{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9837367","patent":{"patent_number":"US-9837367","title":"Fabrication of solder balls with injection molded solder","assignee":null,"inventors":[],"filing_date":"2016-10-19T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"Wafers and methods of forming solder balls include forming a final redistribution layer over terminal contact pad on a surface of a wafer. The wafer includes multiple bulk redistribution layers. A hole is etched in the final redistribution layer to expose the terminal contact pad. Solder is injected into the hole using an injection nozzle that is in direct contact with the final redistribution layer. The final redistribution layer is etched back. The injected solder is reflowed to form a solder ball."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fabrication of solder balls with injection molded solder","description":"Wafers and methods of forming solder balls include forming a final redistribution layer over terminal contact pad on a surface of a wafer. The wafer includes multiple bulk redistribution layers. A hol","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9837367","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9837367","citation_suggestion":"Patentable. \"Fabrication of solder balls with injection molded solder\" (US-9837367). https://patentable.app/patents/US-9837367","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9837367","json":"https://patentable.app/api/llm-context/US-9837367","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:39.835Z"}