{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9839159","patent":{"patent_number":"US-9839159","title":"Dispense pattern for thermal interface material for a high aspect ratio thermal interface","assignee":null,"inventors":[],"filing_date":"2015-09-01T00:00:00.000Z","publication_date":"2017-12-05T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A pattern for heat transfer material for a thermal transfer interface having a high aspect ratio. Two thermal interface elements (e.g., a die and a cover) meet to form a thermal interface with a high aspect ratio (i.e., the ratio of length to width is above a threshold such as 9:5). The pattern includes two star-shaped patterns aligned side-by-side in the lengthwise (longer dimension) direction. Each star pattern includes spokes emanating from a local central point. The pattern optionally includes a central cross shape that includes a vertical line extending between the two longer edges and a horizontal thickened section in which horizontally aligned spokes are thickened. When pressed between two thermal interface elements, this pattern performs better (e.g., covers more area) than a more traditional pattern, thereby improving heat transfer ability."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Dispense pattern for thermal interface material for a high aspect ratio thermal interface","description":"A pattern for heat transfer material for a thermal transfer interface having a high aspect ratio. Two thermal interface elements (e.g., a die and a cover) meet to form a thermal interface with a high ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9839159","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9839159","citation_suggestion":"Patentable. \"Dispense pattern for thermal interface material for a high aspect ratio thermal interface\" (US-9839159). https://patentable.app/patents/US-9839159","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9839159","json":"https://patentable.app/api/llm-context/US-9839159","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:18:23.645Z"}