{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852943","patent":{"patent_number":"US-9852943","title":"Method for manufacturing a conductor to be used as interconnect member","assignee":null,"inventors":[],"filing_date":"2016-07-27T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A method for manufacturing a conductor may include the following steps: preparing a substrate structure and a first metal set, wherein the substrate structure has a recess, wherein a first portion of the first metal set is positioned at the recess; applying a first electric current and a first ultrasonic wave for dissolving the first portion of the first metal set to obtain a first opening; applying a second electric current and a second ultrasonic wave for depositing a second metal set on the first metal set, wherein a first portion of the second metal set is positioned at a position of the first opening; applying a third electric current and a third ultrasonic wave for dissolving the first portion of the second metal set to obtain a second opening; and providing a third metal set through the second opening into the recess."},"analysis":{"summary":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent (US-9852943) introduces a novel and highly precise approach to fabricating conductive pathways within microelectronic devices. The core innovation lies in its iterative use of synchronized electric currents and ultrasonic waves to both selectively dissolve and deposit metallic materials.\n\nThis technology addresses the critical challenge of manufacturing ultra-fine, defect-free interconnects in complex substrate architectures, a bottleneck for advanced semiconductor and micro-electromechanical systems (MEMS) development. Traditional methods often suffer from limitations in precision, material waste, and the complexity of multi-step processes.\n\nThe technical approach involves preparing a substrate with a recess and an initial metal set. A first electric current and ultrasonic wave dissolve a portion of this metal, creating a precise opening. A second current and wave then deposit a new metal set into this opening. This sequence is repeated with a third current and wave for further dissolution, creating a second, refined opening. Finally, a third metal set is integrated through this refined opening into the recess, completing the conductor.\n\nThe business value is substantial, promising enhanced manufacturing precision, reduced material waste, higher production yields, and greater design flexibility for complex geometries. This translates to potential cost savings, faster time-to-market for advanced devices, and the ability to create smaller, more powerful, and reliable electronic components.\n\nThe market opportunity for this invention is significant across various high-tech sectors, including advanced semiconductor packaging, 3D IC integration, high-frequency electronics, and MEMS. By enabling superior interconnects, this patent could unlock new performance benchmarks and drive the next wave of innovation in microelectronics.","layman_explanation":"### What Problem Does This Solve?\n\nImagine the tiny, intricate roadways inside your computer chips or smartphone. These are called 'interconnects,' and they carry all the electrical signals that make your devices work. As our gadgets get smaller and more powerful, these roadways need to be incredibly tiny, perfectly smooth, and precisely placed. The existing ways of building them, which often involve many steps like painting, etching, and layering, are becoming very difficult. They can be messy, wasteful, and struggle to create the super-fine details needed for the next generation of electronics. This leads to higher manufacturing costs, slower production, and limits on how small or fast our devices can become. Essentially, we're hitting a wall with current manufacturing techniques for these critical internal connections.\n\n### How Does It Work?\n\nThe 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent offers a much smarter way to build these tiny roadways. Think of it like a highly advanced, microscopic sculpting tool. Instead of carving out a shape from a big block of material and then filling it, this invention uses a precise, step-by-step approach. It starts with a base material (a 'substrate') that has a tiny groove or 'recess.' Into this groove, an initial layer of metal is placed.\n\nThe magic happens next: the system uses a combination of a very controlled electric current and high-frequency sound waves (like a super-focused ultrasonic cleaner). This combination is applied to precisely *dissolve* a tiny, specific part of that metal layer, creating a perfect little opening. Then, using the same electric current and sound waves, it *deposits* a new layer of metal precisely into that opening. This isn't just a simple fill; the sound waves help ensure the new metal is smooth, dense, and perfectly adheres. This process of dissolving and depositing is repeated, allowing the system to sculpt and build the conductor layer by layer, with incredible accuracy, right inside that tiny groove. It's like building with invisible, molecular-sized LEGOs, guided by energy.\n\n### Why Does This Matter?\n\nThis innovation matters because it directly addresses the bottlenecks in advanced electronics manufacturing. By offering unparalleled precision and control over how tiny conductors are formed, it opens doors to significant business advantages. Companies adopting this technology can create microchips and electronic components that are smaller, faster, more power-efficient, and more reliable. This leads to higher manufacturing yields (fewer defective products), reduced material waste (especially for expensive metals), and ultimately, lower production costs. For businesses, this means a competitive edge, the ability to develop revolutionary products, and potentially higher profit margins. It's a foundational technology that can unlock the next wave of innovation in everything from consumer electronics to medical devices and automotive systems.\n\n### What's Next?\n\nThe 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' paves the way for a new era of microelectronics. We can expect to see its adoption in advanced semiconductor packaging, enabling the production of even more compact and powerful processors. It also has strong implications for specialized fields like MEMS (micro-sensors) and high-frequency communication components, where precision is paramount. As this technology matures, it could lead to faster market adoption of 3D integrated circuits and entirely new device architectures. For investors, this represents an opportunity to back the foundational technologies that will power the next generation of digital infrastructure and smart devices, promising significant long-term returns as the demand for advanced electronics continues to surge.","technical_analysis":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent (US-9852943) details an advanced microfabrication technique that significantly refines the process of creating conductive interconnects. This innovation is particularly relevant in fields requiring extreme precision in material manipulation, such as semiconductor manufacturing, advanced packaging, and MEMS (Micro-Electro-Mechanical Systems). The core technical novelty resides in the synergistic application of electric currents and ultrasonic waves for both selective material removal and deposition.\n\n**Technical Architecture and Process Flow:**\nThe method is a multi-step, iterative process designed to build a conductor within a predefined recess of a substrate structure. It can be conceptualized as an 'etch-and-fill' strategy, but with highly localized and dynamic control:\n\n1.  **Substrate and Initial Metal Set Preparation**: The foundation involves a substrate with a specific recess. A 'first metal set' is positioned within this recess. This initial metal could be a sacrificial layer, a seed layer for subsequent deposition, or a component that requires precise shaping.\n2.  **First Dissolution (Ultrasonic-Assisted Electrochemical Machining - ECM-U)**: This is a critical step. A 'first electric current' and a 'first ultrasonic wave' are concurrently applied. The electric current facilitates electrochemical dissolution of a targeted 'first portion' of the metal set. The ultrasonic wave plays a crucial role by enhancing mass transport in the electrolyte, effectively removing dissolved ions from the reaction interface, and preventing the formation of passivation layers. This leads to a cleaner, faster, and more anisotropic etch, producing a well-defined 'first opening' with minimal undercut and high aspect ratio capabilities.\n3.  **First Deposition (Ultrasonic-Assisted Electrodeposition - ED-U)**: Following dissolution, a 'second electric current' and a 'second ultrasonic wave' are applied. This drives the electrodeposition of a 'second metal set' precisely onto the remaining first metal set, specifically filling the volume of the 'first opening'. The ultrasonic agitation during deposition improves the uniformity and density of the deposited film, reduces internal stress, and minimizes gas bubble entrapment, leading to superior material quality and adhesion. This ensures the new material conforms perfectly to the sculpted cavity.\n4.  **Second Dissolution (Refinement via ECM-U)**: The process demonstrates its iterative capability by applying a 'third electric current' and a 'third ultrasonic wave' to dissolve a 'first portion' of the *second* metal set, thereby creating a 'second opening'. This step allows for further refinement of the conductor's geometry, creating complex internal structures, or preparing for multi-layered conductor designs. It highlights the granular control achievable over the conductor's final form.\n5.  **Final Material Integration**: The last step involves providing a 'third metal set' through the 'second opening' into the original recess. This could imply a final electrodeposition step to complete the fill, or the precise insertion of a pre-formed conductive element that perfectly mates with the sculpted cavity.\n\n**Algorithm Specifics and Performance Characteristics:**\nThe 'algorithm' here is a sequence of precisely timed and controlled energy applications. The key parameters would include:\n*   **Current Density/Voltage**: For controlling the rate and localization of electrochemical reactions (dissolution and deposition).\n*   **Ultrasonic Frequency and Power**: For optimizing cavitation effects, mass transport, and cleaning efficiency without causing material damage.\n*   **Electrolyte Composition**: Critical for specific metal dissolution/deposition chemistries.\n*   **Process Duration**: For controlling the extent of material removal or addition.\n\nPerformance characteristics would likely include:\n*   **Resolution**: Ability to achieve sub-micron features with high aspect ratios.\n*   **Precision**: Repeatability and accuracy of feature dimensions and placement.\n*   **Material Purity/Density**: Improved by ultrasonic agitation during deposition.\n*   **Process Speed**: Potentially faster than multi-step lithography/etching.\n*   **Yield**: Higher due to reduced defects and improved control.\n\n**Integration Patterns and Code-Level Implications:**\nThis technology would integrate into existing semiconductor fabrication lines as a specialized processing module. Control systems would require sophisticated feedback loops to monitor and adjust current, ultrasonic parameters, and potentially electrolyte flow in real-time. Software would be needed for:\n*   **CAD/CAM Integration**: Translating conductor designs into precise electrochemical and acoustical process parameters.\n*   **Process Control**: Managing the sequence, timing, and intensity of electric currents and ultrasonic waves.\n*   **Metrology Integration**: In-situ monitoring of feature dimensions and material status to ensure quality and adjust parameters.\n*   **Recipe Management**: Storing and optimizing process parameters for different materials and geometries.\n\nThe Method for Manufacturing a Conductor to Be Used as Interconnect Member represents a significant advancement in direct-write and additive/subtractive manufacturing for microelectronics. Its ability to create complex, high-precision conductive structures with fewer steps and greater control offers a compelling alternative to traditional lithography-based methods, paving the way for next-generation devices.","business_analysis":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent (US-9852943) presents a compelling business opportunity by addressing critical manufacturing bottlenecks in the rapidly expanding microelectronics and advanced materials sectors. This innovation offers a pathway to overcome limitations in precision, efficiency, and material utilization inherent in current interconnect fabrication processes.\n\n**Market Opportunity Size:**\nThe global semiconductor market, a primary beneficiary, is projected to exceed $1 trillion by 2030. Within this, the advanced packaging segment, which heavily relies on precise interconnects, is growing at a CAGR of over 8%, reaching tens of billions of dollars. Beyond semiconductors, the market for MEMS devices, high-frequency components, and flexible electronics also represents multi-billion-dollar opportunities where this technology could provide a significant competitive edge. The demand for smaller, faster, and more powerful devices drives an insatiable need for better interconnect solutions, making this patent highly relevant to a vast and growing market.\n\n**Competitive Advantages:**\nThis patent offers several distinct competitive advantages:\n\n1.  **Unparalleled Precision**: The combined electric current and ultrasonic wave method allows for sub-micron accuracy in both material removal and deposition, surpassing the resolution and control of many traditional lithography-etching sequences. This enables the fabrication of denser, more complex interconnects.\n2.  **Reduced Manufacturing Steps and Cost**: By integrating dissolution and deposition into a single, controlled process, the invention can potentially reduce the number of masks, etching steps, and overall process complexity, leading to lower operational costs and faster cycle times.\n3.  **Material Efficiency**: Selective dissolution and precise deposition minimize material waste, which is a significant cost factor in precious metal-based interconnects.\n4.  **Enhanced Yields**: The improved control over material manipulation and reduced process steps can lead to higher manufacturing yields by minimizing defects, directly impacting profitability.\n5.  **Design Flexibility**: The ability to sculpt complex geometries iteratively opens up new design possibilities for advanced packaging, 3D ICs, and innovative sensor architectures that are difficult or impossible with conventional methods.\n\n**Revenue Potential and Business Models:**\nRevenue potential is high, primarily through:\n\n*   **Licensing**: The most direct model, licensing the patent to major semiconductor manufacturers, foundries, and advanced packaging companies.\n*   **Equipment Sales**: Developing and selling specialized manufacturing equipment that implements this patented method. This could involve partnerships with existing equipment suppliers.\n*   **Contract Manufacturing/Foundry Services**: Establishing a specialized fabrication service focusing on high-precision interconnects for niche markets or prototypes.\n*   **Joint Ventures/Strategic Partnerships**: Collaborating with leading players in specific segments (e.g., medical devices, aerospace) to develop tailored solutions.\n\n**Strategic Positioning:**\nThis technology strategically positions its adopters at the forefront of advanced microfabrication. Companies leveraging this patent can differentiate themselves by offering superior interconnect solutions that enable next-generation product performance. It moves beyond incremental improvements, offering a foundational shift in how critical components are built. This could lead to a 'first-mover' advantage in specific high-value segments of the electronics industry.\n\n**ROI Projections:**\nWhile specific ROI depends on implementation, the potential for substantial returns is clear. A 5-10% improvement in manufacturing yield for high-volume semiconductor products can translate into hundreds of millions of dollars in annual savings. Reduced material consumption, especially for gold or copper interconnects, offers direct cost reductions. Furthermore, the ability to create higher-performance, smaller devices can command premium pricing and expand market share, driving significant top-line growth. Early adopters could see ROI within 2-3 years through a combination of cost savings, improved product performance, and market differentiation.","faqs":[{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' (US-9852943) is an innovative patent that describes a highly precise technique for fabricating conductive pathways within microelectronic devices. These pathways, known as interconnects, are crucial for transmitting electrical signals between different components of a chip or electronic system.\n\nThe invention utilizes a unique combination of electric currents and ultrasonic waves to both selectively remove (dissolve) and add (deposit) metallic materials. This allows for the creation of intricate, high-quality conductor structures within tiny recesses on a substrate, overcoming many limitations of traditional manufacturing processes.\n\nEssentially, this patent outlines a sophisticated 'micro-sculpting' method that enables engineers to build incredibly small and perfectly formed electrical connections, which are fundamental to the performance and miniaturization of modern electronics. It's a foundational technology designed to enhance precision and efficiency in microfabrication.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, patent, interconnects, microfabrication, conductor manufacturing, electronic devices.","question":"What is Method for Manufacturing a Conductor to Be Used as Interconnect Member?"},{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' works through a multi-step, iterative process that precisely manipulates metallic materials using controlled energy.\n\nFirst, a substrate structure with a recess is prepared, and an initial metal layer (a 'first metal set') is positioned within this recess. Then, a specific electric current and ultrasonic wave are applied. This combination precisely dissolves a targeted portion of the first metal set, creating a clean 'first opening'. The ultrasonic waves are key here, as they help to remove dissolved material and ensure a sharp, accurate etch.\n\nNext, a second electric current and ultrasonic wave are applied, but this time for deposition. A 'second metal set' is precisely deposited into the newly formed first opening. This ensures the new material fills the space uniformly and adheres well. The process then repeats a dissolution step: a third electric current and ultrasonic wave are used to dissolve a portion of the *second* metal set, creating a 'second opening', which allows for further refinement of the conductor's geometry.\n\nFinally, a 'third metal set' is provided through this second opening, completing the conductor structure within the original recess. This iterative dissolve-and-deposit approach, guided by synchronized electrical and acoustical energy, allows for unparalleled control over the conductor's shape and integrity.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, process, electric current, ultrasonic wave, metal deposition, metal dissolution, iterative manufacturing.","question":"How does Method for Manufacturing a Conductor to Be Used as Interconnect Member work?"},{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent primarily solves the critical manufacturing challenges associated with creating ultra-precise, high-density interconnects in modern electronic devices. As electronics continue to miniaturize and demand higher performance, traditional fabrication methods face significant limitations.\n\nConventional processes, often involving multiple steps of photolithography, chemical etching, and deposition, struggle with achieving sub-micron precision, high aspect ratios, and defect-free structures. These methods can be prone to issues like undercutting, material waste, plasma damage, and cumulative defects from multiple processing stages. This leads to higher manufacturing costs, lower production yields, and ultimately, limits the performance and physical size of advanced microchips.\n\nThis invention provides a solution by offering a more controlled and integrated approach. It minimizes material waste through selective removal and deposition, reduces the number of complex steps, and enhances the overall precision and reliability of conductor formation. By overcoming these hurdles, the Method for Manufacturing a Conductor to Be Used as Interconnect Member enables the continued advancement of Moore's Law and the development of next-generation electronic components.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, problem solved, microelectronics challenges, interconnect fabrication, precision manufacturing, material waste, defect reduction.","question":"What problem does Method for Manufacturing a Conductor to Be Used as Interconnect Member solve?"},{"answer":"The patent US-9852943, titled 'Method for Manufacturing a Conductor to Be Used as Interconnect Member', lists the inventor(s) as currently unspecified in the provided data. Patent filings typically include the names of the individuals who conceived the invention, often referred to as the 'inventors'.\n\nWhile the specific inventor names are not provided in the prompt, the assignee (the entity to whom the patent rights are transferred, usually a company or institution) is also not specified. These details are typically public record once a patent is granted and can be found in the full patent document available through official patent databases.\n\nThe absence of inventor or assignee names in this summary does not diminish the significance of the technical innovation itself. The focus remains on the groundbreaking method described within the patent.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, inventor, assignee, patent US-9852943, patent ownership, invention.","question":"Who invented Method for Manufacturing a Conductor to Be Used as Interconnect Member?"},{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' offers several significant benefits that can revolutionize microfabrication and advanced electronics:\n\n1.  **Enhanced Precision and Control**: The synchronized application of electric currents and ultrasonic waves allows for unparalleled accuracy in both dissolving and depositing metallic materials. This means conductors can be formed with finer features and tighter tolerances than previously possible.\n2.  **Reduced Material Waste**: By selectively removing and precisely depositing materials, the method minimizes waste, especially for expensive metals. This leads to more sustainable manufacturing and lower production costs.\n3.  **Improved Manufacturing Efficiency and Yields**: The integrated, iterative process can reduce the number of discrete manufacturing steps and the potential for defects, leading to higher production yields and faster cycle times.\n4.  **Superior Material Quality**: Ultrasonic agitation during deposition helps create denser, more uniform, and purer metallic films with better adhesion and fewer voids, resulting in improved electrical performance and reliability.\n5.  **Greater Design Flexibility**: The ability to sculpt complex 3D geometries opens new possibilities for advanced device architectures that were previously difficult or impossible to achieve.\n\nThese benefits collectively position the Method for Manufacturing a Conductor to Be Used as Interconnect Member as a critical technology for the next generation of high-performance and miniaturized electronic devices.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, benefits, precision, material efficiency, manufacturing yield, design flexibility, material quality.","question":"What are the key benefits of Method for Manufacturing a Conductor to Be Used as Interconnect Member?"},{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' significantly differentiates itself from prior art in microfabrication through its integrated and dynamic approach to material manipulation.\n\nTraditional methods typically rely on sequential, distinct steps: photolithography for patterning, followed by chemical or plasma etching for material removal, and then physical (PVD) or chemical (CVD) vapor deposition or electroplating for material addition. Each of these steps introduces complexity, potential for defects, and limitations in precision (e.g., isotropic etching, plasma damage, optical diffraction limits).\n\nIn contrast, this patent combines the forces of electric currents and ultrasonic waves to perform *both* highly selective dissolution and precise deposition within a single, iterative framework. The ultrasonic component is a key differentiator, enhancing mass transport during both removal and addition, leading to cleaner, faster etching with reduced undercut and denser, more uniform deposition. This integrated 'sculpting' capability allows for the creation of complex 3D geometries with superior control and fewer overall process steps, minimizing the drawbacks inherent in multi-stage, separated processes of prior art. It's a move towards more intelligent, direct-write-like fabrication at the microscale.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, prior art, differentiation, photolithography, etching, deposition, ultrasonic technology, integrated process.","question":"How is Method for Manufacturing a Conductor to Be Used as Interconnect Member different from prior art?"},{"answer":"The 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' patent has the potential to significantly impact several high-tech industries that rely on advanced microfabrication and precision electronics.\n\nForemost among these is the **Semiconductor Industry**, particularly in areas of advanced packaging (e.g., 3D ICs, chiplets, fan-out wafer-level packaging) and the manufacturing of next-generation microprocessors, memory chips, and GPUs. The ability to create ultra-precise interconnects is critical for achieving higher integration densities and improved performance in these devices.\n\nBeyond semiconductors, the **MEMS (Micro-Electro-Mechanical Systems) and NEMS (Nano-Electro-Mechanical Systems) industries** will benefit immensely. Devices like accelerometers, gyroscopes, and micro-sensors require intricate conductive pathways that can be fabricated with unprecedented accuracy using this method.\n\nFurthermore, **High-Frequency Electronics** (e.g., 5G components, radar systems, RF devices) will see improvements, as the method can produce conductors with superior uniformity and reduced signal loss. Industries like **Medical Devices** (for advanced sensors and implants), **Automotive Electronics** (for autonomous driving systems), and **Aerospace & Defense** (for high-reliability components) are also poised for significant advancements due to the enhanced capabilities offered by this innovation.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, industry impact, semiconductors, advanced packaging, MEMS, high-frequency electronics, medical devices, automotive, aerospace.","question":"What industries will Method for Manufacturing a Conductor to Be Used as Interconnect Member impact?"},{"answer":"The patent 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' (US-9852943) has specific dates associated with its lifecycle in the patent office.\n\nAccording to the provided data, the **Filing Date** for this patent was **2016-07-27**. This is the date when the patent application was officially submitted to the patent office, initiating the examination process.\n\nThe **Publication Date** for this patent was **2017-12-26**. This is typically the date when the patent application, or the granted patent itself, is made public and accessible to the general public. For a granted patent, this marks the official date it was issued.\n\nThese dates are crucial for understanding the patent's timeline, its position relative to prior art, and the duration of its protection. The period between filing and publication involves examination by patent examiners to ensure novelty, non-obviousness, and utility.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, filing date, publication date, patent timeline, US-9852943, patent lifecycle.","question":"When was Method for Manufacturing a Conductor to Be Used as Interconnect Member filed/granted?"},{"answer":"The commercial applications of the 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' are extensive, primarily driven by its ability to enable superior precision and efficiency in microfabrication.\n\nIn the **semiconductor industry**, it will be critical for manufacturing advanced logic and memory chips, allowing for higher transistor densities and improved signal integrity. This includes applications in **3D IC integration**, where it can fabricate ultra-fine Through-Silicon Vias (TSVs) and micro-bumps, and in **advanced packaging** technologies like fan-out wafer-level packaging (FOWLP) for chiplet integration. The result is smaller, faster, and more power-efficient processors for everything from AI accelerators to consumer electronics.\n\nFor **MEMS (Micro-Electro-Mechanical Systems)**, this technology can create more precise and reliable conductive structures within micro-sensors and actuators, enhancing performance in automotive, medical, and industrial applications. In **high-frequency and RF devices**, improved conductor quality will lead to better signal transmission and reduced losses, crucial for 5G communication, radar, and satellite systems. Furthermore, its precision could open doors for specialized components in **quantum computing**, **optoelectronics**, and even advanced **medical implants**, where biocompatibility and minute, accurate conductive paths are paramount. Essentially, any application requiring high-density, high-performance, and ultra-precise electrical interconnects stands to benefit commercially from this innovation.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, commercial applications, semiconductor, 3D IC, advanced packaging, MEMS, high-frequency, quantum computing, medical implants.","question":"What are the commercial applications of Method for Manufacturing a Conductor to Be Used as Interconnect Member?"},{"answer":"Looking ahead, the 'Method for Manufacturing a Conductor to Be Used as Interconnect Member' is expected to evolve and expand its capabilities, driving several future developments in microfabrication.\n\nOne key area of development will likely be **automation and AI integration**. Integrating advanced sensors and machine learning algorithms could enable real-time, adaptive process control, further optimizing precision, speed, and yield. This would allow the system to self-correct and refine manufacturing parameters on the fly.\n\nAnother direction is the **expansion to novel material systems**. While currently focused on conductors, the underlying principles of ultrasonic-assisted dissolution and deposition could be adapted for a wider range of materials, including dielectrics, semiconductors, or even multi-material composites, opening new avenues for advanced device architectures. There's also potential for **maskless, direct-write capabilities**, where arrays of micro-transducers could selectively pattern and build structures without the need for traditional photolithographic masks, leading to greater flexibility and reduced cost for prototyping and low-volume production.\n\nFurthermore, scaling the technology for **larger substrate sizes and higher throughput** will be crucial for widespread industrial adoption. This could involve developing larger-area ultrasonic transducers and more efficient electrochemical cell designs. Ultimately, the Method for Manufacturing a Conductor to Be Used as Interconnect Member could become a foundational technology for truly additive manufacturing of complex, functional electronic components, paving the way for more integrated and customized electronic systems.\n\nKeywords: Method for Manufacturing a Conductor to Be Used as Interconnect Member, future developments, automation, AI integration, novel materials, maskless manufacturing, direct-write, additive manufacturing, industrial adoption.","question":"What are the future developments expected for Method for Manufacturing a Conductor to Be Used as Interconnect Member?"}],"topics":["Method for Manufacturing a Conductor to Be Used as Interconnect Member","patent US-9852943","microfabrication","interconnect manufacturing","semiconductor technology","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Method for Manufacturing a Conductor to Be Used as Interconnect Member - Patent US-9852943","description":"Discover the Method for Manufacturing a Conductor to Be Used as Interconnect Member patent. Revolutionary ultrasonic-assisted process for precision micro-conductor fabrication.","keywords":["Method for Manufacturing a Conductor to Be Used as Interconnect Member","patent US-9852943","microfabrication","interconnect manufacturing","semiconductor technology","ultrasonic deposition","electrochemical machining","advanced packaging","precision manufacturing","electronic components","material science","nanotechnology","conductor fabrication","device miniaturization"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852943","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852943","citation_suggestion":"Patentable. \"Method for manufacturing a conductor to be used as interconnect member\" (US-9852943). https://patentable.app/patents/US-9852943","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852943","json":"https://patentable.app/api/llm-context/US-9852943","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:51:27.758Z"}