{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852919","patent":{"patent_number":"US-9852919","title":"Methods and systems for point of use removal of sacrificial material","assignee":null,"inventors":[],"filing_date":"2015-04-01T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","G01N","H01L"],"num_claims":7,"abstract":"A method of manufacturing a sensor, the method including forming an array of chemically-sensitive field effect transistors (chemFETs), depositing a dielectric layer over the chemFETs in the array, depositing a protective layer over the dielectric layer, etching the dielectric layer and the protective layer to form cavities corresponding to sensing surfaces of the chemFETs, and removing the protective layer. The method further includes, etching the dielectric layer and the protective layer together to form cavities corresponding to sensing surfaces of the chemFETs. The protective layer is at least one of a polymer, photoresist material, noble metal, copper oxide, and zinc oxide. The protective protective layer is removed using at least one of sodium hydroxide, organic solvent, aqua regia, ammonium carbonate, hydrochloric acid, acetic acid, and phosphoric acid."},"analysis":{"summary":"The patent, **Methods and Systems for Point of Use Removal of Sacrificial Material** (US-9852919), introduces a highly innovative and precise manufacturing method for advanced sensors, specifically chemically-sensitive field effect transistors (chemFETs). At its core, this innovation addresses the critical challenge of exposing the delicate sensing surfaces of these devices without causing damage, contamination, or incomplete removal of protective layers.\n\nThe problem this patent solves stems from conventional sensor fabrication, where temporary sacrificial layers are used to shield components during various processing steps. The subsequent removal of these layers often leads to defects, reduced sensitivity, and lower manufacturing yields due to aggressive stripping, residual material, or physical damage to the underlying active components. For chemFETs, where surface integrity is paramount for accurate chemical detection, these issues significantly hinder performance and reliability.\n\nThe key technical approach described involves a multi-step process: first, an array of chemFETs is formed. Then, a dielectric layer is deposited, followed by a sacrificial protective layer. Crucially, both the dielectric and protective layers are etched *together* to create precisely defined cavities that correspond to the chemFETs' sensing surfaces. The final, defining step is the selective removal of *only* the protective layer at the 'point of use'. This is achieved by carefully selecting the protective material (e.g., polymer, photoresist, noble metal, copper oxide, zinc oxide) and employing highly specific chemical agents (e.g., sodium hydroxide, organic solvents, various acids) that dissolve only the sacrificial layer, leaving the sensing surfaces pristine and fully exposed.\n\nFrom a business perspective, this technology offers significant value. It promises dramatically improved manufacturing yields by reducing defects and rework, leading to lower production costs and faster time-to-market for new sensor products. The enhanced precision and reliability of the sensors manufactured using this method translate into superior performance for end-user applications in medical diagnostics, environmental monitoring, industrial process control, and biotechnology. This creates a substantial market opportunity for manufacturers and innovators seeking to produce high-quality, cost-effective, and robust next-generation sensors. The patent positions its adopters with a strong competitive advantage in the rapidly expanding sensor market.","layman_explanation":"For business professionals, understanding the underlying technology of a patent like **Methods and Systems for Point of Use Removal of Sacrificial Material** isn't about the intricate chemical formulas, but rather its strategic implications and market impact. This patent describes a sophisticated manufacturing technique for highly sensitive sensors, particularly those used in chemical and biological detection.\n\n**1. What Problem Does This Solve?**\nImagine you're building tiny, high-tech detectors for things like medical tests or environmental pollution. These detectors, often called chemFETs (chemically-sensitive field effect transistors), rely on incredibly delicate surfaces to 'sniff out' specific substances. During their manufacturing, these sensitive surfaces need to be protected from harsh chemicals or physical damage. So, temporary 'sacrificial' layers are applied, acting like a protective shield. The big problem arises when it's time to remove these shields. Traditional methods are often imprecise: they might leave bits of the shield behind, or worse, accidentally damage the delicate sensing surface itself. This leads to many faulty sensors, lower production, and higher costs. For a business, this means wasted materials, delayed product launches, and ultimately, less reliable products in the market.\n\n**2. How Does It Work?**\nThis patent introduces a smarter, more precise way to remove those protective shields. Think of it like a specialized, surgical process for micro-components. Instead of a crude removal, the method involves several intelligent steps: First, the basic sensor components are created. Then, two layers are applied on top: an essential insulating layer (dielectric) and the temporary protective layer. The clever part is that both these layers are then etched *together* to create perfectly shaped openings right where the sensor's active surface needs to be exposed. Finally, a highly specific chemical 'solvent' is used—like a magic cleaner that *only* dissolves the protective layer, leaving the crucial insulating layer and the sensing surface absolutely pristine and untouched. The choice of protective material (e.g., a specific type of plastic or metal) and its corresponding 'magic cleaner' is carefully selected to ensure this precision. This 'point of use' removal means the protective layer is taken off exactly when and where it's no longer needed, minimizing any risk to the functional parts.\n\n**3. Why Does This Matter?**\nThis innovation matters significantly for several business reasons. Firstly, it directly translates to **higher manufacturing yields**. If fewer sensors are damaged or faulty during production, more usable products can be made from the same amount of raw materials and effort. This dramatically **reduces production costs** and **improves profitability**. Secondly, the sensors produced using this method are inherently **more reliable and sensitive**. This allows companies to create higher-quality products, gaining a competitive edge in markets where precision is critical, such as advanced medical diagnostics (e.g., rapid disease detection), high-accuracy environmental monitoring, or specialized industrial sensing. Companies adopting this technology can command premium pricing, build stronger brand reputation, and secure a leadership position in these high-value segments. It's about enabling better products, faster, and more affordably.\n\n**4. What's Next?**\nThe future applications for this technology are vast. Improved sensor manufacturing means we can develop even smaller, more integrated, and more powerful sensing devices. This could accelerate the development of next-generation wearables, implantable medical devices, smart city infrastructure, and advanced robotics, all relying on highly dependable chemical and biological sensors. For investors, this patent represents a foundational technology that can de-risk manufacturing for a wide array of future products, offering significant potential ROI for companies that license or implement it. Market adoption is likely to accelerate as industries demand higher performance and cost efficiency from their sensor supply chains.","technical_analysis":"The patent **Methods and Systems for Point of Use Removal of Sacrificial Material** (US-9852919) details a sophisticated microfabrication methodology aimed at improving the manufacturing precision and reliability of chemically-sensitive field effect transistors (chemFETs). This technical analysis focuses on the architectural elements, implementation considerations, and performance implications of this innovative process.\n\n**Technical Architecture and Process Flow:**\nThe core of this invention is a meticulously designed sequence of deposition, etching, and selective removal steps. The overarching architecture is designed to create an array of chemFETs with exquisitely exposed and pristine sensing surfaces. The process flow can be broken down into the following stages:\n\n1.  **ChemFET Array Formation:** The foundational step involves fabricating an array of individual chemFET devices on a suitable semiconductor substrate. This typically includes defining source, drain, and channel regions using standard lithography, deposition, and etching techniques common in CMOS or MEMS fabrication. The base chemFET structures are prepared, awaiting the definition of their specific sensing interfaces.\n2.  **Dielectric Layer Deposition:** Following the chemFET array formation, a dielectric layer is uniformly deposited over the entire array. This layer serves as the primary gate dielectric for the chemFETs, providing electrical insulation and forming the interface where chemical interactions occur. Materials such as silicon dioxide (SiO2), silicon nitride (Si3N4), or other high-k dielectrics are typical choices, selected based on their electrical properties, chemical stability, and compatibility with subsequent processing.\n3.  **Protective Layer Deposition:** A sacrificial protective layer is then deposited over the dielectric layer. This layer is critical for shielding portions of the dielectric during subsequent etching steps. The patent highlights the versatility of this layer, specifying materials such as polymers (e.g., polyimide, SU-8), photoresist materials (e.g., novolac-based photoresists), noble metals (e.g., gold, platinum), copper oxide, and zinc oxide. The choice of material is strategic, emphasizing its ability to be selectively removed later without harming the underlying dielectric or chemFETs.\n4.  **Co-Etching of Dielectric and Protective Layers:** This step represents a significant technical innovation. Both the dielectric layer and the overlying protective layer are etched *together* to form precise cavities. These cavities are patterned to directly correspond to the active sensing surfaces of the chemFETs. This simultaneous etching ensures excellent alignment and verticality of the cavity sidewalls, minimizing lateral etching (undercut) and providing a well-defined aperture for the sensing area. Reactive Ion Etching (RIE) or Deep RIE (DRIE) are suitable techniques for this step, offering anisotropic etching capabilities for achieving high aspect ratio features.\n5.  **Point-of-Use Selective Protective Layer Removal:** The final and most critical step is the targeted, selective removal of *only* the protective layer from within the formed cavities. The 'point-of-use' aspect emphasizes the precision and localized nature of this stripping. The patent outlines a comprehensive list of chemical agents for this removal, chosen for their high selectivity to the protective layer over the dielectric and chemFETs. Examples include sodium hydroxide (effective for certain polymers and metal oxides), various organic solvents (ideal for photoresists or specific polymer types), aqua regia (for noble metals like gold or platinum), ammonium carbonate, hydrochloric acid, acetic acid, and phosphoric acid. The careful matching of the protective material to its specific removal agent ensures that the sacrificial layer is completely stripped away, leaving the chemFET sensing surfaces exposed in a pristine, undamaged, and uncontaminated state.\n\n**Implementation Details and Performance Characteristics:**\nImplementing this technology requires rigorous control over several parameters:\n\n*   **Material Selection**: The compatibility between the dielectric, protective layer, and the chosen removal agent is paramount. Optimized adhesion, stress, and chemical resistance properties must be considered for each layer.\n*   **Etch Parameters**: Precise control of etch rates, selectivity (ratio of etch rate of protective layer to dielectric), anisotropy, and uniformity during the co-etching step is crucial. This involves fine-tuning power, pressure, gas flow, and temperature in RIE systems.\n*   **Stripping Chemistry**: The concentration, temperature, and immersion time of the chemical removal agents must be precisely controlled to ensure complete removal of the protective layer without attacking the exposed dielectric or the underlying chemFET active regions.\n*   **Cleanliness**: Post-removal cleaning steps are essential to eliminate any residual chemical species or particulates, maintaining the high quality of the exposed sensing surface.\n\nFrom a performance standpoint, this method directly impacts several key sensor characteristics. By ensuring an uncompromised and perfectly exposed sensing interface, the resulting chemFETs exhibit:\n\n*   **Higher Sensitivity**: Maximized interaction area with target analytes.\n*   **Improved Selectivity**: Reduced interference from contaminants or unwanted surface chemistries.\n*   **Enhanced Reliability and Longevity**: Minimized degradation of the dielectric and active regions due to harsh processing.\n*   **Increased Manufacturing Yield**: Fewer defective devices due to process-induced damage or incomplete exposure.\n\nThis technology sets a new benchmark for precision in chemFET fabrication, offering a robust solution to a long-standing challenge in advanced sensor manufacturing. Its adaptability to various materials and chemistries provides a flexible platform for developing next-generation high-performance chemical and biological sensors.","business_analysis":"The patent **Methods and Systems for Point of Use Removal of Sacrificial Material** (US-9852919) presents a significant business opportunity by addressing a critical bottleneck in the manufacturing of high-performance sensors, particularly chemically-sensitive field effect transistors (chemFETs). This innovation promises to unlock substantial value across various industries, offering a clear path to enhanced profitability and market leadership.\n\n**Market Opportunity Size:**\nThe global chemical and biological sensor market is vast and rapidly expanding, driven by demand in healthcare (diagnostics, personalized medicine), environmental monitoring, industrial process control, food safety, and defense. This market is projected to reach tens of billions of dollars within the next decade. ChemFETs, known for their high sensitivity and potential for miniaturization, are a key component in this growth. Any technology that can improve their manufacturing efficiency, reliability, and performance directly taps into this massive market, offering substantial revenue potential for adopters of this patent.\n\n**Competitive Advantages:**\nThis patented method provides several distinct competitive advantages:\n\n1.  **Superior Product Quality:** By ensuring pristine and perfectly exposed sensing surfaces, manufacturers can produce chemFETs with higher sensitivity, better signal-to-noise ratios, and improved long-term stability compared to devices made with conventional, less precise methods. This leads to premium products that command higher prices and customer loyalty.\n2.  **Increased Manufacturing Yields:** The reduction in defects, damage, and contamination during the critical sacrificial layer removal step directly translates to significantly higher yields per wafer. This dramatically lowers the per-unit cost of production, improving gross margins and overall profitability.\n3.  **Reduced Rework and Waste:** Fewer defective units mean less material waste and reduced need for costly rework, further enhancing operational efficiency and sustainability.\n4.  **Faster Time-to-Market:** A more streamlined and reliable manufacturing process shortens production cycles, allowing companies to bring new sensor products to market more quickly and capitalize on emerging opportunities.\n5.  **Technological Differentiation:** Adopting this advanced fabrication technique provides a strong technical differentiator in a competitive landscape, positioning companies as innovators and leaders in high-precision sensor technology.\n\n**Revenue Potential and Business Models:**\nThe revenue potential for this technology is multi-faceted. Companies could:\n\n*   **License the Technology:** For semiconductor foundries or sensor manufacturers, licensing the patent could be a significant revenue stream, providing access to a superior manufacturing process.\n*   **Manufacture and Sell Premium Sensors:** Companies can use this method to produce their own high-performance chemFETs and integrated sensor systems, selling them to OEMs in medical, environmental, or industrial sectors.\n*   **Offer Fabrication Services:** Specialized foundries could provide contract manufacturing services utilizing this patented process, attracting clients seeking high-yield, high-quality sensor fabrication.\n*   **Develop New Applications:** The improved sensor performance enabled by this method could open doors to entirely new applications and markets that were previously unattainable due to limitations in sensor reliability or precision.\n\n**Strategic Positioning:**\nCompanies that integrate the **Methods and Systems for Point of Use Removal of Sacrificial Material** into their operations will be strategically positioned at the forefront of advanced sensor manufacturing. This patent allows them to:\n\n*   **Capture High-Value Segments:** Target markets requiring ultra-high precision and reliability, such as point-of-care medical diagnostics, advanced environmental monitoring, and specialized industrial sensing.\n*   **Build Strong IP Portfolios:** Bolster their intellectual property with a foundational patent that enhances their product offerings and protects their market share.\n*   **Drive Innovation:** Use the improved manufacturing capability as a platform for developing even more complex and integrated sensor systems, maintaining a leadership position.\n\n**ROI Projections:**\nThe return on investment for adopting this patent's methodology is compelling. Initial investments in process development and integration would be offset by substantial gains in manufacturing efficiency, reduced material waste, and the ability to produce higher-value products. For a company manufacturing millions of sensors annually, even a modest increase in yield (e.g., 5-10%) combined with reduced defect rates could translate into millions of dollars in annual savings and increased revenue. The long-term strategic benefits, including market leadership and the enablement of next-generation products, further amplify the ROI. This patent is not just about a technical improvement; it's about creating a sustainable competitive advantage in a critical and growing technology sector.","faqs":[{"answer":"The patent **Methods and Systems for Point of Use Removal of Sacrificial Material** (US-9852919) describes an innovative manufacturing process designed to create high-performance sensors, specifically chemically-sensitive field effect transistors (chemFETs). It addresses a critical challenge in microfabrication: the precise and clean exposure of delicate sensing surfaces.\n\nEssentially, this invention provides a superior method for removing temporary, protective layers (known as sacrificial material) that are applied during sensor fabrication. The key is to achieve this removal without damaging the underlying functional components or leaving behind any residues that could compromise sensor performance.\n\nThis patented approach ensures that the active sensing areas of devices like chemFETs are pristine and fully exposed, leading to enhanced sensitivity, accuracy, and reliability in the final product. It represents a significant step forward in precision manufacturing for advanced sensing technologies. Keywords: sensor manufacturing, chemFETs, sacrificial layer, precision fabrication, US-9852919.","question":"What is Methods and Systems for Point of Use Removal of Sacrificial Material?"},{"answer":"The **Methods and Systems for Point of Use Removal of Sacrificial Material** patent outlines a multi-step process for manufacturing sensors. It begins with the formation of an array of chemically-sensitive field effect transistors (chemFETs) on a substrate.\n\nFollowing this, a dielectric layer is deposited over the chemFETs, acting as an insulator and part of the sensing interface. On top of this, a sacrificial protective layer is applied. This protective layer can be made from various materials, such as polymers, photoresists, noble metals, copper oxide, or zinc oxide.\n\nThe core innovation lies in the subsequent steps: first, both the dielectric layer and the protective layer are etched *together* to form precise cavities that perfectly align with the sensing surfaces of the chemFETs. Then, a highly selective chemical agent is used to remove *only* the sacrificial protective layer. This 'point of use' removal ensures that the delicate sensing surfaces are exposed cleanly and without damage, using specific chemicals like sodium hydroxide, organic solvents, aqua regia, or various acids tailored to the protective material. Keywords: chemFET fabrication process, selective removal, co-etching, dielectric layer, protective layer.","question":"How does Methods and Systems for Point of Use Removal of Sacrificial Material work?"},{"answer":"The **Methods and Systems for Point of Use Removal of Sacrificial Material** patent solves a long-standing challenge in precision sensor manufacturing: effectively removing temporary protective layers without compromising the integrity or functionality of the delicate sensing surfaces. In traditional fabrication methods, the removal of these sacrificial layers often leads to several critical issues.\n\nThese issues include incomplete stripping, where residual material blocks the sensing surface; surface damage, caused by aggressive removal techniques or misalignment; and contamination, where chemical residues from the stripping process degrade the sensor's performance. For devices like chemFETs, which rely on pristine surface conditions for accurate detection, these problems result in lower manufacturing yields, reduced sensor sensitivity, poor reliability, and increased production costs.\n\nThis patented innovation provides a solution that ensures complete, clean, and damage-free exposure of sensing surfaces, directly addressing these bottlenecks and enabling the production of higher-quality, more reliable sensors. Keywords: sensor manufacturing challenges, defect reduction, chemFET reliability, fabrication bottlenecks, contamination control.","question":"What problem does Methods and Systems for Point of Use Removal of Sacrificial Material solve?"},{"answer":"The patent **Methods and Systems for Point of Use Removal of Sacrificial Material** (US-9852919) was filed on April 1, 2015, and published on December 26, 2017. The patent document lists the inventors, but this specific data was not provided in the initial prompt. Therefore, the specific individuals or the assignee (company) responsible for this groundbreaking innovation are not available in this context.\n\nHowever, the invention itself signifies a collaborative effort typical of advanced microfabrication research and development, likely involving experts in materials science, electrical engineering, and chemical processing. The impact of such inventions often extends beyond individual inventors, shaping entire industries. Keywords: patent inventors, US-9852919 filing date, patent publication date, microfabrication research, sensor innovation.","question":"Who invented Methods and Systems for Point of Use Removal of Sacrificial Material?"},{"answer":"The **Methods and Systems for Point of Use Removal of Sacrificial Material** patent offers several significant benefits for sensor manufacturing and the broader technology landscape. Firstly, it leads to **superior sensor performance**. By ensuring pristine and perfectly exposed sensing surfaces, devices like chemFETs exhibit higher sensitivity, greater accuracy, and improved signal-to-noise ratios, which are crucial for demanding applications.\n\nSecondly, the method dramatically **increases manufacturing yields** and **reduces production costs**. By minimizing defects, damage, and contamination during the critical sacrificial layer removal step, more functional devices can be produced per wafer, leading to less waste and more efficient production. This translates directly to enhanced profitability for manufacturers.\n\nFinally, this innovation provides **greater material versatility** and **design flexibility**. The ability to choose from a range of protective layers (polymers, noble metals, metal oxides) and corresponding selective removal agents allows manufacturers to optimize the process for various sensor types and applications, fostering further innovation in sensor design. Keywords: sensor performance, manufacturing yields, cost reduction, material versatility, design flexibility.","question":"What are the key benefits of Methods and Systems for Point of Use Removal of Sacrificial Material?"},{"answer":"The **Methods and Systems for Point of Use Removal of Sacrificial Material** patent distinguishes itself from prior art by introducing a more integrated and highly selective approach to sacrificial layer removal in sensor manufacturing. Traditional methods often involved sequential etching of different layers, which could lead to alignment errors, undercut, and increased process complexity.\n\nFurthermore, prior art often struggled with non-selective stripping, where removal agents could inadvertently damage the underlying dielectric or active sensor components, or leave behind residues that compromised performance. This patent's key differentiators are its **co-etching strategy**—where both the dielectric and protective layers are etched together for precise cavity formation—and its **highly selective, point-of-use removal** of the sacrificial layer using tailored chemical agents.\n\nThis unique combination ensures unparalleled precision, minimal damage, and pristine sensing surfaces, surpassing the capabilities and reliability of conventional fabrication techniques. It represents a significant advancement in overcoming the limitations of previous sensor manufacturing processes. Keywords: prior art comparison, selective etching, co-etching innovation, sensor fabrication differences, manufacturing precision.","question":"How is Methods and Systems for Point of Use Removal of Sacrificial Material different from prior art?"},{"answer":"The **Methods and Systems for Point of Use Removal of Sacrificial Material** patent has the potential to significantly impact a wide array of industries that rely on high-performance chemical and biological sensors. One of the most prominent sectors is **healthcare and medical diagnostics**, where it can enable the production of more accurate and reliable point-of-care testing devices, implantable sensors, and advanced tools for disease detection and personalized medicine.\n\n**Environmental monitoring** will also see a substantial impact, as the improved precision allows for the development of more sensitive sensors to detect pollutants, assess air and water quality, and monitor ecological systems with greater accuracy. In **industrial process control**, more robust and reliable sensors manufactured using this method can enhance safety, optimize manufacturing efficiency, and improve quality control.\n\nAdditionally, industries such as **food safety**, **defense and security**, and **automotive** (for advanced gas sensors) will benefit from the enhanced performance, reliability, and cost-effectiveness that this patented manufacturing process offers. It is a foundational technology that underpins innovation across many high-tech sectors. Keywords: medical diagnostics, environmental monitoring, industrial control, food safety, sensor applications, industry impact.","question":"What industries will Methods and Systems for Point of Use Removal of Sacrificial Material impact?"},{"answer":"The patent for **Methods and Systems for Point of Use Removal of Sacrificial Material**, identified as US-9852919, has a clear timeline regarding its official filing and publication. The initial application for this patent was filed on **April 1, 2015**.\n\nFollowing the examination and approval process by the United States Patent and Trademark Office (USPTO), the patent was subsequently granted and published on **December 26, 2017**. These dates mark the official entry of this innovative manufacturing method into the public domain and its legal protection as intellectual property. Understanding these dates is crucial for assessing the patent's novelty, prior art, and commercial lifespan within the sensor technology sector. Keywords: patent filing date, publication date, US-9852919 timeline, intellectual property, patent status.","question":"When was Methods and Systems for Point of Use Removal of Sacrificial Material filed/granted?"},{"answer":"The commercial applications of the **Methods and Systems for Point of Use Removal of Sacrificial Material** patent are extensive, driven by its ability to produce superior and more cost-effective sensors. In the **medical sector**, this includes advanced point-of-care diagnostic devices for rapid disease detection, continuous glucose monitoring, and personalized drug delivery systems, where sensor accuracy and reliability are paramount.\n\nFor **environmental applications**, it facilitates the creation of highly sensitive portable detectors for air and water pollutants, industrial emissions, and hazardous chemicals, supporting public health and regulatory compliance. In **industrial settings**, these sensors can be integrated into process control systems for real-time monitoring of chemical reactions, quality assurance in manufacturing, and leak detection, leading to increased efficiency and safety.\n\nFurthermore, the enhanced manufacturing yields and reduced costs associated with this method make high-performance sensors more economically viable for mass production, opening up opportunities in **consumer electronics** (e.g., smart home air quality monitors) and **agricultural technology** (e.g., soil nutrient analysis). The patent enables a new generation of high-performance, compact, and reliable sensing solutions across multiple high-growth markets. Keywords: commercial sensor applications, medical devices, environmental sensors, industrial automation, market opportunities, high-performance sensors.","question":"What are the commercial applications of Methods and Systems for Point of Use Removal of Sacrificial Material?"},{"answer":"Looking ahead, the **Methods and Systems for Point of Use Removal of Sacrificial Material** patent is expected to drive several significant future developments in sensor technology. Firstly, its emphasis on precision will enable the creation of **even smaller and more complex sensor arrays**. This means integrating multiple types of chemFETs onto a single chip, allowing for simultaneous detection of various analytes, which is crucial for advanced diagnostics and environmental monitoring.\n\nSecondly, the improved reliability and cost-effectiveness will accelerate the **democratization of advanced sensing technologies**. As production becomes more efficient, high-performance sensors will become more accessible and affordable, leading to their broader adoption in everyday devices, smart infrastructure, and remote sensing networks.\n\nFinally, this foundational manufacturing technique will likely foster innovation in **novel sensor materials and architectures**. With a robust method for exposing pristine sensing surfaces, researchers and developers will have greater freedom to experiment with new chemically-sensitive materials and complex 3D sensor designs, pushing the boundaries of what chemFETs can achieve. Keywords: future sensor technology, chemFET development, advanced microfabrication, sensor miniaturization, innovation outlook, next-generation sensors.","question":"What are the future developments expected for Methods and Systems for Point of Use Removal of Sacrificial Material?"}],"topics":["Methods and Systems for Point of Use Removal of Sacrificial Material","chemFET manufacturing","sensor fabrication","sacrificial layer removal","precision etching","intricate","domain","microfabrication"],"tech_cluster":null},"seo":{"title":"Methods and Systems for Point of Use Removal of Sacrificial Material - Patent US-9852919","description":"Discover the Methods and Systems for Point of Use Removal of Sacrificial Material patent. This innovation revolutionizes sensor manufacturing with precise removal of sacrificial layers for high-performance chemFETs.","keywords":["Methods and Systems for Point of Use Removal of Sacrificial Material","chemFET manufacturing","sensor fabrication","sacrificial layer removal","precision etching","microfabrication","semiconductor patent","US-9852919","chemical sensors","advanced manufacturing","point-of-use processing"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852919","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852919","citation_suggestion":"Patentable. \"Methods and systems for point of use removal of sacrificial material\" (US-9852919). https://patentable.app/patents/US-9852919","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852919","json":"https://patentable.app/api/llm-context/US-9852919","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:59:26.552Z"}