{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9847285","patent":{"patent_number":"US-9847285","title":"Semiconductor packages including heat spreaders and methods of manufacturing the same","assignee":null,"inventors":[],"filing_date":"2017-02-17T00:00:00.000Z","publication_date":"2017-12-19T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":14,"abstract":"There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device."},"analysis":{"summary":null,"layman_explanation":null,"technical_analysis":null,"business_analysis":null,"faqs":null,"topics":[],"tech_cluster":null},"seo":{"title":"Semiconductor packages including heat spreaders and methods of manufacturing the same","description":"There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an","keywords":[]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9847285","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9847285","citation_suggestion":"Patentable. \"Semiconductor packages including heat spreaders and methods of manufacturing the same\" (US-9847285). https://patentable.app/patents/US-9847285","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9847285","json":"https://patentable.app/api/llm-context/US-9847285","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:39:20.209Z"}