{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842813","patent":{"patent_number":"US-9842813","title":"Tranmission line bridge interconnects","assignee":null,"inventors":[],"filing_date":"2015-09-21T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":22,"abstract":"In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The interposer structure, which includes multiple interposer layers, may be formed on a top surface of the package substrate. The printed circuit board may be coupled to the package substrate through the transmission line bridge interconnect. The transmission line may be formed on at least one of the interposer layers. The transmission line may be utilized to convey signals between the package substrate and the printed circuit board. The transmission line may be a stripline transmission line or a micro-strip transmission line. The transmission line may have a low parasitic inductance and implementation of the transmission line does not introduce large dimensional discontinuity throughout that signal pathway. The integrated circuit package may be part of a circuit system that includes external circuits."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Tranmission line bridge interconnects","description":"In one embodiment, an integrated circuit package includes a package substrate, a printed circuit board, an interposer structure and a transmission line bridge interconnect within the interposer. The i","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842813","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842813","citation_suggestion":"Patentable. \"Tranmission line bridge interconnects\" (US-9842813). https://patentable.app/patents/US-9842813","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842813","json":"https://patentable.app/api/llm-context/US-9842813","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:49:57.622Z"}