{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9837345","patent":{"patent_number":"US-9837345","title":"Interposer and circuit substrate","assignee":null,"inventors":[],"filing_date":"2016-07-15T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, the third surface is perpendicular to the first surface, the fourth surface is on the opposite side of the third surface, and the insulating layers are laminated on the third surface, and conductor layers formed in the insulating plate such that each conductor layer is interposed between adjacent insulating layers and includes straight conductors having first electrodes exposed from the first surface and second electrodes exposed from the second surface, respectively. The insulating layers include second insulating layers each sandwiched by adjacent conductor layers such that each second insulating layer integrally has an inter-conductor-layer insulating layer portion formed between the adjacent conductor layers and inter-conductor insulating layer portions formed between adjacent straight conductors in a respective conductor layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Interposer and circuit substrate","description":"An interposer includes an insulating plate including insulating layers and having first, second, third and fourth surfaces such that the second surface is on the opposite side of the first surface, th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9837345","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9837345","citation_suggestion":"Patentable. \"Interposer and circuit substrate\" (US-9837345). https://patentable.app/patents/US-9837345","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9837345","json":"https://patentable.app/api/llm-context/US-9837345","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:19:23.263Z"}