{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842771","patent":{"patent_number":"US-9842771","title":"Semiconductor device and fabrication method thereof and semiconductor structure","assignee":null,"inventors":[],"filing_date":"2014-05-08T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A semiconductor device is disclosed, which includes: a substrate having a plurality of connecting pads; a semiconductor component having a plurality of bonding pads formed on a surface thereof and corresponding to the connecting pads and a UBM layer formed on the bonding pads; a plurality of conductive elements each having a first conductive portion and a second conductive portion sequentially formed on the UBM layer, wherein the second conductive portion is less in width than the first conductive portion; and a plurality of solder balls formed between the second conductive portions and the connecting pads for connecting the semiconductor component and the substrate, thereby preventing solder bridging from occurring between the adjacent conductive elements and reducing stresses between the conductive elements and the UBM layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor device and fabrication method thereof and semiconductor structure","description":"A semiconductor device is disclosed, which includes: a substrate having a plurality of connecting pads; a semiconductor component having a plurality of bonding pads formed on a surface thereof and cor","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842771","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842771","citation_suggestion":"Patentable. \"Semiconductor device and fabrication method thereof and semiconductor structure\" (US-9842771). https://patentable.app/patents/US-9842771","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842771","json":"https://patentable.app/api/llm-context/US-9842771","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:18:01.488Z"}