{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9844138","patent":{"patent_number":"US-9844138","title":"Multilayer wiring board","assignee":null,"inventors":[],"filing_date":"2015-11-05T00:00:00.000Z","publication_date":"2017-12-12T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H04M","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A plating film is formed on the mounting electrodes with the reduced area. The mounting electrodes for connection to specific components are defined by first end surfaces of first via conductors, and hence, the areas of the mounting electrodes are significantly reduced, and the pitch between the mounting electrodes is significantly decreased. Also, the mounting electrodes defined by the first end surfaces of the first via conductors are connected to plane electrodes at end surfaces of second via conductors exposed from a surface of the multilayer body with internal wiring electrodes interposed therebetween. Thus, a plating film is able to be reliably provided on the mounting electrodes."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Multilayer wiring board","description":"A method reduces an area of a mounting electrode provided on a first surface of a multilayer body and connected to a specific component is reduced and decreases a pitch between mounting electrodes. A ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9844138","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9844138","citation_suggestion":"Patentable. \"Multilayer wiring board\" (US-9844138). https://patentable.app/patents/US-9844138","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9844138","json":"https://patentable.app/api/llm-context/US-9844138","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:21:09.540Z"}