{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842784","patent":{"patent_number":"US-9842784","title":"System and methods for producing modular stacked integrated circuits","assignee":null,"inventors":[],"filing_date":"2015-06-23T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","G06F","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":27,"abstract":"A system according to some examples herein includes a base chip which may include a plurality of attachment slots for attaching dies thereto. One or more of the attachment slots may be programmable attachment slots. The base chip may further include circuitry for interconnecting the dies attached to the base chip. For example, the base chip may include a plurality of cross bar switches, each of which is associated with respective ones of the plurality of attachment slots. The base chip may further include a configuration block, which is adapted to receive and transmit test signals for determining electrically connected signal lines of one or more attachment slots when one or more dies are attached to the base chip and which is further adapted to receive configuration data for programming signal (including power and ground) channels of the cross bar switches."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"System and methods for producing modular stacked integrated circuits","description":"A system according to some examples herein includes a base chip which may include a plurality of attachment slots for attaching dies thereto. One or more of the attachment slots may be programmable at","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842784","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842784","citation_suggestion":"Patentable. \"System and methods for producing modular stacked integrated circuits\" (US-9842784). https://patentable.app/patents/US-9842784","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842784","json":"https://patentable.app/api/llm-context/US-9842784","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:39:19.102Z"}