{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9831217","patent":{"patent_number":"US-9831217","title":"Method of fabricating package substrates","assignee":null,"inventors":[],"filing_date":"2017-03-22T00:00:00.000Z","publication_date":"2017-11-28T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"This disclosure provides a package substrate fabrication method including: forming a first conductive wire and a first connecting unit on a first carrier substrate; forming a first dielectric layer on the first carrier substrate while enabling an end face of the first connecting unit to be exposed; bonding a second carrier substrate to the first dielectric layer and removing the first carrier substrate; disposing a first circuit chip and a second connecting unit on the first conductive wire; forming a second dielectric layer on the second carrier substrate while enabling the first circuit chip and the second connecting unit to be surrounded by the second dielectric layer and an end face of the second connecting unit to be exposed; forming a second conductive wire on the second dielectric layer; disposing a second circuit chip on the second conductive wire; and forming a third dielectric layer on the second carrier substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Method of fabricating package substrates","description":"This disclosure provides a package substrate fabrication method including: forming a first conductive wire and a first connecting unit on a first carrier substrate; forming a first dielectric layer on","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9831217","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9831217","citation_suggestion":"Patentable. \"Method of fabricating package substrates\" (US-9831217). https://patentable.app/patents/US-9831217","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9831217","json":"https://patentable.app/api/llm-context/US-9831217","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:06:00.492Z"}