{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842822","patent":{"patent_number":"US-9842822","title":"Semiconductor packages with socket plug interconnection structures","assignee":null,"inventors":[],"filing_date":"2015-08-20T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may be disposed on the second substrate. The plug bumps may be configured for insertion into the insertion grooves of the socket bumps and may electrically connect to the socket bumps. Related memory cards and electronic systems may also be provided."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages with socket plug interconnection structures","description":"A semiconductor package may include a first substrate and a second substrate. Socket bumps may be disposed on the first substrate to provide insertion grooves within the socket bumps. Plug bumps may b","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842822","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842822","citation_suggestion":"Patentable. \"Semiconductor packages with socket plug interconnection structures\" (US-9842822). https://patentable.app/patents/US-9842822","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842822","json":"https://patentable.app/api/llm-context/US-9842822","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:38:27.912Z"}