{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9842830","patent":{"patent_number":"US-9842830","title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","assignee":null,"inventors":[],"filing_date":"2017-06-19T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","G11C","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A package can include first and second semiconductor devices stacked in a first direction. The first semiconductor device can include a first circuit formed on the first semiconductor device that provides a first potential greater than a ground potential at a first circuit output, and a second circuit coupled to receive the first circuit output. The second semiconductor device can include a first through via providing a first electrical connection between a first side and a second side of the second semiconductor device, and a third circuit. The first circuit output can be electrically connected to the first through via at the first side of the first semiconductor device and the third circuit can be electrically connected to the first through via at the second side of the first semiconductor device to receive the first potential."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture","description":"A package can include first and second semiconductor devices stacked in a first direction. The first semiconductor device can include a first circuit formed on the first semiconductor device that prov","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9842830","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9842830","citation_suggestion":"Patentable. \"Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture\" (US-9842830). https://patentable.app/patents/US-9842830","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9842830","json":"https://patentable.app/api/llm-context/US-9842830","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T17:45:38.588Z"}