{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852941","patent":{"patent_number":"US-9852941","title":"Stacked conductor structure and methods for manufacture of same","assignee":null,"inventors":[],"filing_date":"2014-10-03T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A circuit structure that includes a plurality of stacked conductor layers separated from each other by respective dielectric layers. The conductor layers may include a first set of conductor layers made of a first type conductor material and a second set of conductor layers made of a second type conductor material different from the first. A pair of conductor posts may traverse the stacked conductor layers. A first post may be electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers. A second post electrically connected to the second set of conductor layers and electrically insulated from the first set of conductor layers."},"analysis":{"summary":"The patent titled \"Stacked Conductor Structure and Methods for Manufacture of Same\" introduces a groundbreaking circuit architecture designed to significantly enhance the performance and density of modern electronic devices. At its core, this innovation presents a multi-layered circuit structure where conductor layers are stacked vertically, each separated by dielectric layers. The ingenuity lies in the differentiation of these conductor layers into distinct sets, each potentially fabricated from a different type of conductor material, allowing for optimized electrical properties within various parts of the circuit.\n\nThe primary problem this invention solves is the challenge of achieving both high integration density and superior electrical isolation in complex, multi-layered circuits. Traditional stacking methods often lead to issues like crosstalk, signal degradation, and inefficient power delivery due to the close proximity and non-selective connectivity of numerous electrical pathways. This patent directly addresses these limitations by providing a mechanism for precise, isolated interconnects.\n\nThe key technical approach involves the use of a pair of specialized conductor posts that traverse the entire stack. A first post is designed to establish electrical connection solely with the first set of conductor layers, while remaining completely insulated from the second set. Conversely, a second post connects exclusively to the second set of conductor layers, insulated from the first. This selective connectivity ensures that different electrical signals or power rails can run in parallel within the stack without interfering with each other, leading to vastly improved signal integrity and power efficiency.\n\nFrom a business perspective, the Stacked Conductor Structure and Methods for Manufacture of Same offers substantial value. It enables the creation of smaller, more powerful, and more reliable electronic components, which are crucial for industries ranging from high-performance computing and artificial intelligence to IoT, autonomous vehicles, and advanced mobile devices. The market opportunity is immense, as this technology can serve as a foundational building block for next-generation semiconductors, offering a competitive edge through superior performance metrics and potentially streamlined manufacturing processes for complex integrated circuits.","layman_explanation":"In today's fast-paced world, every electronic device, from the smartphone in your pocket to the servers powering the cloud, relies on increasingly complex and compact microchips. The challenge for engineers and manufacturers is to keep making these chips smaller, faster, and more energy-efficient without sacrificing reliability. This is where the patent titled \"Stacked Conductor Structure and Methods for Manufacture of Same\" comes in, offering a sophisticated solution to some fundamental problems in modern electronics.\n\n**1. What Problem Does This Solve?**\n\nThink of a modern city with many layers of roads – highways, local streets, and even subway lines. If all these paths were built without careful planning, they would constantly intersect, causing traffic jams, accidents, and delays. In the world of microchips, this 'traffic jam' is called crosstalk or interference. As more and more electrical pathways (conductors) are crammed into tiny, multi-layered circuits, signals can 'leak' or interfere with each other, leading to errors, slower performance, and increased power consumption. Additionally, efficiently delivering power to different parts of a complex chip without significant energy loss or noise is a major hurdle. Existing solutions often involve trade-offs: either the chip gets bigger to create more separation, or performance is limited due to interference. This innovation directly tackles these issues by providing a smarter way to organize and connect these electrical pathways.\n\n**2. How Does It Work?**\n\nThis patent describes a clever way to build these multi-layered circuits. Imagine a stack of pancakes, where each pancake is a layer of electrical wiring. What makes this invention unique is that not all 'pancakes' are made of the same batter. Some layers are made of a special material perfect for carrying very fast data signals (like a fiber-optic highway), while other layers are made of a different, robust material ideal for delivering steady power (like a heavy-duty power line). These different material types are crucial because they allow engineers to optimize each layer for its specific job.\n\nThe real genius, however, lies in how these layers are connected. Instead of generic 'straws' (vias) that punch through all pancakes, this system uses two types of 'smart straws' or conductor posts. A 'data-only' straw is designed to connect *only* to the data-optimized pancake layers, completely bypassing and being insulated from the power-optimized layers. Conversely, a 'power-only' straw connects *only* to the power-optimized pancake layers, insulated from the data layers. This means that data signals and power can travel vertically through the chip on their own dedicated, isolated paths, without ever interfering with each other. It's like having separate, secure elevator systems for different types of cargo in a building.\n\n**3. Why Does This Matter?**\n\nThis technology matters immensely for several reasons. Firstly, it allows for significantly higher integration density. Because signals and power are so well isolated, engineers can pack more functionality into a smaller physical space, leading to more compact and powerful devices. Secondly, it drastically improves signal integrity, meaning data travels cleaner and faster, leading to higher performance and more reliable operation. Thirdly, it enables more efficient power delivery, reducing energy waste and extending battery life, which is a key driver for mobile and IoT devices. For businesses, this translates into products that are smaller, faster, more reliable, and more energy-efficient, offering a substantial competitive advantage in crowded markets. Industries like artificial intelligence, autonomous vehicles, 5G communications, and advanced consumer electronics will be direct beneficiaries, as they all demand these exact improvements.\n\n**4. What's Next?**\n\nThe \"Stacked Conductor Structure and Methods for Manufacture of Same\" lays a foundational groundwork for the next generation of semiconductors. We can expect to see this technology integrated into advanced chip packaging, enabling the creation of 'chiplets' – specialized modular components that can be stacked and interconnected with unprecedented efficiency. This approach will accelerate the development of highly customized, high-performance computing solutions. For investors, this patent signals a significant opportunity in companies focused on advanced materials science, semiconductor manufacturing equipment, and chip design that can leverage this innovation to create market-leading products in the coming years. It represents a key step towards unlocking even greater capabilities in the digital future.","technical_analysis":"The patent \"Stacked Conductor Structure and Methods for Manufacture of Same\" (US-9852941) describes an innovative circuit architecture designed to overcome fundamental limitations in high-density electronic packaging and signal integrity. This technical analysis delves into the architectural specifics, implementation considerations, and performance implications of this advanced structure.\n\n**Technical Architecture:**\nAt its foundation, the invention proposes a circuit structure comprising a plurality of stacked conductor layers. These layers are spatially separated by respective dielectric layers, which provide electrical insulation and structural support. The critical innovation lies in the material composition of these conductor layers: they are divided into at least two distinct sets. A 'first set' of conductor layers is fabricated from a 'first type' conductor material, while a 'second set' is made from a 'second type' conductor material, which is chemically or electrically distinct from the first. This heterogeneous material integration within the vertical stack is a cornerstone of the patent, allowing for optimized electrical properties (e.g., conductivity, impedance, RF characteristics) for different functional blocks within the same chip or package.\n\nCrucially, the architecture incorporates a pair of conductor posts that vertically traverse the entire stack of conductor and dielectric layers. The posts are designed for selective electrical connectivity: a first conductor post is electrically connected *only* to the first set of conductor layers and is electrically insulated from the second set. Symmetrically, a second conductor post is electrically connected *only* to the second set of conductor layers and is electrically insulated from the first set. This selective interconnect scheme is a significant advancement over conventional through-vias or micro-bumps that typically connect all layers or require complex routing to bypass intermediate ones.\n\n**Implementation Details:**\nManufacturing such a precise structure necessitates advanced semiconductor fabrication techniques. The formation of distinct conductor layers with different materials would involve sequential deposition processes (e.g., PVD, CVD, electroplating) and selective patterning (e.g., photolithography, etching). The dielectric layers would be deposited via similar methods. The most complex aspect is the creation of the selectively connected conductor posts.\n\nOne possible implementation involves forming vertical trenches or vias through the entire stack. Following this, a conformal dielectric liner (e.g., SiO2, SiN) could be deposited along the sidewalls of these trenches. Selective etching or chemical mechanical planarization (CMP) techniques would then be employed to remove this dielectric liner only from the interfaces where electrical contact is desired with a specific set of conductor layers. Finally, the trenches would be filled with a conductor material (ee.g., copper, tungsten) to form the posts. This process demands extremely high precision in alignment, etching selectivity, and material deposition control to ensure robust electrical contact to target layers and complete insulation from non-target layers.\n\n**Performance Characteristics:**\nThis architectural approach yields several significant performance advantages:\n\n1.  **Superior Electrical Isolation:** The primary benefit is the dramatic reduction in crosstalk and inter-layer interference. By physically and electrically isolating different sets of conductor layers via their dedicated posts, signal integrity is vastly improved, especially in high-frequency and mixed-signal applications.\n2.  **Optimized Power Delivery Networks (PDNs):** Different conductor materials can be chosen for power delivery layers (e.g., low resistance for power rails) versus signal layers (e.g., specific impedance for high-speed data). The selective posts enable highly efficient and noise-free power distribution to specific circuit blocks.\n3.  **Increased Integration Density:** The ability to route distinct signals/power vertically with precise isolation means that more functional blocks can be stacked within a smaller footprint without compromising performance. This contributes directly to smaller, lighter, and more powerful devices.\n4.  **Enhanced Reliability:** Reduced electrical noise and improved thermal management (through potentially optimized material choices) can lead to more reliable operation and longer device lifetimes.\n\n**Integration Patterns and Code-Level Implications:**\nWhile this patent primarily addresses hardware architecture and manufacturing, its implications extend to the design and verification of integrated circuits. Hardware description languages (HDLs) and electronic design automation (EDA) tools would need to accommodate the modeling of heterogeneous material stacks and selective vertical interconnects. Design rules would become more complex, incorporating material compatibility and selective contact parameters. For engineers, this means greater flexibility in physical layout and potentially simplified high-level routing, as critical signal/power paths can be inherently isolated by the structure itself, rather than relying solely on complex software-driven routing algorithms or additional shielding layers. The Stacked Conductor Structure and Methods for Manufacture of Same provides a powerful new primitive for advanced packaging and heterogeneous integration strategies.","business_analysis":"The patent \"Stacked Conductor Structure and Methods for Manufacture of Same\" (US-9852941) represents a significant leap in semiconductor manufacturing and circuit design, with profound business implications across various high-tech sectors. This innovation addresses critical challenges in miniaturization, performance, and power efficiency, unlocking substantial market opportunities and competitive advantages.\n\n**Market Opportunity Size:**\nThe global semiconductor market, valued at over $500 billion annually and projected for continuous growth, is constantly driven by the need for more powerful, smaller, and energy-efficient chips. Technologies that enable higher integration density and improved performance are directly tied to this growth. This patent's focus on advanced stacked conductor structures targets the core of high-performance computing, AI accelerators, IoT devices, automotive electronics, and advanced mobile platforms – all multi-billion dollar segments. The ability to enhance signal integrity and power delivery within compact packages positions this technology to capture a substantial share of the advanced packaging and heterogeneous integration market, which is rapidly expanding as traditional Moore's Law scaling slows.\n\n**Competitive Advantages:**\nCompanies that adopt or license the Stacked Conductor Structure and Methods for Manufacture of Same stand to gain significant competitive advantages:\n\n1.  **Superior Product Performance:** Devices incorporating this technology can boast higher operating frequencies, lower power consumption, reduced latency, and improved reliability due to enhanced electrical isolation and optimized power delivery. This translates directly into market-leading products.\n2.  **Increased Miniaturization:** The ability to achieve higher circuit density without compromising performance allows for smaller form factors, critical for wearables, IoT, and compact computing solutions.\n3.  **Cost Efficiency in the Long Run:** While initial R&D for implementation may be high, the optimized design can lead to higher yields, simplified board-level design (due to better on-chip integration), and reduced material waste in the long term. The selective use of materials can also lead to cost optimization.\n4.  **Intellectual Property Protection:** Owning or licensing this patent provides a strong IP barrier against competitors, safeguarding product differentiation and market share.\n\n**Revenue Potential and Business Models:**\nThis technology presents multiple avenues for revenue generation:\n\n*   **Direct Product Integration:** Semiconductor foundries and integrated device manufacturers (IDMs) can incorporate this structure into their advanced process nodes, selling chips with superior performance. This would command premium pricing.\n*   **Licensing:** The patent holder could license the technology to other semiconductor companies, generating significant royalty streams.\n*   **Design Services:** Companies specializing in chip design could offer services leveraging this architecture, helping clients optimize their designs for the new stacked conductor structure.\n*   **Material and Equipment Sales:** Manufacturers of specialized conductor materials, dielectric materials, and advanced fabrication equipment (e.g., for selective etching or deposition) would see increased demand.\n\n**Strategic Positioning:**\nCompanies embracing this invention can strategically position themselves as leaders in next-generation chip design and manufacturing. It enables a move towards more advanced 3D ICs and heterogeneous integration, which are widely recognized as the future of semiconductor technology. This innovation allows for the creation of unique value propositions in areas demanding extreme performance, such as AI training chips, high-bandwidth memory (HBM) interfaces, and specialized sensors.\n\n**ROI Projections:**\nThe return on investment (ROI) for implementing the Stacked Conductor Structure and Methods for Manufacture of Same would be realized through increased market share, higher average selling prices (ASPs) for premium products, and potentially reduced R&D cycles for future product generations due to a robust architectural foundation. Early adopters could see substantial market gains by being first to market with products that offer significantly better performance-per-watt or performance-per-area metrics, leading to strong financial returns.","faqs":[{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same is a groundbreaking patent (US-9852941) that describes an innovative circuit architecture. At its core, it involves creating electronic circuits by stacking multiple layers of conductive materials, which are separated by insulating (dielectric) layers. What makes this invention particularly unique is that these conductor layers are not all uniform; instead, they are divided into distinct sets, with each set potentially made from a different type of conductor material.\n\nThis differentiation allows for specialized optimization within the same circuit. For example, some layers might be optimized for carrying high-speed data signals, while others are designed for efficient power delivery. The patent also introduces a clever system of vertical conductor posts that are designed to connect exclusively to their designated sets of conductor layers, while remaining completely insulated from the other sets. This selective connectivity is crucial for maintaining signal integrity and optimizing power distribution in highly dense electronic devices.\n\nEssentially, this technology provides a sophisticated blueprint for building smaller, faster, and more reliable microchips by intelligently organizing and isolating different electrical pathways within a multi-layered structure. It represents a significant advancement in semiconductor manufacturing, addressing long-standing challenges in circuit density and electrical performance.","question":"What is Stacked Conductor Structure and Methods for Manufacture of Same?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same works by employing a multi-faceted approach to circuit construction. First, it involves the sequential deposition and patterning of various conductor layers and dielectric (insulating) layers, creating a vertical stack. A key aspect is the use of at least two different types of conductor materials for different sets of layers within this stack. This allows engineers to tailor the electrical properties of specific layers for distinct functions, such as high-frequency signal transmission or robust power delivery.\n\nSecond, the innovation introduces specialized vertical conductor posts. Imagine these posts as highly selective 'elevators' that traverse the entire stacked structure. One type of post is designed to connect only to the first set of conductor layers (e.g., those made of material A) and is completely insulated from the second set of conductor layers (e.g., those made of material B). Conversely, a second type of post connects only to the second set of conductor layers, insulated from the first set.\n\nThis selective connectivity is achieved during the manufacturing process through precise etching and deposition techniques. For instance, after creating vertical channels through the stack, a thin insulating layer is applied to the channel walls. Then, portions of this insulation are selectively removed only where contact with the desired conductor layers is needed. Finally, the channels are filled with conductive material to form the posts. This ensures that different electrical signals or power lines have dedicated, isolated vertical pathways, preventing interference and optimizing performance within the chip.","question":"How does Stacked Conductor Structure and Methods for Manufacture of Same work?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same patent primarily solves critical challenges associated with building high-density, high-performance electronic circuits. As modern devices demand ever-smaller footprints and greater computational power, chip designers resort to stacking multiple layers of circuitry. However, this vertical integration introduces several problems.\n\nOne major issue is **crosstalk and signal interference**. When numerous electrical pathways are crammed closely together in a multi-layered chip, signals can unintentionally 'leak' or interfere with adjacent lines, degrading data integrity and overall device performance. Another significant problem is **inefficient power delivery**. Distributing stable and clean power across complex, multi-layered structures without excessive voltage drop or noise is difficult, often leading to wasted energy and reduced reliability.\n\nExisting solutions often involve trade-offs, such as increasing chip size to create more spacing, or implementing complex shielding layers that add to manufacturing cost and complexity. This patent directly addresses these limitations by providing an architectural and manufacturing solution that inherently ensures superior electrical isolation and optimized power/signal paths, enabling higher circuit density without compromising performance or reliability. It fundamentally tackles the 'electrical traffic jam' problem in advanced microchips.","question":"What problem does Stacked Conductor Structure and Methods for Manufacture of Same solve?"},{"answer":"The patent \"Stacked Conductor Structure and Methods for Manufacture of Same\" (US-9852941) was filed on October 3, 2014, and published on December 26, 2017. The patent document typically lists the inventors and the assignee (the company or entity to whom the patent rights are assigned). In this particular case, the provided data indicates that the inventor and assignee information was not provided in the prompt. However, in a real-world scenario, this information would be readily available on the official patent document.\n\nKnowing the inventors and assignee is crucial for understanding the research and development ecosystem behind such innovations. It sheds light on which organizations are driving advancements in semiconductor technology and who holds the intellectual property rights to these critical breakthroughs. The development of a technology as complex as the Stacked Conductor Structure and Methods for Manufacture of Same typically involves a team of highly skilled engineers, material scientists, and process experts, often within a leading semiconductor company or research institution dedicated to pushing the boundaries of microchip design and manufacturing.","question":"Who invented Stacked Conductor Structure and Methods for Manufacture of Same?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same offers a multitude of key benefits that are highly advantageous for the evolution of modern electronics. Firstly, it provides **superior electrical isolation**. By selectively connecting conductor posts to specific sets of conductor layers and insulating them from others, the patent drastically reduces crosstalk and inter-layer interference. This leads to cleaner signals, higher signal-to-noise ratios, and overall more reliable circuit operation, especially critical in high-frequency and mixed-signal applications.\n\nSecondly, the invention enables **higher integration density**. Because signals and power can be routed vertically with precise isolation, more functional blocks and transistors can be packed into a smaller physical footprint. This translates directly into smaller, lighter, and more compact electronic devices without sacrificing performance.\n\nThirdly, it allows for **optimized power delivery networks (PDNs)**. Different conductor materials can be chosen for power layers versus signal layers, and dedicated posts ensure efficient and noise-free power distribution. This results in lower power consumption, reduced IR drop, and improved energy efficiency, extending battery life for portable devices and lowering operational costs for data centers.\n\nFinally, this technology fosters **enhanced heterogeneous integration**. It provides a robust framework for combining diverse functional blocks, potentially made with different materials or processes, into a single, high-performance stacked package. This is crucial for the future of chiplet architectures and advanced system-in-package solutions, pushing beyond traditional scaling limits to build more powerful and versatile electronic systems.","question":"What are the key benefits of Stacked Conductor Structure and Methods for Manufacture of Same?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same significantly differentiates itself from prior art in several fundamental ways, primarily by addressing the limitations of conventional multi-layer interconnects. In prior art, vertical connections (vias or through-silicon vias - TSVs) often traverse all stacked layers indiscriminately, or require complex routing at each layer to achieve selective bypass. This can lead to inherent challenges in electrical isolation, signal integrity, and material optimization.\n\nOne key difference lies in the **heterogeneous material composition of conductor layers**. Unlike many conventional approaches that use uniform conductor materials, this patent explicitly defines distinct sets of conductor layers made from different materials. This allows for specific optimization of each layer's electrical properties (e.g., for high-speed signals vs. power delivery), a level of material tailoring not typically built into generic stacking processes.\n\nThe most significant distinction is the **introduction of selective conductor posts**. Instead of generic vias, this invention's posts are engineered to connect *only* to their designated set of conductor layers, while being electrically insulated from all other sets. This is a profound architectural shift. Prior art might use shielding layers or complex design rules to mitigate crosstalk, but this patent integrates the isolation directly into the vertical interconnect structure itself. This inherent, built-in selectivity provides superior signal integrity, more efficient power delivery, and higher integration density compared to reactive or less integrated isolation methods of the prior art, paving the way for more robust and high-performance electronic systems.","question":"How is Stacked Conductor Structure and Methods for Manufacture of Same different from prior art?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same patent has the potential to significantly impact a wide array of industries that rely heavily on advanced electronic components and microchips. Its ability to enable higher integration density, superior electrical isolation, and optimized power delivery makes it a foundational technology for numerous high-growth sectors.\n\n**High-Performance Computing (HPC) and Artificial Intelligence (AI):** These fields require immense computational power, high-bandwidth data transfer, and energy efficiency. This technology can lead to more powerful and compact AI accelerators, processors for data centers, and supercomputers by improving interconnect performance and reducing power consumption.\n\n**Consumer Electronics:** From smartphones and tablets to wearables and smart home devices, the demand for smaller, faster, and longer-lasting gadgets is relentless. This innovation can enable thinner form factors, extended battery life, and enhanced performance in all personal electronic devices.\n\n**Automotive Electronics:** Autonomous vehicles, advanced driver-assistance systems (ADAS), and in-car infotainment systems require robust, reliable, and high-performance chips. The improved signal integrity and reliability offered by this patent are crucial for mission-critical automotive applications.\n\n**Internet of Things (IoT):** IoT devices often operate with limited power budgets and in small form factors. This technology can help create more efficient, compact, and reliable IoT sensors and edge computing devices. Additionally, **telecommunications (5G/6G)**, **medical devices**, and **aerospace/defense** will also benefit from the enhanced performance and integration capabilities of circuits built using the Stacked Conductor Structure and Methods for Manufacture of Same.","question":"What industries will Stacked Conductor Structure and Methods for Manufacture of Same impact?"},{"answer":"The patent titled \"Stacked Conductor Structure and Methods for Manufacture of Same\" carries the patent number US-9852941. According to the provided patent data, the **filing date** for this patent was **October 3, 2014**. This is the date when the patent application was initially submitted to the patent office, marking the official beginning of the patent prosecution process and establishing the priority date for the invention.\n\nThe **publication date** for this patent was **December 26, 2017**. This date signifies when the patent was officially granted and published by the patent office, making its details publicly available. The period between the filing date and the publication date involves examination by patent examiners, potential revisions, and responses to office actions before the patent is ultimately issued.\n\nUnderstanding these dates is important for tracking the lifecycle of intellectual property. The filing date is critical for determining novelty and priority against other inventions, while the publication date marks when the patent's claims and specifications become enforceable and publicly accessible for review by competitors, researchers, and potential licensees. The Stacked Conductor Structure and Methods for Manufacture of Same, therefore, has been a protected innovation since late 2017, providing its owners with exclusive rights to the technology described.","question":"When was Stacked Conductor Structure and Methods for Manufacture of Same filed/granted?"},{"answer":"The commercial applications of the Stacked Conductor Structure and Methods for Manufacture of Same are vast and span across virtually every sector that relies on advanced electronics. Its core benefits of higher integration density, superior electrical isolation, and optimized power delivery translate directly into marketable advantages for numerous products.\n\nIn **high-performance computing (HPC)** and **Artificial Intelligence (AI)**, this technology can enable the creation of more powerful and energy-efficient AI accelerators, graphic processing units (GPUs), and central processing units (CPUs) that are crucial for data centers, cloud computing, and machine learning. Its impact on **high-bandwidth memory (HBM)** interfaces will be significant, allowing for faster and more efficient data transfer between processor and memory.\n\nFor **consumer electronics**, the patent's ability to facilitate miniaturization and extend battery life makes it ideal for next-generation smartphones, wearables, smart home devices, and virtual/augmented reality (VR/AR) headsets. In the **automotive industry**, it can contribute to more reliable and compact electronic control units (ECUs) for autonomous driving, infotainment systems, and advanced sensor fusion. Furthermore, **5G and future telecommunications infrastructure**, **medical imaging devices**, and sophisticated **aerospace and defense systems** will benefit from the enhanced signal integrity and robust performance offered by circuits built using the Stacked Conductor Structure and Methods for Manufacture of Same, making it a foundational technology for a wide range of commercial products.","question":"What are the commercial applications of Stacked Conductor Structure and Methods for Manufacture of Same?"},{"answer":"The Stacked Conductor Structure and Methods for Manufacture of Same represents a foundational innovation, and its underlying principles are likely to inspire several future developments in semiconductor technology. One key area of expected advancement is the **integration of even more diverse materials**. Beyond two types of conductor materials, future iterations might incorporate three or more distinct conductor sets, potentially including optical interconnects or even early-stage quantum computing elements within the classical stack, pushing towards truly heterogeneous system-in-package (SiP) solutions.\n\nAnother development could involve **dynamic or reconfigurable interconnects**. Building upon the selective connectivity, future systems might feature conductor posts whose electrical characteristics or even connectivity paths can be dynamically altered based on computational workload or power requirements, offering unprecedented flexibility and efficiency. This could involve phase-change materials or micro-electromechanical systems (MEMS) integrated within the post structures.\n\nFurthermore, advancements in **thermal management** will be crucial. As density increases, heat dissipation becomes a major challenge. Future developments for the Stacked Conductor Structure and Methods for Manufacture of Same could include integrating microfluidic cooling channels or advanced thermal interface materials directly within the dielectric layers of the stack, or even leveraging the conductor posts themselves for more efficient heat extraction. Finally, the manufacturing processes will continue to evolve, with greater precision in atomic layer deposition (ALD) and selective etching techniques enabling even finer pitch, higher aspect ratios, and more complex, multi-layered structures, ensuring the continued relevance and evolution of this intelligent interconnect architecture.","question":"What are the future developments expected for Stacked Conductor Structure and Methods for Manufacture of Same?"}],"topics":["stacked conductor structure","circuit manufacturing","high-density electronics","semiconductor patent","electrical insulation","relentless","pursuit","higher"],"tech_cluster":null},"seo":{"title":"Stacked Conductor Structure and Methods for Manufacture of Same - Patent US-9852941","description":"Discover the Stacked Conductor Structure and Methods for Manufacture of Same patent: a breakthrough in high-density electronics with selective conductor layers and posts, enhancing signal integrity and power delivery. Explore its technical details and market impact.","keywords":["stacked conductor structure","circuit manufacturing","high-density electronics","semiconductor patent","electrical insulation","conductor materials","signal integrity","power delivery","heterogeneous integration","advanced packaging","US-9852941","patent analysis"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852941","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852941","citation_suggestion":"Patentable. \"Stacked conductor structure and methods for manufacture of same\" (US-9852941). https://patentable.app/patents/US-9852941","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852941","json":"https://patentable.app/api/llm-context/US-9852941","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:36:01.421Z"}