{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9847245","patent":{"patent_number":"US-9847245","title":"Filling processes","assignee":null,"inventors":[],"filing_date":"2016-11-03T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method of filling cavities in a semiconductor structure during fabrication. A layer of a first material, e.g., a polysilazane, is deposited on the semiconductor, and subjected to a first thermal process to change its chemical composition, e.g., to change it to silicon dioxide. It is then etched back, and the cycle of deposition, and thermal processing is repeated. The etch-back may also be repeated in one or more of the cycles after the first cycle, and a second thermal process, that may increase the density of one or more of the deposited layers, may be performed in one or more of the cycles."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Filling processes","description":"A method of filling cavities in a semiconductor structure during fabrication. A layer of a first material, e.g., a polysilazane, is deposited on the semiconductor, and subjected to a first thermal pro","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9847245","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9847245","citation_suggestion":"Patentable. \"Filling processes\" (US-9847245). https://patentable.app/patents/US-9847245","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9847245","json":"https://patentable.app/api/llm-context/US-9847245","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:32:39.631Z"}