{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842828","patent":{"patent_number":"US-9842828","title":"Stacked semiconductor package with compliant corners on folded substrate","assignee":null,"inventors":[],"filing_date":"2016-06-13T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"One or more embodiments are directed to stacked packages, such as Package-on-Package (PoP) packages, that are stacked on a flexible folded substrate. The stacked packages have compliant corners. In particular, the stacked packages include an adhesive material at the corners between layers of the folded substrate. The adhesive material has a low modulus of elasticity, such as, for example, a modulus of elasticity of silicone adhesive. The low modulus of elasticity of the adhesive material produces compliant corners of the stacked package. The adhesive material fills openings between the folded substrate that are formed around a bottom semiconductor package of the stack package. In that regard, the bottom semiconductor package may have pulled back or recessed corners and the adhesive material fills the openings formed by the recessed corners. The recessed corners may be any size or shape."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Stacked semiconductor package with compliant corners on folded substrate","description":"One or more embodiments are directed to stacked packages, such as Package-on-Package (PoP) packages, that are stacked on a flexible folded substrate. The stacked packages have compliant corners. In pa","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842828","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842828","citation_suggestion":"Patentable. \"Stacked semiconductor package with compliant corners on folded substrate\" (US-9842828). https://patentable.app/patents/US-9842828","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842828","json":"https://patentable.app/api/llm-context/US-9842828","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:38:23.198Z"}