{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842774","patent":{"patent_number":"US-9842774","title":"Through substrate via structure for noise reduction","assignee":null,"inventors":[],"filing_date":"2016-06-13T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device includes a substrate and a through substrate via structure. The substrate has a through via hole. The through substrate via structure is disposed in the through via hole. The through substrate via structure disposed in the through via hole includes a liner structure and a metal layer. The liner structure includes at least two insulation liners and at least one conductive shielding layer disposed between the insulation liners, in which the insulation liners and the at least one conductive shielding layer conformally cover a sidewall and a bottom of the through via hole. The metal layer covers the liner structure and fills the through via hole."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Through substrate via structure for noise reduction","description":"A semiconductor device includes a substrate and a through substrate via structure. The substrate has a through via hole. The through substrate via structure is disposed in the through via hole. The th","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842774","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842774","citation_suggestion":"Patentable. \"Through substrate via structure for noise reduction\" (US-9842774). https://patentable.app/patents/US-9842774","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842774","json":"https://patentable.app/api/llm-context/US-9842774","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:19:31.129Z"}