{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842809","patent":{"patent_number":"US-9842809","title":"Semiconductor packages having EMI shielding parts and methods of fabricating the same","assignee":null,"inventors":[],"filing_date":"2016-01-06T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":19,"abstract":"A semiconductor package may include a semiconductor device mounted on a package substrate, a conductive roof located over the semiconductor device, a plurality of conductive walls disposed on the package substrate and arrayed in a closed loop line surrounding the semiconductor device. Conductive pillars may be disposed in regions between the conductive walls on the package substrate and bonded to the conductive roof. The semiconductor package may include a first dielectric layer filling a space between the package substrate and the conductive roof."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages having EMI shielding parts and methods of fabricating the same","description":"A semiconductor package may include a semiconductor device mounted on a package substrate, a conductive roof located over the semiconductor device, a plurality of conductive walls disposed on the pack","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842809","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842809","citation_suggestion":"Patentable. \"Semiconductor packages having EMI shielding parts and methods of fabricating the same\" (US-9842809). https://patentable.app/patents/US-9842809","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842809","json":"https://patentable.app/api/llm-context/US-9842809","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:21:32.552Z"}