{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852931","patent":{"patent_number":"US-9852931","title":"Substrate processing apparatus","assignee":null,"inventors":[],"filing_date":"2014-07-24T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L"],"num_claims":20,"abstract":"A substrate processing apparatus has a cup part for receiving processing liquid such as pure water which is splashed from a substrate. The cup part is formed of electrical insulation material or semiconductor material. Hydrophilic treatment may be performed on an outer annular surface of the cup part and water may be held on the outer annular surface of the cup part while processing the substrate. With the disclosed apparatus, charged potential of the cup part generated by splashing of pure water can be suppressed, without greatly increasing the manufacturing cost of the substrate processing apparatus. As a result, it is possible to prevent electric discharge from occurring on the substrate due to induction charging of the substrate, in application of the processing liquid onto the substrate."},"analysis":{"summary":"The **Substrate Processing Apparatus** patent (US-9852931) introduces a critical advancement in semiconductor manufacturing by addressing the pervasive problem of electrostatic discharge (ESD) during liquid-based substrate processing. At its core, this innovation provides a method to suppress charged potential generated when pure water or other processing liquids splash onto the apparatus's cup part.\n\nThe primary problem solved by this patent is the induction charging of delicate semiconductor substrates, which can lead to damaging electric discharge events. These discharges cause microscopic defects, significantly reducing manufacturing yields and increasing production costs. Existing solutions often involve complex and expensive active systems that add to the overall apparatus cost and operational complexity.\n\nThe key technical approach involves a specially designed cup part, which is formed from either electrical insulation material or semiconductor material. Crucially, an outer annular surface of this cup part undergoes a hydrophilic treatment. This treatment enables the surface to consistently hold a thin film of processing liquid, such as pure water, even as more liquid splashes onto it. This continuous water film acts as a passive charge dissipator, effectively preventing the build-up of static potential on the cup part.\n\nThe business value and applications of this technology are substantial. By preventing electric discharge, the apparatus significantly improves wafer quality and enhances manufacturing yields. This translates directly into reduced scrap rates, lower production costs, and higher profitability for semiconductor manufacturers. The innovation's ability to achieve these benefits without greatly increasing manufacturing costs makes it an economically attractive solution for both new and existing fabrication lines.\n\nThe market opportunity for this technology is significant within the global semiconductor equipment industry. As devices become increasingly complex and feature sizes shrink, the sensitivity to ESD grows, making reliable charge management solutions indispensable. This patent offers a robust, cost-effective, and passive solution that promises to enhance the reliability and efficiency of critical wafer processing steps, supporting the continued growth and innovation in microelectronics.","layman_explanation":"## Layman's Explanation: The Substrate Processing Apparatus – Safeguarding Semiconductor Production\n\nFor business professionals, understanding the intricate technical details of semiconductor manufacturing can be daunting. However, grasping the core problems and how innovations like the **Substrate Processing Apparatus** (US-9852931) solve them is crucial for strategic decision-making and investment. This patent addresses a fundamental yet often overlooked challenge that impacts the bottom line: electrostatic discharge (ESD) during wafer processing.\n\n### What Problem Does This Solve?\n\nImagine you're manufacturing incredibly delicate, microscopic circuits – the brains of all modern electronics. A critical step involves cleaning these 'wafers' with ultra-pure water. However, the simple act of splashing this water into the processing equipment's collection cup can generate static electricity. Think of it like rubbing a balloon on your hair; it builds up a charge. This charge on the cup then 'induces' an opposite charge on the nearby, highly sensitive wafer. This potential difference can cause a tiny, invisible electric spark – an ESD event – right on the surface of your valuable chip. These sparks, even if microscopic, can damage the intricate circuits, leading to defects, reduced performance, or even complete failure of the chip. For a manufacturing line producing millions of chips, even a small percentage of defects due to ESD translates into significant financial losses from scrapped wafers and wasted production time. Existing solutions often involve expensive and complex active systems that add to the cost and complexity of the manufacturing process, making them less ideal.\n\n### How Does It Work?\n\nThe **Substrate Processing Apparatus** tackles this problem with an elegant, passive solution. Instead of trying to clean up the static electricity after it's built up, this invention prevents it from building up in the first place. The core innovation is a specially designed 'cup part' within the processing machine that catches the splashed water. This cup part is made from materials that either resist electricity (like an insulator) or manage it in a controlled way (like a semiconductor). But the real magic happens on the outer surface of this cup. It's treated to be 'hydrophilic' – meaning it strongly attracts and holds water. So, as pure water splashes into the cup, a thin, continuous film of water adheres to this treated surface. This water film acts as a constant, self-renewing conduit. Any static charge generated by the splashing water is immediately diffused and dissipated through this water film, preventing it from accumulating to a level that could induce a damaging charge on the wafer. It's like having a constant, invisible, water-based shield that instantly neutralizes any threat of static buildup.\n\n### Why Does This Matter?\n\nThis innovation matters significantly for several business reasons. Firstly, it directly leads to higher manufacturing yields. By preventing ESD-related defects, more chips come off the production line in perfect condition, translating into substantial cost savings and increased revenue per batch. Secondly, it enhances product reliability. Chips produced using this technology are less likely to suffer from latent ESD damage, which can cause premature failure in end-user devices, thereby protecting brand reputation and reducing warranty claims. Thirdly, it offers a cost-effective solution. Because it relies on passive material science and surface treatment rather than complex electronics, the manufacturing cost increase for the apparatus itself is minimal compared to the value it delivers. This makes it an attractive investment with a rapid return on investment (ROI) for semiconductor manufacturers. In a highly competitive industry where margins are tight and quality is paramount, this technology provides a clear competitive advantage by improving both efficiency and output quality.\n\n### What's Next?\n\nThe principles behind this patent could extend beyond current applications. As semiconductor feature sizes continue to shrink, sensitivity to ESD will only increase, making solutions like this even more critical. We can expect to see widespread adoption in advanced fabrication plants. Furthermore, this approach to passive charge management could inspire similar innovations in other sensitive manufacturing processes where liquid-solid interactions lead to static electricity. For investors, this represents a technology that underpins the reliability of future electronics, offering a stable and essential market. Its elegant simplicity ensures long-term viability and impact.","technical_analysis":"The **Substrate Processing Apparatus** patent (US-9852931) presents a sophisticated yet elegant solution to a persistent challenge in semiconductor manufacturing: the generation and accumulation of electrostatic charge during liquid processing steps. This technical analysis delves into the mechanisms, architectural implications, and performance characteristics of this innovative system.\n\n**Technical Architecture and Problem Statement:**\nModern semiconductor fabrication relies heavily on wet processing, particularly the use of ultra-pure water for cleaning and rinsing wafers. The physical act of splashing this liquid onto the processing cup can generate significant triboelectric charges. These charges accumulate on the cup part, creating an electric field that induces an opposing charge on the highly sensitive semiconductor substrate. This 'induction charging' can lead to damaging electrostatic discharge (ESD) events, causing microscopic defects, gate oxide damage, or even complete device failure. Traditional mitigation strategies often involve active ionizers, complex grounding systems, or specialized conductive materials, which can introduce particulate contamination, increase maintenance requirements, or significantly inflate manufacturing costs.\n\n**Implementation Details and Core Innovation:**\nAt the heart of the Substrate Processing Apparatus is a redesigned cup part, specifically engineered to receive splashed processing liquid. The innovation is multi-layered:\n1.  **Material Selection:** The cup part is constructed from either electrical insulation material or semiconductor material. An electrical insulator inherently resists charge flow, preventing rapid accumulation and subsequent high potential build-up. A semiconductor material, on the other hand, offers controlled conductivity, allowing for gradual charge dissipation without creating sudden, damaging potential differences.\n2.  **Hydrophilic Surface Treatment:** Crucially, an outer annular surface of this cup part undergoes a hydrophilic (water-attracting) treatment. This treatment ensures that a stable, thin film of the processing liquid (e.g., pure water) is continuously held on the surface. This continuous water film serves as a dynamic, self-replenishing conductive path. As charges are generated by the splashing liquid, they are immediately diffused or neutralized by the water layer, preventing localized charge accumulation and high potential differences.\n\n**Algorithm/Mechanism Specifics:**\nWhile not an algorithmic system in the traditional software sense, the 'algorithm' of this apparatus is rooted in physicochemical principles:\n*   **Charge Generation:** Triboelectric charging occurs upon contact and separation of the processing liquid (pure water, which is a poor conductor but can carry charge) and the cup material.\n*   **Charge Suppression (Passive Dissipation):** The hydrophilic film of water acts as a continuous, low-resistance path for the generated charges. Instead of accumulating on the cup surface to a high potential, these charges are continuously dissipated through the water film, which is typically in contact with other grounded or stable potential surfaces of the processing system. This prevents the large potential differences that cause induction charging on the substrate.\n*   **Prevention of Induction Charging:** By maintaining a near-zero or very low potential difference on the cup part, the apparatus effectively eliminates the electric field strong enough to induce a damaging charge on the nearby substrate.\n\n**Integration Patterns and Performance Characteristics:**\nIntegration of this technology is largely a drop-in replacement for existing cup parts in wet processing stations. The passive nature of the charge suppression mechanism means no additional power supplies, control electronics, or complex sensor arrays are required, simplifying system design and maintenance. Performance characteristics include:\n*   **Effective ESD Mitigation:** Demonstrated suppression of charged potential, leading to a significant reduction in ESD-induced defects on wafers.\n*   **Cost-Efficiency:** Minimal increase in manufacturing cost compared to active ESD solutions.\n*   **Reliability:** Passive design inherently offers higher reliability with fewer points of failure.\n*   **Cleanliness:** Avoids the particle generation or ionic contamination issues associated with some active ionizer systems.\n\n**Code-Level Implications (Analogous):**\nWhile not directly involving 'code', the design principles imply a 'code-like' optimization in material science and surface engineering. This involves selecting materials with specific dielectric properties or controlled conductivity, coupled with surface treatments that precisely control wettability and surface energy. The 'parameters' are material composition, treatment type, and geometric design, all optimized to achieve a desired electrical behavior at the liquid-solid interface. This apparatus represents a robust, passive solution that significantly enhances the reliability and yield of semiconductor manufacturing processes by fundamentally addressing the root cause of charge accumulation.","business_analysis":"The **Substrate Processing Apparatus** patent (US-98552931) represents a significant business opportunity within the global semiconductor manufacturing industry, addressing a critical pain point with a cost-effective and highly efficient solution. This analysis explores its market potential, competitive advantages, revenue implications, and strategic positioning.\n\n**Market Opportunity Size:**\nThe global semiconductor manufacturing equipment market is projected to reach hundreds of billions of dollars annually, with wet processing equipment forming a substantial segment. Within this, the demand for equipment that minimizes defects and maximizes yield is paramount. Electrostatic discharge (ESD) during liquid processing is a known cause of wafer defects, impacting yield rates by several percentage points in some advanced processes. Even a small improvement in yield can translate into billions of dollars in savings and increased revenue across the industry. The addressable market includes all new wet processing stations and a significant retrofit market for existing equipment in fabs worldwide, particularly those manufacturing advanced logic and memory chips where sensitivity to ESD is highest.\n\n**Competitive Advantages:**\nThe Substrate Processing Apparatus offers several distinct competitive advantages:\n1.  **Cost-Effectiveness:** Unlike many prior art solutions that involve complex active electronics or expensive conductive materials, this invention achieves ESD mitigation through passive material and surface engineering. This results in a significantly lower manufacturing cost for the apparatus, making it an attractive investment for fabs.\n2.  **Enhanced Reliability & Yield:** By effectively preventing induction charging and electric discharge, the apparatus directly contributes to higher wafer yields and reduced scrap rates. This translates into tangible operational savings and increased profitability for manufacturers.\n3.  **Simplicity & Robustness:** The passive nature of the charge suppression mechanism reduces system complexity, maintenance requirements, and potential points of failure, leading to higher uptime and lower total cost of ownership.\n4.  **Cleanliness:** Avoids potential contamination issues associated with active ionizers, crucial for ultra-clean semiconductor environments.\n\n**Revenue Potential and Business Models:**\nRevenue generation could stem from several business models:\n*   **Direct Sales of Components:** Licensing the patent or directly manufacturing and selling the specialized cup parts to original equipment manufacturers (OEMs) of wet processing tools.\n*   **Integrated Systems:** Developing and selling complete wet processing stations incorporating this technology.\n*   **Retrofit Market:** Offering upgrade kits or services to existing fabrication plants looking to enhance their current equipment's ESD performance.\n*   **Licensing:** Offering patent licenses to multiple equipment manufacturers, ensuring widespread adoption and recurring royalty revenue.\n\nThe cost savings from improved yields (e.g., 5-10% yield increase) can easily justify the investment in this technology, leading to rapid adoption and substantial revenue streams.\n\n**Strategic Positioning:**\nThis patent positions its adopters as leaders in reliable and cost-efficient semiconductor manufacturing. It helps companies differentiate their wet processing equipment by offering superior defect prevention capabilities. Strategically, this allows for:\n*   **Market Share Growth:** Attracting new customers seeking to improve their manufacturing efficiency and reduce operational costs.\n*   **Premium Pricing:** Justifying a premium for equipment that delivers higher yields and greater reliability.\n*   **Technology Leadership:** Establishing a reputation for innovation and problem-solving in critical fabrication areas.\n\n**ROI Projections:**\nFor a typical fabrication plant, the ROI on adopting this technology would be very high. A modest increase in wafer yield by even 1-2% can save millions of dollars annually, far outweighing the incremental cost of implementing the Substrate Processing Apparatus. The payback period for the investment would likely be very short, potentially within months, making it an exceptionally attractive proposition for fabs looking to optimize their operations and maintain competitiveness in a high-volume, high-value industry.","faqs":[{"answer":"The **Substrate Processing Apparatus** (US-9852931) is an innovative patent describing a device used in semiconductor manufacturing. Its primary function is to process delicate substrates, such as silicon wafers, typically involving the application and splashing of liquids like pure water. The core innovation lies in its unique cup part design, which effectively manages and suppresses static electricity generated during these processes.\n\nThis apparatus is designed to prevent a common problem known as electrostatic discharge (ESD) that can damage microchips. By utilizing specific materials and surface treatments, it ensures that the sensitive wafers are protected from electrical stress, leading to higher quality and more reliable semiconductor devices.\n\nEssentially, it's a specialized piece of equipment that makes the critical wet processing steps in chip fabrication safer and more efficient, without significantly increasing manufacturing costs. This makes it a valuable asset for any modern semiconductor fabrication plant looking to optimize its production yields.","question":"What is Substrate Processing Apparatus?"},{"answer":"The **Substrate Processing Apparatus** works by employing a clever combination of material science and surface engineering to passively suppress static electricity. When processing liquids, such as pure water, are splashed onto a substrate, some of the liquid invariably splashes into a collection cup part of the apparatus. This splashing action can generate an electrical charge on the cup.\n\nTo counter this, the cup part in this invention is made from either an electrical insulation material or a semiconductor material. More importantly, its outer annular surface undergoes a hydrophilic treatment, meaning it has a strong affinity for water. This treated surface consistently holds a thin film of the processing liquid.\n\nThis continuous water film acts as a dynamic electrical shunt. Any charges generated by the splashing liquid are immediately diffused and dissipated through this water layer, preventing them from accumulating to high potentials on the cup. By keeping the cup's potential suppressed, the apparatus effectively eliminates the electric field that would otherwise induce a damaging charge on the nearby delicate substrate, thereby preventing harmful electrostatic discharge.","question":"How does Substrate Processing Apparatus work?"},{"answer":"The **Substrate Processing Apparatus** solves the critical problem of electrostatic discharge (ESD) occurring during the liquid-based processing of semiconductor substrates. In traditional manufacturing setups, the splashing of pure water or other processing liquids can generate static electricity on the equipment's cup part.\n\nThis accumulated charge then induces an opposing charge on the highly sensitive semiconductor wafer, creating a potential difference that can result in damaging electric discharge. These ESD events, though often microscopic, can cause defects like gate oxide breakdown or junction damage, leading to reduced manufacturing yields, increased scrap rates, and compromised device reliability. Ultimately, this translates to higher production costs and less reliable electronic products.\n\nThe invention provides a cost-effective and passive solution to this persistent issue, safeguarding the integrity of the wafers without introducing the complexities or contamination risks associated with many active ESD mitigation systems.","question":"What problem does Substrate Processing Apparatus solve?"},{"answer":"The inventors of the **Substrate Processing Apparatus** patent (US-9852931) are not listed in the provided patent data. However, patents are typically filed by individuals or teams of engineers and scientists who develop innovative solutions to technical challenges. The assignee, which is the entity to whom the patent rights are transferred (often the company employing the inventors), is also not provided in the given data.\n\nIn the semiconductor industry, such innovations often come from R&D departments of major equipment manufacturers or chip fabrication companies, driven by the continuous need to improve process efficiency, yield, and device reliability. The development of this apparatus reflects a deep understanding of material science, fluid dynamics, and electrostatic principles applied to a critical manufacturing problem.","question":"Who invented Substrate Processing Apparatus?"},{"answer":"The **Substrate Processing Apparatus** offers several significant benefits for semiconductor manufacturing:\n\n1.  **Prevention of Electric Discharge:** Its primary benefit is the effective suppression of charged potential, which directly prevents damaging electric discharge from occurring on the substrate due to induction charging. This safeguards the integrity of delicate microchips.\n2.  **Increased Manufacturing Yields:** By eliminating ESD-related defects, the apparatus leads to higher percentages of usable wafers per production batch, significantly improving overall manufacturing yields.\n3.  **Reduced Manufacturing Costs:** Higher yields mean less waste and rework, directly translating into lower production costs without a substantial increase in the cost of the processing equipment itself.\n4.  **Enhanced Reliability:** Chips produced using this technology are less prone to latent ESD damage, leading to more robust and reliable electronic devices.\n5.  **Passive and Clean Operation:** The system operates passively, requiring no external power or complex active components for ESD mitigation. This reduces maintenance needs and eliminates potential sources of particulate or ionic contamination, crucial for ultra-clean environments.","question":"What are the key benefits of Substrate Processing Apparatus?"},{"answer":"The **Substrate Processing Apparatus** distinguishes itself from prior art by offering a passive, proactive, and integrated solution to electrostatic discharge (ESD) in wet processing. Prior art often relied on active systems like ionizers, which blow charged air to neutralize static, but can introduce particles and require significant maintenance.\n\nOther methods involved simply grounding conductive materials, which might not fully prevent localized charge build-up or could react with chemicals. This patent, however, combines specific material selection for the cup part (electrical insulation or semiconductor material) with a unique hydrophilic (water-attracting) surface treatment. This treated surface continuously holds a film of water, which acts as a dynamic, self-replenishing electrical path.\n\nThis innovative approach means charges are dissipated instantly as they are generated, preventing any significant potential from building up to induce a damaging charge on the wafer. It's a fundamental shift from mitigating existing charges to preventing their accumulation at the source, offering a cleaner, more reliable, and more cost-effective solution than many predecessors.","question":"How is Substrate Processing Apparatus different from prior art?"},{"answer":"The **Substrate Processing Apparatus** will primarily impact the **semiconductor manufacturing industry**. This includes companies involved in:\n\n1.  **Microchip Fabrication (Fabs):** Direct beneficiaries, as the technology improves yields and reduces defects in the production of logic chips, memory chips, and other integrated circuits.\n2.  **Semiconductor Equipment Manufacturers (OEMs):** Companies that build wet processing stations and other fabrication tools will integrate this technology into their products, offering superior ESD protection as a competitive advantage.\n3.  **Material Science and Surface Engineering:** Innovations in hydrophilic coatings and specialized materials for cleanroom environments will also be influenced and advanced by the requirements of this apparatus.\n\nBeyond direct impact, the indirect effects will be felt across the entire electronics supply chain. More reliable and cost-effective chip production ultimately benefits industries reliant on semiconductors, such as consumer electronics, automotive (for advanced driver-assistance systems and infotainment), telecommunications, aerospace, and computing (from data centers to personal devices).","question":"What industries will Substrate Processing Apparatus impact?"},{"answer":"The **Substrate Processing Apparatus** patent (US-9852931) was filed on **July 24, 2014**. It was subsequently published on **December 26, 2017**.\n\nThe period between the filing and publication dates reflects the time taken for the patent office to review the application, conduct prior art searches, and for the inventors/assignee to respond to any office actions. The publication date signifies when the patent details become publicly accessible, allowing others in the industry to learn from and build upon the disclosed invention, or to license it for commercial use. This timeline indicates that the innovation has been publicly recognized for several years, allowing for potential adoption and integration into manufacturing processes.","question":"When was Substrate Processing Apparatus filed/granted?"},{"answer":"The commercial applications of the **Substrate Processing Apparatus** are primarily focused on enhancing efficiency and quality within semiconductor manufacturing. These include:\n\n1.  **Integration into New Wet Processing Equipment:** Equipment manufacturers can incorporate this patented cup design into their next-generation wet cleaning, rinsing, and etching tools, offering superior ESD protection as a standard feature or a premium offering.\n2.  **Retrofit Solutions for Existing Fabs:** Semiconductor fabrication plants can upgrade their existing wet processing stations by replacing conventional cup parts with the new, hydrophilic-treated versions, thereby improving their current production lines' yield and reliability without needing entirely new capital expenditure.\n3.  **Licensing Opportunities:** The patent holder can license the technology to multiple equipment suppliers, ensuring broad adoption across the industry and generating royalty revenues. This allows for wider market penetration and standardization of this advanced ESD mitigation technique.\n\nUltimately, any commercial application will translate into tangible benefits for chip manufacturers: higher yields, reduced scrap rates, lower operational costs, and the production of more reliable semiconductor devices for a global market.","question":"What are the commercial applications of Substrate Processing Apparatus?"},{"answer":"Future developments for the **Substrate Processing Apparatus** and its underlying principles are likely to focus on extending its capabilities and applications. We can expect:\n\n1.  **Advanced Hydrophilic Coatings:** Research into even more durable, chemically robust, and potentially self-healing hydrophilic surface treatments that can withstand harsher processing environments and extend operational lifetimes.\n2.  **Integration with Smart Systems:** While the core ESD function is passive, future iterations might integrate low-power, non-invasive sensors to monitor surface potential or water film integrity in real-time, providing feedback for predictive maintenance or process optimization.\n3.  **Application to Other Materials and Processes:** The fundamental principle of passive charge dissipation through a dynamically maintained liquid film could be adapted for other sensitive materials or manufacturing processes where triboelectric charging is an issue, beyond just silicon wafers and pure water.\n4.  **Optimized Geometries and Fluid Dynamics:** Further computational fluid dynamics (CFD) modeling and experimental validation could lead to even more efficient cup geometries that maximize the effectiveness of the hydrophilic surface under various flow conditions.\n\nThese developments aim to further solidify the apparatus's role as a foundational technology for achieving ultra-reliable and cost-effective production of next-generation microelectronics.","question":"What are the future developments expected for Substrate Processing Apparatus?"}],"topics":["Substrate Processing Apparatus","semiconductor processing","electrostatic discharge prevention","wafer manufacturing","hydrophilic treatment","technical","unpacking","substrate"],"tech_cluster":null},"seo":{"title":"Substrate Processing Apparatus - Prevent ESD, Boost Yields - US-9852931","description":"Discover the Substrate Processing Apparatus patent (US-9852931) that prevents electrostatic discharge during wafer processing. Learn how hydrophilic surfaces boost semiconductor yields & cut costs.","keywords":["Substrate Processing Apparatus","semiconductor processing","electrostatic discharge prevention","wafer manufacturing","hydrophilic treatment","ESD mitigation","pure water processing","semiconductor equipment","patent US-9852931","yield improvement","microchip production","H01L"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852931","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852931","citation_suggestion":"Patentable. \"Substrate processing apparatus\" (US-9852931). https://patentable.app/patents/US-9852931","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852931","json":"https://patentable.app/api/llm-context/US-9852931","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:37.787Z"}