{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852929","patent":{"patent_number":"US-9852929","title":"Lead frame and manufacturing method of lead frame","assignee":null,"inventors":[],"filing_date":"2015-10-16T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"A lead frame includes a lead frame body processed in a predetermined shape, and including a notched part provided at an end of the lead frame body, the notched part being used as a starting point of tape-removing, a resin leakproof tape stuck on a back surface of the lead frame body, and a region of a periphery of the notched part in the back surface of the lead frame body, the region being reduced in a strength of bonding between the resin leakproof tape and the lead frame body is reduced relative to other region."},"analysis":{"summary":"The Lead Frame and Manufacturing Method of Lead Frame patent (US-9852929) introduces a significant advancement in semiconductor component manufacturing, specifically addressing the persistent challenge of removing protective resin leakproof tapes from lead frames. This innovation aims to prevent damage to the delicate lead frame body and eliminate adhesive residue, issues common with traditional tape removal methods.\n\nThe core of this invention lies in a two-fold approach. Firstly, the lead frame is designed with a strategically placed 'notched part' at one end. This notch serves as a predefined, easy-to-access starting point for the tape-removing operation, streamlining what was often a precarious manual or automated process. By providing a clear initiation point, the risk of haphazard or forceful peeling is substantially reduced.\n\nSecondly, and critically, the patent describes a region around this notched part on the back surface of the lead frame body where the bonding strength between the resin leakproof tape and the lead frame is intentionally reduced. This localized weakening of adhesion ensures that when the tape is peeled, it detaches cleanly and smoothly from this starting point, without exerting undue stress on the fragile lead frame structures or leaving behind unwanted adhesive traces.\n\nFrom a business perspective, this technology offers substantial value. It promises increased manufacturing efficiency through faster and more reliable tape removal, leading to higher production yields and reduced material waste. The elimination of damage and residue translates into lower rework costs and improved product quality. For industries reliant on semiconductors, this innovation contributes to more reliable and durable electronic devices, reinforcing the foundational quality of components across various applications. The market opportunity lies in providing a more robust and cost-effective method for a critical step in semiconductor packaging.","layman_explanation":"In the world of high-tech manufacturing, especially for the tiny components that power our electronics, every detail matters. One such critical component is a 'lead frame,' which acts as the skeleton and electrical connector for the actual computer chip. During the manufacturing process, these lead frames need protective tape to shield them from various treatments. The challenge, however, has always been removing that tape cleanly without damaging the delicate frame or leaving sticky residue behind.\n\n**1. What Problem Does This Solve?**\nImagine you're building a complex model. You use masking tape to protect certain areas, but when you peel it off, it tears, leaves glue, or even pulls off a piece of your model. This is precisely the problem the semiconductor industry faces with lead frames. Traditional methods for removing protective resin leakproof tapes often result in bent leads, scratched surfaces, or adhesive remnants. These defects can lead to faulty chips, costly reworks, and significant delays in production. The business problem is clear: how to maintain protection during processing while ensuring a pristine, damage-free removal, which directly impacts manufacturing yield, product quality, and overall profitability.\n\n**2. How Does It Work?**\nThis patent, the Lead Frame and Manufacturing Method of Lead Frame, introduces a clever, two-pronged solution to this persistent issue. Think of it like a smart design for an 'easy-peel' label, but for microchip components.\n\nFirst, the lead frame itself is designed with a small, specific 'notched part' at one end. This notch isn't just for looks; it's a deliberate starting point, a designated 'handle' if you will, for the tape removal process. This eliminates guesswork and the need for technicians to find an edge, making the initial peel consistent and less prone to errors.\n\nSecond, and this is the truly innovative part, the adhesive on the protective tape is intentionally made *less sticky* in the small area immediately surrounding this notch. So, while the rest of the tape holds firmly to protect the lead frame, the 'release zone' at the notch allows for a gentle, clean separation. This is like having a sticker that's super strong everywhere except for a tiny corner designed to lift off effortlessly. This controlled weakening of the bond ensures that when the tape is pulled, it detaches smoothly from the starting point without tearing, leaving residue, or stressing the delicate lead frame structure.\n\n**3. Why Does This Matter?**\nThis innovation offers significant advantages for businesses operating in the semiconductor and electronics sectors. Firstly, it leads to **higher manufacturing yields**. Fewer damaged lead frames mean less waste and more usable components from each production run, directly impacting the bottom line. Secondly, it ensures **superior product quality**. By eliminating residue and physical damage, the integrity of the final semiconductor package is enhanced, leading to more reliable and durable electronic devices for consumers. This can translate into stronger brand reputation and fewer warranty claims. Thirdly, it **streamlines production**. A more consistent and efficient tape removal process reduces labor costs, speeds up assembly lines, and helps bring products to market faster. For investors, this patent represents an opportunity to back a technology that delivers tangible operational improvements and competitive advantages in a high-growth industry.\n\n**4. What's Next?**\nThe principles behind the Lead Frame and Manufacturing Method of Lead Frame patent could become a standard feature in high-precision manufacturing. Future applications might involve integrating this concept with even more advanced materials or automated systems, further enhancing efficiency and reliability. As electronic devices become smaller and more complex, the need for such foundational process improvements will only grow, making this technology a valuable asset for any company aiming for excellence in microelectronics assembly.","technical_analysis":"The Lead Frame and Manufacturing Method of Lead Frame patent (US-9852929) presents a refined approach to a fundamental process in semiconductor packaging: the removal of temporary protective layers. Lead frames, crucial for mechanical support and electrical interconnection of semiconductor dies, often require the application of resin leakproof tapes during various wet processes (e.g., etching, plating) to protect specific areas. The technical challenge lies in subsequently removing these tapes cleanly and without inducing mechanical stress or leaving adhesive residue, both of which can compromise device reliability and manufacturing yield.\n\nThis invention's technical architecture is elegantly simple yet highly effective. It focuses on modifying both the lead frame design and the adhesive properties of the tape at a critical juncture. The primary technical components are:\n\n1.  **Notched Part Integration**: The patent specifies a 'notched part' provided at an end of the lead frame body. This is not merely an arbitrary cut; it functions as a precisely engineered stress concentration point and a predefined initiation site for tape delamination. In traditional methods, the starting point for tape removal is often ambiguous, leading to uneven peeling, tearing, or excessive force application. By providing a clear, accessible notch, the invention standardizes the tape removal process, making it amenable to high-precision automation. This geometric feature ensures consistent engagement by peeling tools, minimizing variability in the initial peel force vector.\n\n2.  **Localized Reduced Bonding Strength**: This is the most significant technical breakthrough. The patent describes a region of the periphery of the notched part where the bonding strength between the resin leakproof tape and the lead frame body is intentionally reduced relative to other regions. This differential adhesion can be achieved through various material science and surface engineering techniques:\n    *   **Surface Treatment**: Prior to tape application, the specific region around the notch on the lead frame surface could be selectively treated. This might involve plasma treatment to alter surface energy, application of a thin release layer (e.g., silicone-based, fluoropolymer-based), or UV-curing of a pre-applied layer to form a low-adhesion zone.\n    *   **Differential Adhesive Tape**: Alternatively, the resin leakproof tape itself could be designed with varying adhesive properties. The section of the tape corresponding to the notched area could incorporate a weaker adhesive formulation or a different adhesive chemistry that exhibits lower bond strength to the lead frame material.\n    *   **Controlled Curing/Activation**: If the tape's adhesive is activated or cured in-situ, the curing process could be spatially controlled to result in a weaker bond strength in the critical region.\n\n**Implementation Details and Performance Characteristics:**\nImplementing this technology involves integrating the notched part into existing lead frame stamping or etching processes. The selective reduction in bonding strength requires precise control over surface preparation or tape material application. For automated assembly lines, this means calibration of robotic peeling mechanisms to initiate at the notch, leveraging the engineered weak bond for a smooth, consistent peel. Performance gains are observed in:\n\n*   **Reduced Mechanical Stress**: The lower initial peel force prevents deformation, bending, or micro-cracking of delicate lead frame structures, especially critical for increasingly fine-pitch designs.\n*   **Elimination of Residue**: The clean delamination from the weakened bond region minimizes or eliminates adhesive residue, which is vital for subsequent processes like wire bonding, die attach, and molding, where surface contamination can lead to defects.\n*   **Improved Process Control**: The predefined initiation point and controlled bond strength lead to a highly repeatable and predictable tape removal process, reducing variability and increasing overall manufacturing yield.\n*   **Enhanced Throughput**: Faster and more reliable tape removal contributes to increased production line efficiency and throughput.\n\n**Code-level Implications (for automation/control systems):**\nWhile not directly involving software code, the principles of this patent would inform the programming of automated handling and peeling systems. Robotics would be programmed to identify the notched part (via vision systems), apply a controlled, lower peeling force at this specific point, and then execute a smooth, continuous peel. Quality control algorithms would be enhanced to detect the absence of residue and damage, leveraging the improved consistency provided by this invention. This system enables more robust error handling and less need for manual intervention.\n\nIn essence, the Lead Frame and Manufacturing Method of Lead Frame patent is a foundational technical improvement that enhances the integrity and manufacturability of lead frames, directly contributing to the reliability and cost-effectiveness of advanced semiconductor devices.","business_analysis":"The Lead Frame and Manufacturing Method of Lead Frame patent (US-9852929) addresses a critical pain point in the semiconductor manufacturing value chain, offering substantial business implications across market opportunity, competitive advantage, and revenue potential. As the demand for smaller, more powerful, and more reliable electronic devices continues to surge, the foundational components like lead frames must evolve in parallel. This innovation provides a timely solution to a long-standing manufacturing challenge.\n\n**Market Opportunity Size:**\nThe global lead frame market is a multi-billion dollar industry, projected to grow significantly in the coming years driven by demand from consumer electronics, automotive, industrial, and telecommunications sectors. Within this vast market, every manufacturer of semiconductor packages utilizes lead frames. The problem of tape removal damage and residue is pervasive across all segments. By offering a solution that improves yield, reduces waste, and enhances reliability, this patent taps into a universal need within this market. The addressable market includes all lead frame manufacturers and semiconductor assembly and test (OSAT) companies globally, representing a multi-billion dollar opportunity for licensing, adoption, or integration into proprietary processes.\n\n**Competitive Advantages:**\nCompanies that adopt or license the technology described in the Lead Frame and Manufacturing Method of Lead Frame patent will gain several distinct competitive advantages:\n\n1.  **Superior Product Quality:** By minimizing physical damage and eliminating adhesive residue, the resulting lead frames are of higher integrity, leading to more reliable semiconductor packages and end-products. This can be a key differentiator in a quality-sensitive market.\n2.  **Cost Reduction:** Reduced rework, lower material waste (fewer scrapped lead frames), and enhanced automation capabilities directly translate to significant operational cost savings. In an industry with tight margins, such efficiencies are highly prized.\n3.  **Increased Throughput & Yield:** A more efficient and consistent tape removal process speeds up manufacturing lines and increases the percentage of usable lead frames, boosting overall production capacity and profitability.\n4.  **Technological Leadership:** Early adopters can position themselves as innovators committed to advanced manufacturing techniques and superior product quality, attracting high-value clients and talent.\n\n**Revenue Potential and Business Models:**\nRevenue generation from this patent could manifest through several business models:\n\n*   **Licensing:** Offering non-exclusive or exclusive licenses to lead frame manufacturers, OSAT providers, and integrated device manufacturers (IDMs) for implementation in their production lines. This could involve per-unit royalties or upfront licensing fees.\n*   **Consulting/Integration Services:** Providing expertise to help companies integrate the notched lead frame design and optimized tape removal processes into their existing manufacturing infrastructure.\n*   **Proprietary Manufacturing:** A company holding this patent could choose to manufacture and supply lead frames incorporating this design, carving out a niche as a premium supplier for high-reliability applications.\n*   **Consumables Sales:** If specialized tapes with differential bonding properties are developed in conjunction with this invention, there's potential for recurring revenue from the sale of these optimized tapes.\n\n**Strategic Positioning:**\nThis innovation allows a company to strategically position itself as a leader in semiconductor packaging process optimization. It moves beyond incremental improvements to address a foundational issue, offering a solution that enhances both product quality and manufacturing economics. This patent aligns perfectly with industry trends towards greater automation, precision, and sustainability (through waste reduction). It could become a standard feature in high-performance or critical application lead frames.\n\n**ROI Projections:**\nWhile specific ROI will vary by adopter, the potential for significant returns is clear. A reduction in scrap rates by even a few percentage points across high-volume production can save millions annually. The ability to increase throughput without major capital expenditure on new lines also offers rapid payback. Furthermore, the enhanced reputation for quality and reliability can lead to increased market share and premium pricing for products utilizing this advanced manufacturing method. This patent represents a compelling investment in operational excellence and product differentiation within the semiconductor industry.","faqs":[{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) describes an innovative approach to improve the manufacturing process of lead frames, which are critical components in semiconductor devices. A lead frame acts as the structural foundation and electrical connector for an integrated circuit chip. This patent specifically addresses a common challenge in lead frame production: the clean and damage-free removal of protective resin leakproof tapes.\n\nHistorically, these tapes, while essential for shielding delicate parts of the lead frame during chemical processing, have been difficult to remove. Traditional methods often result in physical damage to the lead frame or leave behind sticky adhesive residue, leading to costly reworks and reduced manufacturing yields. The invention detailed in this patent provides a systematic solution to mitigate these issues, ensuring a more efficient and reliable production process.\n\nAt its core, this technology introduces a two-part solution. First, it incorporates a strategically placed 'notched part' on the lead frame itself, serving as a clear starting point for tape removal. Second, and critically, it specifies that the adhesive strength of the protective tape is intentionally reduced in the area immediately surrounding this notch. This combination allows the tape to be peeled away smoothly and cleanly, preventing damage and residue. This patent represents a significant advancement in the precision and quality control of semiconductor component manufacturing, directly impacting the reliability of electronic devices.","question":"What is the 'Lead Frame and Manufacturing Method of Lead Frame' patent?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) operates on a clever two-fold principle to ensure clean and damage-free tape removal from lead frames. The first aspect involves a physical modification to the lead frame, while the second focuses on a controlled alteration of adhesive properties.\n\nFirstly, the lead frame body is designed to include a 'notched part' at one of its ends. This notch serves as a predefined, easily identifiable starting point for the tape-removing operation. Instead of technicians or automated systems having to find an arbitrary edge or pry at the tape, this notch provides a consistent and reliable point of initiation for peeling. This physical guide significantly improves the repeatability and control of the removal process.\n\nSecondly, and central to this innovation, is the deliberate reduction in the bonding strength between the resin leakproof tape and the lead frame body in the region immediately surrounding this notched part. This means that while the tape maintains its strong adhesion across the majority of the lead frame to provide robust protection, the area where peeling begins is engineered for easier detachment. This localized weakening of the bond can be achieved through various technical means, such as selective surface treatments on the lead frame or by using a tape with differential adhesive properties. When peeling begins at the notch, the tape separates cleanly from this 'weak link' without exerting excessive force on the delicate lead frame structures or leaving behind any adhesive residue. This integrated approach ensures a smooth, efficient, and damage-free tape removal process, optimizing the overall manufacturing workflow for lead frames.","question":"How does 'Lead Frame and Manufacturing Method of Lead Frame' work?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) primarily solves the long-standing and costly problem of damaging lead frames and leaving adhesive residue during the removal of protective resin leakproof tapes in semiconductor manufacturing. This issue has plagued the industry for decades, impacting efficiency, quality, and profitability.\n\nTraditionally, the adhesive tapes used to protect lead frames during chemical processing are designed for strong adhesion to withstand harsh environments. However, this strength becomes a significant detriment during removal. When the tape is peeled, it often requires substantial force, which can easily bend, warp, or even break the delicate, fine-pitch leads and structures of the lead frame. Such damage renders the lead frame unusable, leading to material waste and expensive rework processes. Furthermore, the strong adhesive frequently leaves behind sticky residue on the lead frame surface. This residue can contaminate subsequent critical assembly steps, such as wire bonding or molding, leading to poor adhesion, electrical shorts, or other defects that compromise the reliability and performance of the final integrated circuit.\n\nThis patent directly addresses these challenges by introducing a method that allows for precise, low-force, and residue-free tape removal. By eliminating damage and contamination, the Lead Frame and Manufacturing Method of Lead Frame significantly boosts manufacturing yields, reduces operational costs, and enhances the overall quality and reliability of semiconductor components. It transforms a historically problematic step into a streamlined and highly controlled process, which is crucial for the demands of modern electronics manufacturing.","question":"What problem does 'Lead Frame and Manufacturing Method of Lead Frame' solve?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) does not list specific inventors or an assignee in the provided data. Typically, patent documents include this information, detailing the individuals who conceived the invention and the company or entity to whom the patent rights are assigned. The absence of this data in the summary means it would need to be retrieved from the full patent document itself.\n\nIn general, such innovations in semiconductor manufacturing are often the result of dedicated research and development teams within large electronics corporations, specialized semiconductor packaging companies, or material science firms. These teams comprise engineers, materials scientists, and process specialists who work collaboratively to identify and solve critical manufacturing challenges. Their expertise spans areas like mechanical design, adhesive chemistry, surface engineering, and automated production systems.\n\nRegardless of the specific individuals or entity, the development of the Lead Frame and Manufacturing Method of Lead Frame reflects a deep understanding of the complexities of microelectronics fabrication. It underscores a commitment to continuous improvement in a highly competitive industry where even subtle process enhancements can yield significant advantages in product quality, efficiency, and cost-effectiveness. The collective effort behind such patents aims to push the boundaries of what is possible in creating the foundational components of our digital world.","question":"Who invented 'Lead Frame and Manufacturing Method of Lead Frame'?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) offers several key benefits that significantly impact the efficiency, quality, and cost-effectiveness of semiconductor manufacturing. These advantages cascade throughout the electronics supply chain, ultimately contributing to more reliable end-products.\n\nFirstly, a primary benefit is **damage-free tape removal**. By incorporating a notched part and a localized reduction in bonding strength, the invention ensures that protective resin leakproof tapes can be peeled away without bending, scratching, or breaking the delicate lead frame structures. This directly addresses a major cause of material waste and rework in traditional methods.\n\nSecondly, it guarantees **residue-free surfaces**. The engineered clean detachment means no sticky adhesive residue is left on the lead frame. This is critical for subsequent processes like wire bonding and molding, where contamination can lead to defects, poor adhesion, and compromised electrical performance. Pristine surfaces contribute to higher quality and more reliable semiconductor packages.\n\nThirdly, the innovation leads to **increased manufacturing efficiency and yield**. With damage and residue issues minimized, production lines can operate more smoothly and quickly. Fewer scrapped lead frames mean a higher percentage of usable components from each batch, directly boosting overall production yield and reducing operational costs. Finally, this technology enhances **process control and automation**. The predefined starting point and consistent peeling mechanism make the tape removal process highly predictable and amenable to advanced automation, further improving consistency and throughput. These collective benefits make the Lead Frame and Manufacturing Method of Lead Frame a valuable advancement for the semiconductor industry.","question":"What are the key benefits of 'Lead Frame and Manufacturing Method of Lead Frame'?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) distinguishes itself from prior art by fundamentally rethinking the approach to protective tape removal in lead frame manufacturing. Prior art methods typically faced significant challenges due to the uniform and strong adhesion of resin leakproof tapes across the entire lead frame surface.\n\nIn traditional methods, whether manual or automated, the initiation of tape peeling often lacked a defined starting point. This led to inconsistent application of force, varied peel angles, and a higher risk of damaging the delicate lead frame structures. The strong, uniform adhesive strength also meant that a considerable amount of force was required to detach the tape, often resulting in bent leads, scratched surfaces, or, critically, adhesive residue being left behind. These issues necessitated costly rework or outright scrapping of components, impacting overall manufacturing efficiency and product quality.\n\nIn contrast, the Lead Frame and Manufacturing Method of Lead Frame introduces two key, synergistic innovations:\n\n1.  **A Notched Part:** Unlike prior art, this invention integrates a specific 'notched part' into the lead frame design. This notch serves as a precise, predefined, and easily accessible initiation point for tape removal. This eliminates the guesswork and variability inherent in older methods, providing a consistent and repeatable start to the peeling process.\n2.  **Localized Reduced Bonding Strength:** Crucially, the patent specifies that the adhesive strength of the resin leakproof tape is intentionally reduced in the area immediately surrounding this notched part. This means the bond is engineered to be weaker at the exact point where peeling begins. This is a significant departure from the uniform adhesion of prior art tapes. This localized 'weak link' allows the tape to delaminate cleanly and with minimal force from the notch, preventing mechanical stress on the lead frame and ensuring no adhesive residue is left behind. This combination of a physical guide and engineered adhesive properties makes the Lead Frame and Manufacturing Method of Lead Frame a superior and more controlled solution, directly addressing the core deficiencies of previous tape removal techniques.","question":"How is 'Lead Frame and Manufacturing Method of Lead Frame' different from prior art?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) is poised to have a significant impact primarily on the **semiconductor manufacturing industry** and, by extension, all sectors that rely heavily on semiconductor devices. Lead frames are fundamental components in nearly every integrated circuit, making this innovation broadly influential.\n\nSpecifically, the direct beneficiaries include:\n\n*   **Lead Frame Manufacturers:** Companies that produce lead frames will see improved production yields, reduced scrap rates, and enhanced process efficiency due to the damage-free and residue-free tape removal method. This allows them to offer higher quality components to their clients.\n*   **Semiconductor Assembly and Test (OSAT) Companies:** These firms are responsible for packaging integrated circuits. They will benefit from more reliable incoming lead frames, streamlined assembly lines (e.g., cleaner surfaces for wire bonding), and reduced rework, leading to lower operational costs and faster throughput.\n*   **Integrated Device Manufacturers (IDMs):** Companies that design and manufacture their own chips will experience the same benefits in their internal packaging operations, leading to higher quality final products.\n\nBeyond the immediate semiconductor ecosystem, the impact extends to:\n\n*   **Consumer Electronics:** Devices like smartphones, laptops, tablets, smart home devices, and wearables will benefit from more reliable and potentially more cost-effective internal components.\n*   **Automotive Industry:** Modern vehicles are heavily reliant on advanced electronics for engine control, infotainment, safety systems, and autonomous driving. Improved semiconductor reliability from this patent translates to safer and more dependable automotive electronics.\n*   **Industrial and IoT (Internet of Things):** Industrial control systems, sensors, and IoT devices require robust and long-lasting components. The enhanced quality from the Lead Frame and Manufacturing Method of Lead Frame supports the development of more durable industrial applications.\n*   **Medical Devices:** High-reliability is paramount in medical electronics. This innovation contributes to the foundational quality of components used in life-saving and diagnostic equipment. Overall, any industry integrating semiconductor chips will indirectly benefit from the improved quality and efficiency enabled by this patent.","question":"What industries will 'Lead Frame and Manufacturing Method of Lead Frame' impact?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent, identified as US-9852929, was officially **filed on October 16, 2015**. The filing date marks the crucial point when the patent application was submitted to the patent office, establishing the priority date for the invention.\n\nFollowing the examination process, which involves reviewing the claims against existing prior art and ensuring the invention meets patentability requirements, the patent was subsequently **published and granted on December 26, 2017**. The publication date makes the full details of the patent publicly accessible, allowing others to understand the technology and its scope. The granting date signifies that the patent office has recognized the novelty, non-obviousness, and utility of the invention, officially conferring exclusive rights to the patent holder for a specified period.\n\nThis timeline indicates a relatively swift process from filing to grant, suggesting that the innovation presented in the Lead Frame and Manufacturing Method of Lead Frame was recognized as a distinct and valuable contribution to the field of semiconductor manufacturing. The patent's status as granted means its claims are legally enforceable, providing the patent holder with the right to exclude others from making, using, selling, or importing the invention within the jurisdiction where it was granted. This period of exclusivity allows the patent holder to commercialize the technology, license it to other companies, or use it to gain a competitive advantage in the market.","question":"When was 'Lead Frame and Manufacturing Method of Lead Frame' filed/granted?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) has significant commercial applications across the entire semiconductor and electronics manufacturing supply chain, offering tangible benefits in terms of cost, quality, and efficiency. Its core value lies in optimizing a critical, yet often problematic, step in lead frame production.\n\nPrimary commercial applications include:\n\n1.  **Lead Frame Manufacturing:** Companies specializing in the production of lead frames can implement this technology to create 'smart' lead frames with integrated notches and differential adhesive zones. These superior lead frames can be sold to semiconductor assembly houses as premium components, commanding better pricing due to their enhanced manufacturability and reliability. This allows lead frame producers to differentiate their products in a competitive market.\n2.  **Semiconductor Packaging Services (OSATs):** Outsourced Semiconductor Assembly and Test (OSAT) providers can adopt this manufacturing method to improve their internal processes. By using lead frames designed according to the patent, they can achieve higher assembly yields, reduce rework, and lower operational costs. This translates into more competitive service offerings, faster turnaround times for clients, and increased profitability.\n3.  **Adhesive Tape Development:** There's a commercial opportunity for adhesive tape manufacturers to develop and supply specialized resin leakproof tapes that are specifically designed with differential bonding strengths, optimized to work seamlessly with the notched lead frames described in the patent. These custom tapes would become a consumable product, generating recurring revenue.\n4.  **Automated Equipment & Robotics:** Manufacturers of automated assembly equipment and industrial robots can develop specialized peeling machines and end-effectors that are precisely calibrated to detect the notched part and leverage the reduced bonding strength for optimal tape removal. This creates a market for new or upgraded capital equipment.\n5.  **Direct Integration by IDMs:** Integrated Device Manufacturers (IDMs) that handle their own chip packaging can integrate this method directly into their production lines, realizing all the aforementioned benefits internally, from improved process control to enhanced product quality. Ultimately, the Lead Frame and Manufacturing Method of Lead Frame contributes to the overall reduction in cost and increase in reliability of all electronic devices, making it a commercially impactful innovation in a foundational industry.","question":"What are the commercial applications of 'Lead Frame and Manufacturing Method of Lead Frame'?"},{"answer":"The 'Lead Frame and Manufacturing Method of Lead Frame' patent (US-9852929) lays a strong foundation for future developments in semiconductor packaging and advanced manufacturing. The core concept of engineered debonding, coupled with precise physical design, opens several avenues for further innovation.\n\nOne expected future development involves **more sophisticated adhesive systems**. This could include the creation of 'smart' resin leakproof tapes whose bonding strength can be dynamically altered or de-activated on demand, perhaps through specific wavelengths of UV light, localized heat, or even electrical signals. Such advanced adhesives would allow for even finer control over the debonding process, potentially enabling self-peeling mechanisms or multi-stage tape removal for complex packaging architectures.\n\nAnother area for advancement lies in **enhanced automation and artificial intelligence**. As the notched part provides a consistent starting point, future automated systems could integrate advanced vision systems and machine learning algorithms to precisely identify the notch, optimize peeling parameters (speed, angle, force) in real-time, and detect any micro-residues or damages with even greater accuracy. This would push towards fully autonomous, zero-defect tape removal processes.\n\nFurthermore, the principles of localized bond strength reduction could be **extended to other temporary bonding applications** beyond lead frames. In advanced packaging, techniques like temporary wafer bonding for 3D integrated circuits or temporary die attachment often face similar debonding challenges. The innovation from the Lead Frame and Manufacturing Method of Lead Frame could inspire similar 'smart release' solutions for these critical steps, enabling more complex and denser electronic packages. Finally, there's potential for **sustainable manufacturing integration**, where future tapes and release layers are not only effective but also fully recyclable, biodegradable, or easily recovered, aligning with broader industry goals for environmental responsibility. These developments will ensure that the foundational integrity of semiconductor components continues to meet the escalating demands of future electronics.","question":"What are the future developments expected for 'Lead Frame and Manufacturing Method of Lead Frame'?"}],"topics":["lead frame","semiconductor manufacturing","patent US-9852929","tape removal","packaging technology","intricate","world","semiconductor"],"tech_cluster":null},"seo":{"title":"Lead Frame & Manufacturing Method - Patent US-9852929","description":"Discover the Lead Frame and Manufacturing Method of Lead Frame patent. This innovation prevents damage & residue during tape removal in semiconductor manufacturing, boosting yield.","keywords":["lead frame","semiconductor manufacturing","patent US-9852929","tape removal","packaging technology","manufacturing method","resin leakproof tape","process optimization","electronic components","microelectronics","damage-free removal","adhesive residue","manufacturing yield"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852929","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852929","citation_suggestion":"Patentable. \"Lead frame and manufacturing method of lead frame\" (US-9852929). https://patentable.app/patents/US-9852929","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852929","json":"https://patentable.app/api/llm-context/US-9852929","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:46:51.294Z"}