{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9847268","patent":{"patent_number":"US-9847268","title":"Semiconductor package and manufacturing method thereof","assignee":null,"inventors":[],"filing_date":"2009-11-20T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":29,"abstract":"A semiconductor package and a manufacturing method thereof are disclosed. The semiconductor package includes a device carrier and a stiffener structure. The device carrier includes at least one insulating layer and at least conductive layer defining at least one trace layout unit. The stiffener structure is disposed on the device carrier, surrounding the periphery of the at least one trace layout unit. The stiffener structure is disposed away from the periphery of the at least one trace layout unit, forming a cavity with the device carrier. The shape and disposition of the stiffener structure enhance the strength of the semiconductor package, impeding flexure to the semiconductor package."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor package and manufacturing method thereof","description":"A semiconductor package and a manufacturing method thereof are disclosed. The semiconductor package includes a device carrier and a stiffener structure. The device carrier includes at least one insula","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9847268","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9847268","citation_suggestion":"Patentable. \"Semiconductor package and manufacturing method thereof\" (US-9847268). https://patentable.app/patents/US-9847268","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9847268","json":"https://patentable.app/api/llm-context/US-9847268","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:37:05.013Z"}