{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9847254","patent":{"patent_number":"US-9847254","title":"Fingerprint sensor chip package structure and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2015-10-12T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","G06V","G06V","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":10,"abstract":"A fingerprint sensor chip package structure including a circuit carrier and a fingerprint sensor chip is provided. The fingerprint sensor chip is disposed on the circuit carrier. The fingerprint sensor chip includes a chip body and a plurality of sensing structures. The chip body has an active surface, a fingerprint sensing back surface, a plurality of bond pads disposed on the active surface and a plurality of through holes. The chip body is electrically connected to the circuit carrier with the active surface facing the circuit carrier. The sensing structures are disposed in the through holes respectively. Each of the sensing structures includes a first dielectric layer, a first metal layer, a second dielectric layer and a second metal layer. The first dielectric layer is exposed on the fingerprint sensing back surface. The second metal layer extends to the active surface to be electrically connected to the corresponding bond pad."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fingerprint sensor chip package structure and manufacturing method thereof","description":"A fingerprint sensor chip package structure including a circuit carrier and a fingerprint sensor chip is provided. The fingerprint sensor chip is disposed on the circuit carrier. The fingerprint senso","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9847254","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9847254","citation_suggestion":"Patentable. \"Fingerprint sensor chip package structure and manufacturing method thereof\" (US-9847254). https://patentable.app/patents/US-9847254","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9847254","json":"https://patentable.app/api/llm-context/US-9847254","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:37:49.447Z"}