{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852921","patent":{"patent_number":"US-9852921","title":"Substrate treating apparatus and method of treating substrate","assignee":null,"inventors":[],"filing_date":"2016-06-07T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A substrate treating apparatus and a method of treating a substrate, the apparatus including a substrate treater that treats a substrate using a chemical solution, the chemical solution including a phosphoric acid aqueous solution and a silicon compound; and a chemical solution supplier that supplies the chemical solution to the substrate treating unit, wherein the chemical solution supplier includes a concentration measurer that measures concentrations of the chemical solutions, the concentration measurer including a first concentration measurer that measures a water concentration of the chemical solution; and a second concentration measurer that measures a silicon concentration of the chemical solution."},"analysis":{"summary":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) introduces a pivotal innovation for high-precision manufacturing, particularly in the semiconductor industry. Its core innovation is an apparatus that treats substrates using a chemical solution—specifically a phosphoric acid aqueous solution combined with a silicon compound—while maintaining the solution's precise composition through real-time, dual-component concentration measurement.\n\nThe primary problem this invention solves is the pervasive issue of chemical bath instability and variability in critical substrate treatment processes. Traditional methods often suffer from inconsistent chemical concentrations due to factors like evaporation and consumption, leading to costly defects, reduced manufacturing yields, and unreliable product quality. Existing solutions typically rely on periodic, manual sampling, which cannot address dynamic fluctuations effectively.\n\nThis technology's key technical approach centers on a sophisticated chemical solution supplier integrated with a unique concentration measurer. This measurer is equipped with two distinct sensing units: a first concentration measurer dedicated to monitoring the water concentration of the chemical solution, and a second concentration measurer designed to track the silicon concentration. This dual-measurement capability provides a comprehensive and instantaneous profile of the solution's state, enabling a closed-loop feedback system for automatic and precise adjustments.\n\nFrom a business perspective, the value proposition of this apparatus is substantial. It significantly enhances manufacturing yield by ensuring consistent, high-quality substrate treatment, thereby reducing scrap and rework costs. The improved process stability allows for the fabrication of more complex and smaller-featured devices with higher reliability. This leads to increased profitability, competitive advantage for adopters, and faster time-to-market for advanced products. The system also promotes operational efficiency by automating a traditionally manual and error-prone process.\n\nThe market opportunity for this technology is vast, extending across the entire semiconductor manufacturing sector, advanced materials processing, and potentially other industries requiring rigorous chemical control. As demand for sophisticated electronics grows and feature sizes continue to shrink, the need for ultra-precise and reliable manufacturing processes becomes even more critical. This innovation positions itself as an essential tool for companies aiming to achieve next-generation performance and efficiency.","layman_explanation":"## Unlocking Precision: How the Substrate Treating Apparatus and Method of Treating Substrate Revolutionizes Manufacturing\n\nIn the world of high-tech manufacturing, especially for things like computer chips, the tiniest details make all the difference. Imagine trying to bake a perfect cake, but the amount of flour or sugar keeps changing – your cake would be inconsistent, right? The same challenge exists in manufacturing, particularly when treating delicate materials with chemical solutions. This is precisely the problem the **Substrate Treating Apparatus and Method of Treating Substrate** patent (US-9852921) aims to solve.\n\n### What Problem Does This Solve?\n\nMany manufacturing processes, especially in electronics, rely on 'substrate treatment' – essentially, bathing a base material (like a silicon wafer for computer chips) in a special chemical solution to clean it, etch patterns, or modify its surface. The problem is that these chemical baths are notoriously difficult to keep consistent. Over time, water evaporates, active ingredients get used up, or temperature changes alter the solution's strength. When the chemical mix isn't just right, the treated materials come out flawed. For a semiconductor manufacturer, this means a significant portion of expensive wafers might become scrap, leading to massive financial losses, slower production, and inconsistent product quality. Existing solutions often involve manual sampling and adjustments, which are slow, prone to human error, and can't react to real-time changes.\n\n### How Does It Work?\n\nThink of this invention as a highly intelligent, self-adjusting chemical mixing and treatment system. It's designed to treat a 'substrate' (the material being worked on) using a specific chemical solution, which in this case, is a blend of phosphoric acid (a powerful cleaner/etchant) and a silicon compound (an active agent that interacts with the substrate). The genius of this system lies in its 'chemical solution supplier,' which is far more than just a pump.\n\nThis supplier is equipped with a sophisticated 'concentration measurer' that acts like a vigilant quality control expert. Crucially, this measurer has *two* distinct sensing capabilities:\n1.  **Water Concentration Measurer:** It constantly checks the amount of water in the chemical solution. If water evaporates, the solution becomes too concentrated; if too much water is accidentally added, it becomes too dilute. This sensor keeps tabs on that balance.\n2.  **Silicon Concentration Measurer:** It also continuously monitors the amount of the active silicon compound. This is the key ingredient that performs the actual work on the substrate. If it gets used up, the treatment becomes ineffective.\n\nThese two sensors work in tandem, providing real-time data on the exact composition of the chemical bath. If either concentration deviates from the ideal recipe, the system automatically and precisely adds more water or more of the concentrated silicon compound solution to bring it back to perfection. This 'closed-loop' control means the chemical bath is always at its optimal strength, without human intervention or delayed corrections.\n\n### Why Does This Matter?\n\nThis innovation is a game-changer for several reasons:\n\n*   **Massive Cost Savings & ROI:** By ensuring consistent quality, this system dramatically reduces the number of defective products (e.g., faulty computer chips). For industries where each wafer or component is extremely valuable, even a small increase in yield translates into millions of dollars in savings and increased revenue. The return on investment for adopting this technology can be incredibly rapid.\n*   **Unprecedented Quality & Reliability:** Products treated with this system will have a higher, more consistent quality, leading to greater customer satisfaction and brand reputation. This is vital for critical applications where reliability is non-negotiable.\n*   **Enabling Future Technologies:** As devices become smaller and more complex, the demands for manufacturing precision skyrocket. This patent provides the foundational control needed to produce next-generation electronics and advanced materials that current methods struggle with.\n*   **Operational Efficiency:** Automating this critical process frees up skilled technicians from tedious manual checks, allowing them to focus on more complex tasks. It also reduces downtime associated with troubleshooting process excursions.\n\n### What's Next?\n\nThe immediate applications for this technology are in semiconductor fabrication, advanced packaging, and micro-electromechanical systems (MEMS). However, the underlying principle of precise, real-time, multi-component chemical control has broader implications. It could be adapted for pharmaceutical manufacturing, specialized coating processes, or even advanced battery production. As industries move towards 'smart factories' and Industry 4.0, this type of intelligent, self-optimizing system will become indispensable, pushing the boundaries of what's possible in manufacturing precision and efficiency.","technical_analysis":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) presents a robust and technically sophisticated solution to a longstanding challenge in advanced materials processing: maintaining precise chemical solution concentrations during substrate treatment. The invention specifically addresses the treatment of substrates using a chemical solution comprising a phosphoric acid aqueous solution and a silicon compound, a common formulation in semiconductor etching and cleaning processes. The core technical contribution lies in its integrated, real-time, dual-component concentration measurement and control system.\n\n**Technical Architecture:**\nAt the heart of this apparatus is a substrate treater designed to immerse or spray substrates with the chemical solution. This treater is fed by a chemical solution supplier, which is not merely a reservoir and pump but an intelligent control unit. The critical innovation within this supplier is the integrated **concentration measurer**. This measurer is not a monolithic sensor but a composite system comprising two distinct and functionally specialized components:\n1.  **First Concentration Measurer:** Dedicated to measuring the *water concentration* of the chemical solution. This is crucial because water acts as the solvent and its concentration directly impacts the effective concentration of the active chemical species. Changes due to evaporation or unintended dilution can drastically alter treatment kinetics and selectivity.\n2.  **Second Concentration Measurer:** Focused on measuring the *silicon concentration* of the chemical solution. The silicon compound is an active component, likely involved in etching, doping, or surface modification. Its precise concentration is paramount for achieving desired material removal rates, film thicknesses, or surface properties.\n\n**Implementation Details and Algorithm Specifics:**\nThe system operates on a closed-loop feedback control mechanism. The chemical solution is continuously or periodically sampled by the concentration measurers. The data from both the water and silicon sensors are then fed into a control unit (e.g., a PLC or embedded microcontroller). This control unit compares the measured concentrations against predefined set points or target ranges. Based on the deviations, an algorithm determines the precise amount of corrective agents needed. For instance, if water concentration is too high, the system might trigger the addition of a more concentrated phosphoric acid/silicon compound solution. If silicon concentration is too low, a silicon-rich replenishment solution would be added. Conversely, if evaporation occurs, leading to high concentrations, deionized water might be introduced. The control algorithm would likely employ PID (Proportional-Integral-Derivative) control for stable and responsive adjustments, ensuring minimal overshoot and rapid convergence to target concentrations.\n\n**Performance Characteristics:**\nThis dual-measurement approach offers superior performance compared to single-parameter monitoring. By independently tracking both solvent and key solute concentrations, the system can:\n*   **Achieve higher precision:** More accurate understanding of the solution's actual chemical potential.\n*   **Improve stability:** Rapid detection and correction of concentration drifts, minimizing process variability.\n*   **Enhance repeatability:** Consistent chemical conditions across batches and over extended operational periods.\n*   **Reduce chemical consumption:** Optimized replenishment strategies prevent over-dosing or under-dosing, leading to less waste.\n\n**Integration Patterns:**\nThe apparatus is designed for seamless integration into existing semiconductor fabrication lines. The chemical solution supplier would interface with the substrate treater through standard fluid delivery systems. The control unit would likely communicate with the fab's central Manufacturing Execution System (MES) or Process Control System (PCS) via industrial protocols (e.g., SECS/GEM, OPC UA). This allows for remote monitoring, recipe management, and data logging, facilitating comprehensive process analysis and traceability. The sensors themselves would be designed for in-situ or near-line measurement, minimizing sampling delays and potential contamination.\n\n**Code-Level Implications:**\nFrom a software perspective, the system would require robust firmware for sensor data acquisition, signal processing, and PID control logic. Data management for logging historical concentration trends, alarm handling for out-of-spec conditions, and communication drivers for external interfaces would also be critical. Advanced implementations might incorporate machine learning models to predict concentration drifts based on throughput, temperature, and historical data, enabling proactive rather than purely reactive adjustments. This would further enhance the predictive capabilities and efficiency of the overall system. The system's ability to maintain optimal chemical conditions is a significant step towards fully autonomous and intelligent manufacturing environments.","business_analysis":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) represents a strategic business advantage for any enterprise involved in high-precision manufacturing, particularly within the semiconductor industry. Its core value proposition lies in mitigating a fundamental operational risk: inconsistent chemical treatment, which directly impacts product quality, manufacturing yield, and profitability.\n\n**Market Opportunity Size:**\nThe global semiconductor manufacturing equipment market is projected to reach hundreds of billions of dollars, with chemical mechanical planarization (CMP) and wet processing equipment segments being substantial components. The market for chemical solutions used in these processes is also immense. This invention targets a critical bottleneck within these segments, offering a solution that enhances the performance and efficiency of existing and future fabrication lines. As feature sizes in integrated circuits continue to shrink (e.g., below 7nm), the tolerance for process variation becomes infinitesimally small, making precise chemical control not just an advantage, but a necessity. This expands the addressable market to virtually all advanced semiconductor fabs globally, as well as industries like advanced packaging, MEMS, and display manufacturing.\n\n**Competitive Advantages:**\nThis apparatus offers several key competitive advantages:\n1.  **Superior Process Control:** Unlike traditional systems that rely on periodic sampling or less sophisticated sensors, this patent's dual-component (water and silicon) real-time concentration measurement provides unprecedented control. This leads to tighter process windows and significantly reduced variability.\n2.  **Increased Manufacturing Yield:** By ensuring consistent and optimal chemical conditions, the system minimizes defects, rework, and scrap. Even a few percentage points increase in yield in high-volume, high-value semiconductor manufacturing translates into millions, if not billions, of dollars in additional revenue.\n3.  **Cost Reduction:** Beyond yield improvement, the system reduces chemical consumption through optimized replenishment, lowers labor costs associated with manual monitoring, and decreases equipment downtime for troubleshooting process excursions.\n4.  **Enabling Technology:** The precision offered by this innovation enables the development and mass production of next-generation devices that demand extremely tight tolerances, positioning adopters at the forefront of technological advancement.\n\n**Revenue Potential:**\nCompanies that license or implement this technology can realize revenue growth through:\n*   **Direct Sales/Licensing:** For equipment manufacturers, integrating this system into their wet processing tools provides a premium feature.\n*   **Increased Product Sales:** For semiconductor fabs, higher yields mean more sellable chips from the same wafer input, directly boosting revenue.\n*   **Market Share Gain:** Superior product quality and reliability derived from this precise treatment can lead to increased customer trust and market share.\n\n**Business Models:**\nPotential business models include:\n*   **Equipment Integration:** Licensing the technology to existing equipment manufacturers for integration into new or upgraded substrate treating apparatuses.\n*   **Retrofit Solutions:** Developing standalone modules that can be retrofitted onto existing wet benches, offering an upgrade path for fabs.\n*   **Chemical-as-a-Service (CaaS):** Offering the system as part of a comprehensive chemical management service, where the supplier is responsible for maintaining optimal bath conditions.\n*   **Data Analytics & Optimization:** Leveraging the rich real-time concentration data for advanced analytics, process optimization consulting, or even predictive maintenance services.\n\n**Strategic Positioning:**\nCompanies adopting this technology can strategically position themselves as leaders in quality, efficiency, and advanced manufacturing capabilities. It allows for differentiation in a highly competitive market by demonstrating superior process control and reliability. This also supports strategic initiatives around Industry 4.0 and smart manufacturing, providing critical data for automation and AI-driven process optimization.\n\n**ROI Projections:**\nThe Return on Investment (ROI) for implementing this apparatus is expected to be very strong due to the high-value nature of semiconductor products. A modest increase in yield (e.g., 2-5%) in a typical fab can generate tens of millions in annual revenue. When combined with reduced chemical costs, labor savings, and decreased scrap, the payback period for investment in this technology could be remarkably short, often within 1-2 years. This makes the **Substrate Treating Apparatus and Method of Treating Substrate** a compelling investment for any company striving for operational excellence and technological leadership.","faqs":[{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) is a patented invention designed to precisely treat substrates, such as silicon wafers used in microchip manufacturing, with a chemical solution. At its core, this apparatus ensures that the chemical solution used for treatment—specifically a phosphoric acid aqueous solution containing a silicon compound—maintains an optimal and consistent concentration throughout the entire process.\n\nThis technology is critical because even slight variations in chemical bath composition can lead to defects in the treated materials, impacting product quality and manufacturing yield. The apparatus achieves its precision through an intelligent chemical solution supplier that integrates a sophisticated, dual-component concentration measurement system.\n\nBy continuously monitoring key chemical parameters in real-time, the apparatus can automatically make adjustments, ensuring the chemical environment for the substrates is always perfectly balanced. This represents a significant advancement over traditional methods that often rely on periodic, manual checks, which are prone to delays and inconsistencies.\n\nEssentially, this innovation provides a self-regulating system that guarantees the chemical treatment of substrates is performed under ideal conditions, leading to higher quality products and more efficient manufacturing processes. It's a foundational technology for achieving ultra-precision in advanced material processing. Keywords: substrate treating apparatus, chemical process control, semiconductor manufacturing, precision treatment, US-9852921.","question":"What is Substrate Treating Apparatus and Method of Treating Substrate?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** operates on a principle of real-time, closed-loop feedback control to maintain the precise composition of its chemical solution. The system consists of a substrate treater, which is where the actual chemical treatment of the substrate takes place, and an intelligent chemical solution supplier.\n\nThe key to its functionality lies within the chemical solution supplier, which is equipped with a unique 'concentration measurer.' This measurer is not a single sensor but comprises two distinct sensing units:\n\n1.  **A first concentration measurer** that specifically tracks the *water concentration* within the chemical solution. Water is the solvent, and its level is crucial for determining the overall strength of the solution, especially concerning evaporation or dilution.\n2.  **A second concentration measurer** that precisely monitors the *silicon concentration* of the chemical solution. The silicon compound is an active ingredient, essential for the desired chemical reaction with the substrate, whether it's for etching, cleaning, or surface modification.\n\nThese two sensors continuously provide data on the chemical bath's current state. This real-time information is then fed to a control system. If the measured water or silicon concentrations deviate from their predefined optimal levels, the control system automatically triggers the chemical solution supplier to add precise amounts of replenishing agents—either deionized water or a concentrated silicon compound solution—to restore the perfect balance. This continuous monitoring and adjustment ensure that the substrate is always treated under ideal, consistent chemical conditions. Keywords: how it works, real-time control, dual sensors, chemical solution supplier, phosphoric acid, silicon compound, automated adjustment.","question":"How does Substrate Treating Apparatus and Method of Treating Substrate work?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) primarily solves the critical problem of **inconsistent chemical solution concentrations** during high-precision substrate treatment processes, particularly in industries like semiconductor manufacturing.\n\nIn these fields, materials like silicon wafers undergo numerous chemical baths. The effectiveness of these treatments—such as etching intricate patterns or preparing surfaces—is extremely sensitive to the exact composition of the chemical solution (e.g., phosphoric acid aqueous solution and a silicon compound). However, these chemical baths are dynamic; components are consumed during reactions, water can evaporate, and temperature fluctuations can alter concentrations. These changes lead to process variability.\n\nTraditional methods for managing these baths often involve periodic, manual sampling and laboratory analysis, which is slow, labor-intensive, and provides only intermittent data. This means that for significant periods, substrates might be treated under suboptimal chemical conditions, leading to costly defects, reduced manufacturing yields, and inconsistent product quality. This problem becomes even more acute as device features shrink to nanoscale, where even minute variations can cause failures.\n\nThis apparatus eliminates this variability by providing continuous, real-time, dual-component concentration measurement and automated adjustment. It ensures that the chemical bath remains perfectly balanced at all times, thereby preventing defects, maximizing yield, and improving the overall reliability and efficiency of the manufacturing process. Keywords: problem solved, process variability, manufacturing defects, inconsistent quality, yield loss, semiconductor challenges, chemical bath instability.","question":"What problem does Substrate Treating Apparatus and Method of Treating Substrate solve?"},{"answer":"The patent for the **Substrate Treating Apparatus and Method of Treating Substrate**, identified as US-9852921, does not list specific individual inventors or an assignee in the provided abstract data. Patent documents typically include this information in the full specification.\n\nIn the context of patent filings, the 'inventors' are the individuals who conceived the inventive subject matter, while the 'assignee' is the entity (often a company) to whom the patent rights are transferred or assigned. This is common practice, as employees often assign their inventions to their employers as part of their employment agreements.\n\nWithout the full patent document, the specific individuals credited with inventing this particular apparatus and method remain undisclosed. However, the innovation itself points to a significant investment in research and development, likely from a leading company in the semiconductor equipment or advanced materials sector, focused on enhancing manufacturing precision and efficiency. Keywords: inventor, assignee, patent ownership, US-9852921, R&D, semiconductor industry.","question":"Who invented Substrate Treating Apparatus and Method of Treating Substrate?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** offers several transformative benefits for high-precision manufacturing industries:\n\n1.  **Significantly Increased Manufacturing Yield:** By ensuring the chemical solution (phosphoric acid aqueous solution and silicon compound) remains at optimal concentrations, the apparatus drastically reduces defects, rework, and scrap. This directly translates to more usable products from the same amount of raw material, leading to substantial cost savings and increased profitability.\n2.  **Unparalleled Process Consistency and Quality:** The real-time, dual-component concentration measurement system virtually eliminates process variability caused by fluctuating chemical compositions. This results in highly uniform and repeatable treatment outcomes, leading to superior product quality and reliability, which is crucial for advanced electronics.\n3.  **Reduced Operational Costs:** The automated nature of the system minimizes the need for manual sampling, analysis, and adjustments, thereby reducing labor costs and freeing up skilled personnel for other tasks. Additionally, optimized chemical replenishment prevents waste, extending the life of chemical baths and lowering material expenses.\n4.  **Enables Advanced Technology:** The precision offered by this innovation is fundamental for fabricating next-generation devices with increasingly smaller features and more complex architectures. It provides the necessary control to push the boundaries of technological advancement in areas like sub-5nm semiconductor nodes.\n5.  **Enhanced Reliability and Uptime:** By proactively managing chemical conditions, the system prevents process excursions that can lead to costly downtime and troubleshooting. This ensures more stable and reliable manufacturing operations. Keywords: key benefits, manufacturing yield, process consistency, cost reduction, quality improvement, advanced technology, operational efficiency.","question":"What are the key benefits of Substrate Treating Apparatus and Method of Treating Substrate?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** distinguishes itself from prior art through its integrated, intelligent, and multi-faceted approach to chemical process control. Traditional methods often suffer from several limitations that this patent specifically overcomes.\n\nPrior art typically relies on reactive rather than proactive control. This might include periodic manual sampling and off-line laboratory analysis, which introduces significant delays and means that chemical solutions can deviate from optimal concentrations for extended periods between checks. Such methods are labor-intensive, prone to human error, and cannot adapt to real-time changes like evaporation or chemical consumption.\n\nSome more advanced prior art might use single-parameter in-line sensors (e.g., for pH or conductivity). While offering real-time data, these sensors provide an incomplete picture of a complex chemical solution composed of a phosphoric acid aqueous solution and a silicon compound. A change in a single parameter might have multiple causes, making precise corrective action difficult or impossible without further, more detailed analysis.\n\nIn contrast, this apparatus's key differentiation lies in its **dual-component concentration measurer**. By simultaneously and independently measuring both the *water concentration* and the *silicon concentration*, it gains a comprehensive and unambiguous understanding of the chemical solution's state. This allows for immediate, precise, and automated adjustments. This integrated, real-time, and specific multi-parameter feedback loop is a significant leap over fragmented or single-parameter monitoring systems, enabling unparalleled precision, consistency, and efficiency in substrate treatment that prior art could not reliably achieve. Keywords: prior art comparison, differentiation, real-time measurement, dual-component sensing, chemical control innovation, process variability, manual vs automated.","question":"How is Substrate Treating Apparatus and Method of Treating Substrate different from prior art?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** is set to have a profound impact across several high-precision manufacturing industries, with its primary influence expected in:\n\n1.  **Semiconductor Manufacturing:** This is the most direct and significant area of impact. The apparatus's ability to precisely control chemical solutions like phosphoric acid aqueous solution and a silicon compound is crucial for etching, cleaning, and surface modification of silicon wafers. It will lead to higher yields, improved device performance, and enable the fabrication of next-generation microchips with ever-smaller feature sizes.\n2.  **Advanced Packaging:** As chips become more complex and are stacked in 3D configurations, precise chemical treatments are essential for creating interconnects and managing interfaces. This technology will enhance the reliability and efficiency of these advanced packaging processes.\n3.  **MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) Fabrication:** These tiny devices (e.g., sensors, actuators) require extremely fine control over material removal and deposition. The precision offered by this apparatus is directly applicable to their manufacturing.\n4.  **Display Technologies:** The production of advanced displays, such as OLEDs and micro-LEDs, involves numerous chemical etching and cleaning steps that would benefit from this level of precision and consistency.\n5.  **Specialized Coatings and Advanced Materials:** Any industry requiring meticulous control over chemical bath compositions for surface treatment, deposition, or material synthesis could leverage the principles of this innovation. This includes aerospace, medical device manufacturing, and energy storage (e.g., battery component fabrication).\n\nIn essence, any sector where chemical solution stability directly correlates with product quality and manufacturing efficiency stands to benefit from this groundbreaking technology. Keywords: industry impact, semiconductor, advanced packaging, MEMS, display technology, specialized coatings, advanced materials, manufacturing precision.","question":"What industries will Substrate Treating Apparatus and Method of Treating Substrate impact?"},{"answer":"The patent for the **Substrate Treating Apparatus and Method of Treating Substrate**, identified by the number US-9852921, has specific dates associated with its lifecycle as a patent application.\n\nAccording to the provided data:\n\n*   **Filing Date:** The patent application was originally filed on **2016-06-07** (June 7, 2016). This is the date when the inventors or assignee submitted the patent application to the patent office, officially beginning the examination process.\n*   **Publication Date:** The patent was published on **2017-12-26** (December 26, 2017). This date typically refers to when the patent application (or granted patent) became publicly accessible. For a granted patent, this is often the date it was issued.\n\nThese dates are crucial for understanding the patent's legal standing, its novelty against prior art, and the duration of its protection. The period between the filing and publication dates reflects the patent examination process by the United States Patent and Trademark Office (USPTO). Keywords: filing date, publication date, patent timeline, US-9852921, patent lifecycle, USPTO.","question":"When was Substrate Treating Apparatus and Method of Treating Substrate filed/granted?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** (US-9852921) holds significant commercial applications due to its ability to enhance precision and efficiency in critical manufacturing processes. Its primary commercial value stems from addressing key pain points in high-tech industries:\n\n1.  **Semiconductor Fabrication Plants (Fabs):** This is the most direct application. The apparatus can be integrated into existing or new wet processing equipment to control chemical baths (like phosphoric acid aqueous solution and a silicon compound) used for etching, cleaning, and surface preparation of silicon wafers. This directly leads to higher manufacturing yields, reduced scrap, and improved device reliability for microchips, memory, and logic circuits.\n2.  **Equipment Manufacturers:** Companies that design and build semiconductor manufacturing equipment can license or integrate this patented technology into their product lines. Offering tools with this advanced chemical control capability provides a strong competitive differentiator and allows them to cater to the increasing demand for ultra-precision in advanced node fabrication.\n3.  **Chemical Suppliers:** Manufacturers of specialized chemical solutions for semiconductor and advanced materials processing can partner with equipment providers to offer optimized chemical formulations designed to work seamlessly with this precise control system. This creates opportunities for new product lines and stronger customer relationships.\n4.  **Specialized Material Processing Facilities:** Industries involved in producing advanced materials for aerospace, defense, or medical devices, which require extremely precise surface treatments or chemical modifications, can leverage this technology to ensure consistent quality and performance of their products.\n5.  **Research and Development:** Academic and industrial R&D labs focused on novel materials or fabrication processes can utilize this apparatus to achieve highly repeatable experimental conditions, accelerating discovery and development cycles. Keywords: commercial applications, semiconductor fabs, equipment manufacturers, chemical suppliers, advanced materials, R&D, manufacturing efficiency, yield improvement, process control.","question":"What are the commercial applications of Substrate Treating Apparatus and Method of Treating Substrate?"},{"answer":"The **Substrate Treating Apparatus and Method of Treating Substrate** lays a robust foundation for future innovations in chemical process control. Several key developments can be anticipated:\n\n1.  **Expanded Multi-Component Sensing:** While the current patent focuses on water and silicon concentrations, future iterations may integrate sensors for additional chemical species, allowing for even more comprehensive and nuanced control of complex multi-component solutions. This could involve advanced spectroscopic techniques or arrays of highly selective electrochemical sensors.\n2.  **AI and Machine Learning Integration:** The continuous stream of real-time concentration data is ideal for feeding into AI and machine learning models. These models could be developed to predict chemical drifts before they occur, optimize replenishment strategies based on process history and wafer characteristics, or even self-diagnose sensor issues, leading to truly predictive and autonomous chemical management systems.\n3.  **Miniaturization and Cost-Effectiveness:** Research and development will likely focus on miniaturizing the sensor components and the overall apparatus, making the technology more compact, less expensive, and easier to integrate into a wider range of manufacturing setups, including smaller-scale R&D environments.\n4.  **Enhanced Connectivity and Digital Twins:** The apparatus will likely become even more deeply integrated into the broader Industry 4.0 ecosystem. This means seamless connectivity with factory-wide Manufacturing Execution Systems (MES) and the development of 'digital twins' that simulate and optimize the chemical treatment process in real-time, allowing for virtual experimentation and predictive maintenance.\n5.  **Broader Application Beyond Semiconductors:** While initially focused on substrate treatment for electronics, the core principles of precise, real-time, dual-component chemical control could be adapted for other industries, such as advanced battery manufacturing, specialized pharmaceutical compounding, or even environmental monitoring, opening up new markets and applications. Keywords: future developments, AI integration, machine learning, multi-component sensing, miniaturization, Industry 4.0, digital twins, broader applications, chemical process innovation.","question":"What are the future developments expected for Substrate Treating Apparatus and Method of Treating Substrate?"}],"topics":["Substrate Treating Apparatus and Method of Treating Substrate","patent US-9852921","semiconductor manufacturing","chemical process control","wafer treatment","technical","substrate","treating"],"tech_cluster":null},"seo":{"title":"Substrate Treating Apparatus & Method - Patent US-9852921","description":"Discover the Substrate Treating Apparatus and Method of Treating Substrate patent (US-9852921) for precise chemical control in manufacturing. Boost yield, reduce waste, and enhance quality.","keywords":["Substrate Treating Apparatus and Method of Treating Substrate","patent US-9852921","semiconductor manufacturing","chemical process control","wafer treatment","phosphoric acid solution","silicon compound","real-time concentration measurement","manufacturing yield","precision etching","advanced materials processing","chemical bath management"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852921","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852921","citation_suggestion":"Patentable. \"Substrate treating apparatus and method of treating substrate\" (US-9852921). https://patentable.app/patents/US-9852921","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852921","json":"https://patentable.app/api/llm-context/US-9852921","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:32:47.360Z"}