{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9847269","patent":{"patent_number":"US-9847269","title":"Fan-out packages and methods of forming same","assignee":null,"inventors":[],"filing_date":"2015-07-31T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"An embodiment a device package includes a semiconductor die, a molding compound extending along sidewalls of the semiconductor die, and a planarizing polymer layer over the molding compound and extending along the sidewalls of the semiconductor die. The molding compound includes first fillers, and the planarizing polymer layer includes second fillers smaller than the first fillers. The device package further includes one or more fan-out redistribution layers (RDLs) electrically connected to the semiconductor die, wherein the one or more fan-out RDLs extend past edges of the semiconductor die onto a top surface of the planarizing polymer layer."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Fan-out packages and methods of forming same","description":"An embodiment a device package includes a semiconductor die, a molding compound extending along sidewalls of the semiconductor die, and a planarizing polymer layer over the molding compound and extend","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9847269","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9847269","citation_suggestion":"Patentable. \"Fan-out packages and methods of forming same\" (US-9847269). https://patentable.app/patents/US-9847269","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9847269","json":"https://patentable.app/api/llm-context/US-9847269","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:23:14.754Z"}