{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9837342","patent":{"patent_number":"US-9837342","title":"Multilayer wiring board and method for manufacturing same","assignee":null,"inventors":[],"filing_date":"2015-07-27T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A multilayer wiring board includes a main wiring board which mounts a semiconductor component on a surface of the main wiring board, and a wiring structure body which is mounted to the main wiring board and is formed to be electrically connected to the semiconductor component. The wiring structure body includes conductive pads formed on a first side of the wiring structure body, a heat radiation component formed on a second side of the wiring structure body on the opposite side with respect to the first side, an insulation layer positioned between the conductive pads and the heat radiation component, and via conductors formed in the insulation layer such that each of the via conductors has a diameter which increases from the first side toward the second side of the wiring structure body."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilayer wiring board and method for manufacturing same","description":"A multilayer wiring board includes a main wiring board which mounts a semiconductor component on a surface of the main wiring board, and a wiring structure body which is mounted to the main wiring boa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9837342","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9837342","citation_suggestion":"Patentable. \"Multilayer wiring board and method for manufacturing same\" (US-9837342). https://patentable.app/patents/US-9837342","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9837342","json":"https://patentable.app/api/llm-context/US-9837342","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:37:56.302Z"}