{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842796","patent":{"patent_number":"US-9842796","title":"Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module","assignee":null,"inventors":[],"filing_date":"2015-06-08T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"An electronic module including a semiconductor unit situated in a plastic housing, an electrically conductive plate system, via which the semiconductor unit may be supplied with electrical power, the electrically conductive plate system being connected in a planar fashion to a heat-generating integrated circuit of the semiconductor unit via a heat coupler; and the electrically conductive plate system being designed in such a way that it dissipates the heat generated by the heat-generating integrated circuit of the semiconductor unit to the plastic housing. A method for manufacturing a corresponding electronic module is also described."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module","description":"An electronic module including a semiconductor unit situated in a plastic housing, an electrically conductive plate system, via which the semiconductor unit may be supplied with electrical power, the ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842796","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842796","citation_suggestion":"Patentable. \"Electronic module including a device for dissipating heat generated by a semiconductor unit situated in a plastic housing and method for manufacturing an electronic module\" (US-9842796). https://patentable.app/patents/US-9842796","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842796","json":"https://patentable.app/api/llm-context/US-9842796","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:05:55.593Z"}