{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842820","patent":{"patent_number":"US-9842820","title":"Wafer-level fan-out wirebond packages","assignee":null,"inventors":[],"filing_date":"2015-12-04T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"An integrated circuit package that includes an integrated circuit die, a redistribution substrate, a wirebond interconnect and a package substrate is disclosed. The redistribution substrate is formed on the integrated circuit die and may be wider than the integrated circuit die. The package substrate is formed below the integrated circuit die. The wirebond interconnect may have one of its ends attached to the redistribution substrate and another end attached to the package substrate. In addition to that, another integrated circuit die may be formed between the redistribution substrate and the package substrate. The integrated circuit dies may communicate with each other through the redistribution substrate. In addition to that, a method to manufacture the integrated circuit package may also be disclosed."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer-level fan-out wirebond packages","description":"An integrated circuit package that includes an integrated circuit die, a redistribution substrate, a wirebond interconnect and a package substrate is disclosed. The redistribution substrate is formed ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842820","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842820","citation_suggestion":"Patentable. \"Wafer-level fan-out wirebond packages\" (US-9842820). https://patentable.app/patents/US-9842820","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842820","json":"https://patentable.app/api/llm-context/US-9842820","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T20:45:53.073Z"}