{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842827","patent":{"patent_number":"US-9842827","title":"Wafer level system in package (SiP) using a reconstituted wafer and method of making","assignee":null,"inventors":[],"filing_date":"2016-05-02T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package such as a system in package (SiP) includes a first die disposed in a first mold layer and coupled to a first dielectric layer disposed above the first mold and a second die disposed in a second mold layer and coupled to a second dielectric layer disposed above the second die. A pillar is disposed through the second mold layer and is coupled to a first metal layer disposed above the first dielectric layer. The first metal layer is coupled to the first die, and the pillar is coupled to a second metal layer disposed above the second dielectric layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Wafer level system in package (SiP) using a reconstituted wafer and method of making","description":"A package such as a system in package (SiP) includes a first die disposed in a first mold layer and coupled to a first dielectric layer disposed above the first mold and a second die disposed in a sec","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842827","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842827","citation_suggestion":"Patentable. \"Wafer level system in package (SiP) using a reconstituted wafer and method of making\" (US-9842827). https://patentable.app/patents/US-9842827","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842827","json":"https://patentable.app/api/llm-context/US-9842827","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:15:56.788Z"}