{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9837378","patent":{"patent_number":"US-9837378","title":"Fan-out 3D IC integration structure without substrate and method of making the same","assignee":null,"inventors":[],"filing_date":"2015-11-30T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A three-dimensional (3D) integrated circuit (IC) package is disclosed that contains a plurality of encapsulated layers stacked upon each other without the use of a substrate(s). Each of the encapsulated layers contains an encapsulating material, a die, an interconnecting interface, and vertical vias. The encapsulating material forms the surfaces of an encapsulated layer and encapsulates the die. The interconnecting interface provides an interface at a surface of the encapsulated layer for the die to electrically connect to other dies or external components. The vertical vias provide a conduction path between interconnecting interfaces of different encapsulated layers."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out 3D IC integration structure without substrate and method of making the same","description":"A three-dimensional (3D) integrated circuit (IC) package is disclosed that contains a plurality of encapsulated layers stacked upon each other without the use of a substrate(s). Each of the encapsulat","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9837378","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9837378","citation_suggestion":"Patentable. \"Fan-out 3D IC integration structure without substrate and method of making the same\" (US-9837378). https://patentable.app/patents/US-9837378","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9837378","json":"https://patentable.app/api/llm-context/US-9837378","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:15:19.872Z"}