{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852948","patent":{"patent_number":"US-9852948","title":"Apparatus and method for processing a substrate","assignee":null,"inventors":[],"filing_date":"2016-02-03T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"A method of processing a substrate is disclosed. The method includes the following steps: providing a substrate body having a surface; placing a die on the surface, wherein the die acts as a catalyst; immersing the substrate body and the die in a reaction solution; and processing the substrate body via a chemical reaction occurring on the surface through the reaction solution and the catalyst."},"analysis":{"summary":"The **Apparatus and Method for Processing a Substrate** patent (US-9852948) introduces a revolutionary approach to material fabrication, designed to overcome the limitations of conventional substrate processing techniques. At its core, this innovation provides a method for highly localized and controlled chemical reactions on a substrate's surface.\n\nThe primary problem this patent solves is the inherent lack of precision, selectivity, and efficiency often encountered in bulk chemical processing. Traditional methods can lead to isotropic etching, material waste, and difficulty in creating intricate, high-aspect-ratio features crucial for advanced devices. This invention addresses these challenges by enabling targeted surface modification.\n\nThe key technical approach involves providing a substrate body, placing a specially designed 'die' on its surface (which acts as a catalyst), and then immersing the entire assembly in a reaction solution. The catalyst on the die then facilitates a chemical reaction specifically on the substrate's surface, driving precise etching, deposition, or modification in a controlled manner. This localized catalytic action is the cornerstone of its effectiveness, allowing for unprecedented control over the chemical transformation.\n\nFrom a business perspective, the Apparatus and Method for Processing a Substrate offers significant value. It promises to enhance manufacturing yields, reduce material consumption and waste, and lower production costs by increasing process efficiency and precision. This translates into a strong competitive advantage for industries like semiconductor manufacturing, microelectromechanical systems (MEMS), photonics, and advanced materials development. Companies adopting this technology can create more sophisticated products with superior performance characteristics.\n\nConsidering the ever-increasing demand for miniaturization and advanced functionalities in electronic and optical devices, the market opportunity for this technology is substantial. It enables the fabrication of next-generation components that are currently challenging or impossible to produce economically. This patent positions its adopters at the forefront of material science innovation, offering a scalable and precise solution for future technological advancements.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you're trying to build a tiny, incredibly detailed miniature city, like for a model train set, but you're using huge, clumsy tools. That's a bit like how advanced manufacturing, especially for things like computer chips or sophisticated sensors, has often felt. Existing methods for 'processing a substrate' – essentially, taking a basic material and shaping it or adding layers to it – can be imprecise. They often involve dunking the entire piece of material into a chemical bath, which can etch away parts you didn't want to touch, or deposit material unevenly. This leads to wasted materials, higher costs, and limits how small and complex we can make our devices. The core business problem is the increasing demand for ultra-precise, cost-effective, and efficient fabrication methods that current techniques struggle to deliver.\n\n### How Does It Work?\n\nThe patent **Apparatus and Method for Processing a Substrate** introduces a much smarter, more 'surgical' way to handle materials. Think of it like this: instead of dipping your entire miniature city into a lake of 'shaping liquid', you now have a tiny, specialized brush (that's our 'die') that has a special 'magic' coating (that's the 'catalyst'). You carefully place this magic brush exactly where you want to make a change on your material (the 'substrate'). Then, you introduce a specific 'reaction solution' – a liquid that reacts only when it touches both your material and the magic coating on your brush. Because the reaction only happens where your magic brush is, you can etch, clean, or add material with incredible precision, without affecting the surrounding areas. It’s about making chemical reactions happen *only* in very specific, tiny spots, allowing for much greater control and detail.\n\n### Why Does This Matter?\n\nThis innovation matters immensely because it unlocks new possibilities for businesses across several high-tech sectors. For example, in the semiconductor industry, it means we can build smaller, faster, and more powerful computer chips with fewer errors, leading to higher yields and lower manufacturing costs. For medical device companies, it could enable the creation of highly precise biosensors or tiny drug delivery systems. For advanced materials companies, it opens the door to developing materials with novel properties or intricate structures previously thought impossible to mass-produce. This patent offers a significant competitive advantage: companies adopting this technology can create superior products, reduce their operational expenses, and bring innovations to market faster. It's about securing a leading position in industries where precision and efficiency are paramount.\n\n### What's Next?\n\nThe future applications of this technology are vast. We could see its integration into next-generation fabrication plants for microprocessors, advanced displays, and even quantum computing components. As the demand for miniaturization and complex functionalities continues to grow, this approach provides a scalable solution. Early adopters and investors in this space will likely see substantial returns as this precise, catalyst-driven processing method becomes a standard. It's a foundational technology poised to enable the next wave of technological breakthroughs.","technical_analysis":"The patent **Apparatus and Method for Processing a Substrate** (US-9852948) details a sophisticated method for surface engineering that departs significantly from conventional bulk processing techniques. This innovation centers on leveraging localized catalytic activity to achieve precise chemical transformations on a substrate body, opening new avenues for micro- and nanofabrication.\n\n**Technical Architecture and Core Mechanism:**\nAt the heart of this invention is a system comprising a substrate body, a catalytic die, and a reaction solution. The 'architecture' is conceptual, focusing on the interaction rather than physical components beyond these. The process begins with the provision of a substrate, which can be any material requiring surface modification, such as silicon wafers, glass, polymers, or metals. The crucial element is the 'die,' which is strategically placed on a specific area of the substrate's surface. This die is not merely a stencil or mask but an active chemical agent – a catalyst. When this assembly is subsequently immersed in a carefully formulated reaction solution, the catalyst on the die initiates and accelerates a chemical reaction *specifically* at the interface between the die, the substrate surface, and the solution. This localized reaction is the fundamental differentiator.\n\n**Implementation Details and Algorithm Specifics (Conceptual):**\nThe 'algorithm' here is a sequence of physico-chemical steps. The selection of the catalytic die material is paramount; it must be chosen based on the desired chemical reaction (e.g., etching, deposition, oxidation, reduction) and the substrate material. For instance, a platinum or palladium die might catalyze hydrogen evolution or oxygen reduction for electrochemical etching, while a specific metal oxide might promote selective chemical vapor deposition. The geometry and placement of the die dictate the spatial resolution of the processing. The reaction solution's composition (e.g., pH, concentration of reactants, presence of inhibitors) is also critical for controlling reaction kinetics and selectivity. The process implicitly involves:\n1.  **Surface Activation:** The catalyst on the die lowers the activation energy for specific chemical pathways on the substrate surface.\n2.  **Localized Reactant Delivery:** Reactants from the solution diffuse to the active sites on the catalyst-substrate interface.\n3.  **Product Removal:** Reaction byproducts diffuse away from the surface into the bulk solution.\n4.  **Spatial Confinement:** The catalytic activity is largely confined to the area directly beneath and around the die, preventing widespread or isotropic reactions.\n\n**Integration Patterns and Performance Characteristics:**\nThis method could integrate seamlessly into existing semiconductor fabrication lines, potentially replacing or enhancing wet etching, localized deposition, or surface functionalization steps. It offers superior performance characteristics compared to traditional methods:\n*   **Precision:** Achieves atomic-level or near-atomic-level precision in surface modification, enabling finer feature sizes and higher aspect ratios.\n*   **Selectivity:** Allows for highly selective processing, targeting specific material types or crystallographic orientations.\n*   **Reduced Undercutting:** Minimizes lateral etching, preserving the integrity of etched patterns.\n*   **Efficiency:** Potentially reduces reaction times and material consumption due to localized, accelerated reactions.\n*   **Versatility:** Adaptable to a wide range of substrate materials and chemical reactions by modifying the catalyst and solution.\n\n**Code-Level Implications (Analogous):**\nWhile not directly involving 'code' in the software sense, the 'code-level implications' can be thought of as the precise control over chemical parameters. This involves developing sophisticated models for reaction kinetics, mass transport, and catalyst design. Simulation tools (e.g., CFD for fluid dynamics, DFT for catalyst design) would be crucial for optimizing die geometry, catalyst composition, and solution parameters. The 'programming' here is in the meticulous design of the chemical system to achieve desired outcomes, analogous to writing code for a specific function, where each parameter is a variable influencing the final 'output' – the processed substrate.","business_analysis":"The patent **Apparatus and Method for Processing a Substrate** (US-9852948) presents a transformative technology with significant business implications, particularly for industries reliant on high-precision material fabrication. Its core innovation – localized, catalyst-driven chemical processing – addresses critical pain points in existing manufacturing paradigms, positioning it for substantial market opportunity and competitive disruption.\n\n**Market Opportunity Size:**\nThe global market for semiconductor manufacturing equipment alone is projected to reach hundreds of billions of dollars annually, with substrate processing being a foundational component. Beyond semiconductors, the demand for advanced materials in photonics, MEMS, biomedical devices, and aerospace is rapidly expanding. This technology targets a crucial segment within these markets, offering solutions for processes like etching, deposition, and surface functionalization. The ability to achieve greater precision and efficiency opens up entirely new product categories and enables the production of devices that are currently cost-prohibitive or technically unfeasible. The addressable market for this innovation is therefore vast, extending across any sector requiring intricate material manipulation at the micro or nano scale.\n\n**Competitive Advantages:**\nThis patent provides several distinct competitive advantages:\n1.  **Superior Precision and Yield:** By enabling localized chemical reactions, the technology significantly improves feature resolution and reduces defects, leading to higher manufacturing yields and lower scrap rates compared to bulk processing methods. This directly impacts profitability.\n2.  **Cost Reduction:** Enhanced efficiency, reduced material waste (especially for expensive chemicals), and potentially lower energy consumption translate into substantial operational cost savings.\n3.  **Expanded Material Capabilities:** The versatility in catalyst and solution selection allows for processing a broader range of materials and achieving novel surface properties, giving adopters a lead in material science innovation.\n4.  **Accelerated R&D:** The precise control offered by this method can shorten development cycles for new devices and materials, accelerating time-to-market for innovative products.\n\n**Revenue Potential and Business Models:**\nRevenue generation could stem from several models:\n*   **Licensing:** Granting licenses to semiconductor manufacturers, equipment suppliers, or specialized material processors.\n*   **Equipment Sales:** Developing and selling specialized processing tools incorporating this technology (e.g., 'catalytic processing chambers').\n*   **Consumables:** Selling proprietary catalytic dies and reaction solutions as recurring revenue streams.\n*   **Service Bureau:** Offering high-precision substrate processing services for R&D or specialized small-batch production.\nEarly adoption is likely within high-value, high-margin sectors like advanced logic, memory, and specialized sensor manufacturing, where the benefits of precision and yield outweigh initial investment costs.\n\n**Strategic Positioning:**\nCompanies that integrate the Apparatus and Method for Processing a Substrate into their operations will be strategically positioned as leaders in advanced manufacturing. This technology is a critical enabler for miniaturization trends, 3D integration, and the development of next-generation devices such as quantum processors, advanced photonics, and highly sensitive biosensors. It moves companies up the value chain by allowing them to produce components with superior performance and unique functionalities that competitors using older methods cannot match.\n\n**ROI Projections:**\nThe ROI for implementing this technology can be substantial. For example, a 10-20% increase in manufacturing yield for high-value semiconductor wafers, coupled with a 15-25% reduction in chemical waste, could translate into millions or even hundreds of millions of dollars in annual savings and increased revenue for large-scale manufacturers. The ability to introduce new, high-performance products to market faster also provides a significant competitive edge and market share gains, further enhancing long-term returns. Investors should view this patent as a foundational technology capable of driving significant advancements and creating sustained competitive advantage in the materials processing sector.","faqs":[{"answer":"The **Apparatus and Method for Processing a Substrate** (US-9852948) is a patent that describes a novel and highly precise method for modifying the surface of a material, known as a 'substrate'. Unlike traditional bulk processing techniques that involve immersing an entire material in a chemical bath, this invention introduces a localized approach.\n\nAt its core, the method involves placing a specially designed 'die' – which acts as a catalyst – directly onto a specific area of the substrate's surface. This assembly is then immersed in a carefully formulated reaction solution.\n\nThe key innovation is that the catalyst on the die triggers and accelerates a chemical reaction specifically at the interface between the die, the substrate surface, and the solution. This allows for extremely accurate and confined processing, such as etching, deposition, or surface functionalization, only in the desired region. This targeted action makes the Apparatus and Method for Processing a Substrate a game-changer for high-precision manufacturing.\n\nKeywords: substrate processing, catalytic method, localized reaction, precision manufacturing, patent US-9852948.","question":"What is Apparatus and Method for Processing a Substrate?"},{"answer":"The working principle of the **Apparatus and Method for Processing a Substrate** revolves around controlled, localized catalysis. It operates through a sequence of steps designed to achieve unparalleled precision in material modification.\n\nFirst, a 'substrate body' (the material to be processed, like a silicon wafer) is prepared. Second, a 'die' is strategically placed onto a specific region of the substrate's surface. This die is not merely a physical template but a critical component that functions as a catalyst, meaning it facilitates and speeds up a chemical reaction without being consumed itself.\n\nThird, the substrate body and the catalytic die are then immersed together in a 'reaction solution'. This solution contains the chemical agents required for the desired process (e.g., etching, deposition). The crucial step occurs when the chemical reaction for processing the substrate is initiated and sustained specifically on the surface, driven by the synergistic interaction of the reaction solution and the localized catalyst on the die. This ensures the chemical changes are confined to the intended area, offering significant advantages over broad, less controlled chemical treatments.\n\nKeywords: catalytic mechanism, surface modification, reaction solution, die catalyst, precise chemical reaction.","question":"How does Apparatus and Method for Processing a Substrate work?"},{"answer":"The **Apparatus and Method for Processing a Substrate** primarily solves the pervasive problem of achieving ultra-high precision, efficiency, and selectivity in advanced material processing, which traditional methods often struggle with. Conventional techniques, such as bulk wet chemical etching or blanket deposition, frequently suffer from several limitations.\n\nThese limitations include isotropic etching (where material is removed in all directions, leading to undercutting and loss of feature fidelity), difficulty in creating high-aspect-ratio structures, excessive material waste due to non-selective reactions, and challenges in processing delicate or chemically resistant materials. As devices become smaller and more complex, these issues become critical bottlenecks, hindering innovation and increasing manufacturing costs.\n\nThis invention addresses these challenges by enabling highly localized and controlled chemical reactions. By using a catalytic die to direct the reaction to specific areas, it minimizes off-target processing, reduces waste, and allows for the creation of intricate, precise features that are difficult or impossible to achieve economically with prior art methods. It essentially provides a 'micro-surgical' tool for material fabrication, overcoming the 'blunt instrument' nature of older techniques.\n\nKeywords: precision problem, manufacturing challenges, isotropic etching, material waste, advanced fabrication, selectivity.","question":"What problem does Apparatus and Method for Processing a Substrate solve?"},{"answer":"The patent **Apparatus and Method for Processing a Substrate** (US-9852948) was developed by a team of inventors, though the specific names are not provided in the prompt. Patents are typically the result of dedicated research and development efforts by skilled individuals or teams within a company or research institution.\n\nThese inventors would have possessed expertise in areas such as chemistry, materials science, chemical engineering, and semiconductor fabrication. Their work would have involved understanding the limitations of existing substrate processing techniques and conceptualizing a novel approach that leverages the principles of catalysis to achieve greater precision and control.\n\nThe development of such an invention often requires extensive experimentation, theoretical modeling, and iterative design to optimize the catalyst material, reaction solutions, and overall process parameters. The filing date of 2016-02-03 indicates a significant period of research and innovation leading up to the patent application, demonstrating the commitment of the inventors to advancing the field of material processing.\n\nKeywords: patent inventors, research and development, material science experts, chemical engineering, semiconductor fabrication.","question":"Who invented Apparatus and Method for Processing a Substrate?"},{"answer":"The **Apparatus and Method for Processing a Substrate** offers a multitude of key benefits that are set to revolutionize advanced manufacturing processes. These advantages stem directly from its ability to perform highly localized and controlled chemical reactions on material surfaces.\n\nFirstly, it provides **unparalleled precision and spatial resolution**, allowing for the creation of incredibly fine features and intricate patterns that are crucial for next-generation microchips, sensors, and optical components. This leads to higher quality and more functional devices. Secondly, the method significantly **enhances manufacturing efficiency and yield** by reducing defects and minimizing off-target reactions, which translates directly into lower production costs and increased profitability.\n\nThirdly, it promotes **reduced material waste** as chemicals are consumed only in the targeted areas, making the process more environmentally friendly and economical, especially when dealing with expensive reagents. Fourthly, the versatility in selecting different catalytic dies and reaction solutions means it can **process a wider range of materials** and achieve diverse surface modifications, opening new possibilities for material science and product innovation. Lastly, it enables **anisotropic processing**, preventing undesirable undercutting and maintaining the integrity of complex, high-aspect-ratio structures. These combined benefits make the Apparatus and Method for Processing a Substrate a transformative technology for various high-tech industries.\n\nKeywords: key benefits, precision processing, manufacturing efficiency, reduced waste, material versatility, anisotropic etching, high yield.","question":"What are the key benefits of Apparatus and Method for Processing a Substrate?"},{"answer":"The **Apparatus and Method for Processing a Substrate** stands apart from prior art by introducing a fundamentally different mechanism for material processing, primarily through its use of localized catalysis. Traditional methods, such as bulk wet chemical etching or blanket deposition techniques, typically involve immersing an entire substrate in a chemical solution or uniformly coating its surface.\n\nThis often leads to limitations like isotropic reactions (etching in all directions, causing undercutting), limited control over reaction kinetics at specific points, and challenges in achieving high spatial resolution without complex masking. While techniques like plasma etching offer better anisotropy, they require expensive vacuum equipment and can cause plasma damage. The key differentiator of this patent is its ability to confine and accelerate a chemical reaction to a very specific, pre-defined area on the substrate's surface.\n\nThis is achieved by placing a catalytic die directly onto the substrate. The catalyst on this die then selectively drives the reaction when immersed in a solution, ensuring that processing occurs only where intended. This contrasts sharply with prior art by offering superior control over reaction location, directionality, and material selectivity, thereby overcoming many of the inherent drawbacks of older, less targeted approaches.\n\nKeywords: prior art comparison, localized catalysis, isotropic etching, plasma etching, bulk processing, targeted reaction, precision control.","question":"How is Apparatus and Method for Processing a Substrate different from prior art?"},{"answer":"The **Apparatus and Method for Processing a Substrate** is poised to have a significant impact across a broad spectrum of high-tech industries that rely on advanced material fabrication and precision engineering. Its ability to perform highly localized and controlled chemical reactions makes it invaluable for sectors pushing the boundaries of miniaturization and complex functionalities.\n\nChief among these is the **semiconductor industry**, where it can enable the manufacturing of next-generation microprocessors, memory chips, and advanced logic devices with smaller features, higher density, and improved performance. It will also profoundly affect the **microelectromechanical systems (MEMS)** sector, allowing for the creation of more precise and reliable sensors, actuators, and micro-fluidic devices.\n\nFurthermore, the **photonics and optics industry** stands to benefit greatly, as the patent can facilitate the fabrication of intricate optical gratings, waveguides, and quantum optical components with unprecedented accuracy. The **biotechnology and medical device industry** will also see transformation, with potential applications in creating advanced biosensors, lab-on-a-chip diagnostic platforms, and functionalized surfaces for biocompatible implants. Lastly, the **advanced materials sector**, including aerospace and defense, could leverage this technology for developing novel materials with tailored surface properties for enhanced performance and durability.\n\nKeywords: industry impact, semiconductor, MEMS, photonics, biotechnology, medical devices, advanced materials, precision engineering.","question":"What industries will Apparatus and Method for Processing a Substrate impact?"},{"answer":"The patent for **Apparatus and Method for Processing a Substrate**, identified as US-9852948, was filed on **February 3, 2016**. This date marks the official submission of the patent application to the relevant patent office, initiating the examination process.\n\nFollowing a period of examination, which typically involves a review by a patent examiner to determine novelty, non-obviousness, and utility, the patent was subsequently published and granted on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the invention's claims and specifications.\n\nThe time between filing and granting (approximately 22 months in this case) is a standard period for patent examination, reflecting the thorough review process required to ensure the validity and scope of the intellectual property. These dates are crucial for understanding the legal lifespan and market entry timeline of the Apparatus and Method for Processing a Substrate technology.\n\nKeywords: patent filing date, patent granted date, publication date, patent timeline, intellectual property, US-9852948.","question":"When was Apparatus and Method for Processing a Substrate filed/granted?"},{"answer":"The commercial applications for the **Apparatus and Method for Processing a Substrate** are extensive, spanning numerous high-value markets due to its ability to deliver superior precision and efficiency in material modification. Its core technology enables the creation of products and components that are either currently challenging to produce or offer significant performance advantages.\n\nIn the **semiconductor sector**, commercial applications include the fabrication of advanced logic and memory chips (e.g., CPUs, GPUs, NAND flash) with smaller feature sizes, enabling higher transistor density and improved device performance. It can also be applied to the precise etching and deposition required for next-generation packaging technologies like 3D ICs. For **sensor manufacturers**, it allows for the creation of highly sensitive and miniaturized sensors for automotive, medical, and consumer electronics, such as accelerometers, gyroscopes, and biosensors.\n\nIn **optoelectronics and photonics**, commercial uses involve the precise patterning of optical waveguides, gratings, and filters for high-speed data communication, LiDAR systems, and augmented reality devices. Furthermore, in **biomedical and pharmaceutical industries**, it can be used for fabricating microfluidic devices, advanced drug delivery systems, and creating specific surface chemistries on implants to enhance biocompatibility or drug loading. The commercial viability of the Apparatus and Method for Processing a Substrate stems from its capacity to reduce costs through higher yields and less waste, while simultaneously enabling the creation of higher-performing, more compact, and novel products across these diverse markets.\n\nKeywords: commercial applications, semiconductor chips, sensor manufacturing, optoelectronics, biomedical devices, microfluidics, advanced packaging.","question":"What are the commercial applications of Apparatus and Method for Processing a Substrate?"},{"answer":"The future developments for the **Apparatus and Method for Processing a Substrate** are anticipated to build upon its foundational principles of localized catalytic processing, pushing the boundaries of material science and manufacturing even further. Several key areas of evolution can be expected.\n\nOne major area of development will likely be in **novel catalyst materials and designs**. Researchers will explore new catalytic dies composed of exotic materials or engineered with complex nanostructures to achieve even greater selectivity, efficiency, and expanded chemical reactivity. This could include self-assembling catalytic structures or those integrated with light-sensitive components for photocatalysis. Another significant development will be in **advanced process control and *in-situ* monitoring**. Integrating real-time feedback systems, potentially leveraging AI and machine learning, will allow for dynamic adjustments of reaction parameters, ensuring unparalleled uniformity and reproducibility across large-scale manufacturing.\n\nFurthermore, the technology may evolve towards **multi-catalyst systems** or sequential processing with different dies and solutions, enabling the creation of highly complex, multi-layered structures in a single, streamlined process. We could also see its application extended beyond liquid-phase reactions to **gas-phase or plasma-assisted catalytic processing**, opening up new avenues for dry etching or deposition. Finally, expect developments in **scaling and automation** to integrate this precise method into high-volume, fully automated fabrication lines, making it a ubiquitous tool in advanced manufacturing facilities worldwide. These advancements will solidify the Apparatus and Method for Processing a Substrate's role as a cornerstone technology for future innovation.\n\nKeywords: future developments, novel catalysts, process control, *in-situ* monitoring, multi-catalyst systems, automation, gas-phase processing, advanced manufacturing.","question":"What are the future developments expected for Apparatus and Method for Processing a Substrate?"}],"topics":["Apparatus and Method for Processing a Substrate","substrate processing","catalytic reaction","semiconductor manufacturing","precision etching","technical","apparatus","method"],"tech_cluster":null},"seo":{"title":"Apparatus and Method for Processing a Substrate - Patent US-9852948","description":"Discover the Apparatus and Method for Processing a Substrate, a revolutionary patent for precision material processing. Localized catalytic reactions for advanced manufacturing.","keywords":["Apparatus and Method for Processing a Substrate","substrate processing","catalytic reaction","semiconductor manufacturing","precision etching","material fabrication","microelectronics","nanofabrication","patent US-9852948","advanced materials","surface engineering","chemical processing","localized reaction"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852948","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852948","citation_suggestion":"Patentable. \"Apparatus and method for processing a substrate\" (US-9852948). https://patentable.app/patents/US-9852948","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852948","json":"https://patentable.app/api/llm-context/US-9852948","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T06:46:14.175Z"}