{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9839130","patent":{"patent_number":"US-9839130","title":"Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device","assignee":null,"inventors":[],"filing_date":"2017-04-05T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A semiconductor integrated circuit device (101) includes a component built-in board (21) in which at least a first core layer (Co21) on which a first electronic component (C21) is mounted, a second core layer (Co22) on which a second electronic component (C22) is mounted, an adhesive layer (Ad21) arranged between the first core layer (Co21) and the second core layer (Co22), and wiring layers (L21-L28) are stacked; a third electronic component (SoC) mounted in a first core layer (Co21) side of the component built-in board (21) and electrically connected to at least one of the first and second electronic components (C21, C22) through the wiring layers (L21 to L28); and an external connection terminal (BE) formed in a second core layer (Co22) side of the component built-in board (21) and electrically connected to at least one of the first and second electronic components (C21, C22)."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device","description":"A semiconductor integrated circuit device (101) includes a component built-in board (21) in which at least a first core layer (Co21) on which a first electronic component (C21) is mounted, a second co","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9839130","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9839130","citation_suggestion":"Patentable. \"Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device\" (US-9839130). https://patentable.app/patents/US-9839130","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9839130","json":"https://patentable.app/api/llm-context/US-9839130","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:23:34.325Z"}