"The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, where at least one second chip is disposed on a rear side of the first chip, each second chip has a second pad, and wherein the first pad of the first chip is connected to the second pad of the second chip via a redistribution layer. According to the chip packaging module in the present disclosure, a second chip is disposed on a rear side of a first chip, and a first pad is connected to a second pad via a redistribution layer. By means of a redistribution technology on surfaces of multiple chips, a lead of a pad on a front surface of a fingerprint recognition chip is masterly winded to the back for interconnection, so that an induction area on the front surface of the chip can fully contact with a human body. In addition, the multi-chip redistribution technology can also greatly narrow down an interconnection distance between chips, which improves efficiency of communication between chips."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip packaging module","description":"The present disclosure discloses a chip packaging module, including: a first chip, where a first pad is disposed on a side neighboring to a front surface of the first chip; at least a second chip, whe","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831216","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831216","citation_suggestion":"Patentable. \"Chip packaging module\" (US-9831216). https://patentable.app/patents/US-9831216","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831216","json":"https://patentable.app/api/llm-context/US-9831216","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:26:54.960Z"}