{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9844837","patent":{"patent_number":"US-9844837","title":"Lead-free solder alloy","assignee":null,"inventors":[],"filing_date":"2012-03-23T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":5,"abstract":"By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Lead-free solder alloy","description":"By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible ","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9844837","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9844837","citation_suggestion":"Patentable. \"Lead-free solder alloy\" (US-9844837). https://patentable.app/patents/US-9844837","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9844837","json":"https://patentable.app/api/llm-context/US-9844837","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:12:44.027Z"}