{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842829","patent":{"patent_number":"US-9842829","title":"Chip package structure and method for forming the same","assignee":null,"inventors":[],"filing_date":"2016-09-20T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip package stacked over the substrate. The chip package structure includes first conductive bumps arranged between and in direct contact with the chip package and the substrate providing a clearance. The chip package structure includes a chip structure having a first face and an opposing second face arranged in the clearance between the chip package and the substrate and adjacent to the first conductive bumps. The chip structure contains at least one chip. The chip package structure includes a solder cap connecting the first face of the chip structure and the chip package. The chip package structure includes a second conductive bump connecting the second face of the chip structure and the substrate."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Chip package structure and method for forming the same","description":"A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip package stacked over the substrate. The chip package structure include","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842829","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842829","citation_suggestion":"Patentable. \"Chip package structure and method for forming the same\" (US-9842829). https://patentable.app/patents/US-9842829","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842829","json":"https://patentable.app/api/llm-context/US-9842829","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:21:04.004Z"}