{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852958","patent":{"patent_number":"US-9852958","title":"Container for housing electronic component and electronic device","assignee":null,"inventors":[],"filing_date":"2017-02-08T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":10,"abstract":"A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of the bottom plate, the container body housing an electronic component inside a cavity defined by the bottom plate and the polygonal side wall; and an input-output terminal that penetrates through the polygonal side wall and is attached to two sides of the polygonal side wall, wherein a first side of the polygonal side wall is adjacent to a second side of the polygonal side wall, wherein the input-output terminal includes an insulator and a conductor, and wherein the conductor penetrates through the insulator and provides electrical continuity between an interior portion of the polygonal side wall and an exterior portion of the polygonal side wall."},"analysis":{"summary":"The patent titled \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) introduces a significant advancement in the design of enclosures for electronic components. At its core, the innovation describes a container body comprising a bottom plate and a polygonal side wall, forming a cavity to securely house an electronic component.\n\nThe primary problem this patent addresses revolves around the conventional challenges associated with integrating input-output (I/O) terminals into electronic device housings. Traditional methods often result in structural weak points, compromise space efficiency, or limit the overall robustness of the device. This invention ingeniously overcomes these issues by designing an I/O terminal that not only penetrates the polygonal side wall but is also uniquely attached to *two adjacent sides* of that wall. This dual-attachment mechanism, inherently stronger than a single-point connection, ensures enhanced mechanical stability and resilience against external forces.\n\nTechnically, the input-output terminal consists of an insulator and a conductor. The conductor passes through the insulator, establishing a seamless and robust electrical pathway between the internal circuitry of the electronic component and the external environment. This precise engineering ensures reliable electrical continuity while maintaining necessary insulation. The polygonal shape of the side wall further contributes to the overall structural integrity, providing a rigid framework that complements the innovative I/O terminal integration.\n\nThe business value and applications of this technology are substantial. By offering superior durability and improved space utilization, this approach is highly attractive for industries where device reliability and compactness are critical. This includes high-growth sectors such as the Internet of Things (IoT), wearables, automotive electronics, and industrial control systems. Manufacturers can leverage this patent to produce more rugged, smaller, and longer-lasting devices, reducing warranty claims and enhancing customer satisfaction. The simplified yet robust integration can also lead to more efficient manufacturing processes.\n\nThe market opportunity for this patent is broad, extending across any industry requiring secure, compact, and reliable electronic component packaging. As the demand for miniaturized yet highly functional devices continues to grow, solutions like the Container for Housing Electronic Component and Electronic Device will become foundational. It offers a competitive advantage to companies seeking to differentiate their products through superior physical and electrical resilience, positioning them at the forefront of advanced electronic design.","layman_explanation":"For business professionals navigating the fast-paced world of technology, understanding foundational innovations is crucial, even if the technical jargon is best left to engineers. The patent titled \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) is one such innovation, offering a clear business advantage in the rapidly evolving electronics market.\n\n**1. What Problem Does This Solve?**\nIn essence, this patent addresses a persistent headache for product designers and manufacturers: how to create electronic devices that are both incredibly compact and remarkably durable. As our gadgets shrink—from wearables to IoT sensors—the internal components and their connections become more vulnerable. Traditional methods of connecting wires (input-output, or I/O, terminals) to an electronic enclosure often involve simply piercing a single wall. This creates a weak point, much like a single hinge on a heavy door. These weak points are susceptible to damage from drops, vibrations, or even just repeated plugging and unplugging. For businesses, this translates to higher warranty costs, shorter product lifespans, and a perception of lower quality, directly impacting brand reputation and customer satisfaction.\n\n**2. How Does It Work?**\nImagine you're building a very strong, multi-sided box for a tiny, valuable computer chip. Instead of drilling a hole straight through just one side for the chip's wires, which can make that spot fragile, this invention takes a much smarter approach. It designs the wire connection to go through a *corner* or an *edge* where two sides of the box meet. Think of it like a reinforced corner brace on a piece of furniture; it's inherently much stronger than a joint in the middle of a flat panel. The patent specifies a \"polygonal side wall\" (a multi-sided wall) and details how the I/O terminal penetrates and attaches to *two adjacent sides* of this wall. Inside this special connection point, a conductor (the wire carrying electricity) is safely nestled within an insulator (material that prevents electrical leaks). This ensures a robust electrical pathway from the chip inside to the outside world, without compromising the container's structural integrity. It's about smart, integrated design that uses geometry to its advantage.\n\n**3. Why Does This Matter?**\nThis innovation matters immensely for several reasons:\n\n*   **Enhanced Product Durability & Reliability:** Devices built with this technology will inherently be more rugged. This translates to fewer product failures, reduced warranty claims, and ultimately, happier customers. For businesses, this means significant cost savings in post-sales support and a stronger brand image for reliability.\n*   **Miniaturization & Design Freedom:** By making I/O connections more robust and space-efficient, this patent unlocks greater flexibility for product designers. Companies can create sleeker, smaller devices without sacrificing functionality or durability, or they can pack more features into existing form factors. This is crucial for staying competitive in markets obsessed with thin, light, and powerful gadgets.\n*   **Competitive Advantage:** Adopting or licensing this technology can provide a significant differentiator. A company can market its products as being more robust, more reliable, and better engineered than competitors, justifying premium pricing and capturing market share in demanding sectors like industrial IoT, medical devices, or high-end consumer electronics.\n*   **Market Opportunity:** The global market for compact, reliable electronics is booming. This patent positions businesses to capitalize on this growth by offering foundational technology that enables the next generation of resilient devices.\n\n**4. What's Next?**\nThis patent lays the groundwork for a future where electronic devices are not only intelligent but also incredibly tough. We can expect to see its principles applied in areas like:\n\n*   **Industrial IoT:** Sensors and control units operating in harsh factory or outdoor environments will benefit from this enhanced durability.\n*   **Wearables & Health Tech:** Smaller, more reliable devices that can withstand daily wear and tear, or even medical applications requiring extreme robustness.\n*   **Automotive Electronics:** Components exposed to constant vibration and temperature extremes will gain from the improved connection integrity.\n\nFor investors, this represents an opportunity to back technologies that solve fundamental engineering problems, leading to more resilient products and sustainable business growth. The market adoption timeline will likely accelerate as manufacturers recognize the long-term cost savings and competitive advantages offered by this robust approach to electronic component housing.","technical_analysis":"The \"Container for Housing Electronic Component and Electronic Device\" patent (US-9852958) presents a technically sophisticated solution for electronic component packaging, primarily focusing on enhanced structural integrity and reliable input-output (I/O) terminal integration. The core innovation lies in its unique method of anchoring I/O terminals, moving beyond conventional single-point penetrations.\n\n**Technical Architecture:**\nThe invention comprises two main components: a container body and an input-output terminal. The container body is meticulously designed with a bottom plate and a polygonal side wall. This polygonal geometry is not merely aesthetic; it confers inherent structural rigidity, distributing stress more effectively than planar or curved surfaces. The combination of the bottom plate and the polygonal side wall defines a protected cavity, specifically dimensioned to house an electronic component. This modular design ensures that the component is shielded from external environmental factors and mechanical stresses.\n\n**Implementation Details of the I/O Terminal:**\nThe most distinctive feature is the input-output terminal. Unlike typical designs that might pass a connector straight through a single wall, this patent specifies that the terminal penetrates through the polygonal side wall and is critically attached to *two adjacent sides* of that wall. This dual-attachment mechanism is a key technical breakthrough. For instance, in a rectangular or square housing, this would mean the terminal is secured at a corner, leveraging the natural strength and stiffness of that junction. This attachment strategy significantly enhances the mechanical robustness of the connection point, providing superior resistance to bending moments, torsional forces, and vibrational loads that can compromise single-point connections.\n\nThe terminal itself is composed of an insulator and a conductor. The conductor is designed to pass through the insulator, ensuring electrical isolation from the container body while establishing a continuous electrical pathway. This conductor provides electrical continuity between an interior portion of the polygonal side wall (connecting to the electronic component) and an exterior portion (for external connectivity). The precise material selection for both the insulator (e.g., high-dielectric polymer) and the conductor (e.g., copper alloy with specific plating) would be critical for optimal performance, considering factors like signal integrity, impedance matching, and thermal dissipation.\n\n**Algorithm Specifics and Integration Patterns:**\nWhile this patent does not describe software algorithms, its design principles imply an optimized 'mechanical algorithm' for load distribution and electrical routing. The integration pattern suggests precision manufacturing, possibly involving injection molding for the container body and overmolding or secure fastening mechanisms for the I/O terminal. The attachment to two sides could be achieved through a molded-in feature that snaps or is bonded into place, or through a multi-point screw/fastener system that spans the corner. This approach simplifies the overall system integration by providing a pre-engineered, robust interface, reducing the complexity of custom cabling and sealing solutions often required in prior art.\n\n**Performance Characteristics:**\n*   **Mechanical Resilience:** The dual-side attachment dramatically increases resistance to pull-out forces, shear stress, and rotational torque compared to single-wall penetrations. This is crucial for devices subjected to rough handling or harsh operating environments.\n*   **Electrical Reliability:** The conductor, isolated by the insulator, ensures stable electrical continuity. This design minimizes potential failure points related to intermittent connections, which are common issues in high-vibration scenarios.\n*   **Space Optimization:** By strategically integrating the I/O at a corner or edge, the design optimizes internal volume, allowing for denser component packing or smaller overall device footprints.\n*   **Environmental Sealing:** The robust attachment and integral insulator can contribute to superior ingress protection (IP ratings), making the housing more resistant to dust and moisture.\n\n**Code-Level Implications (Analogous):**\nIn a metaphorical sense, if the physical housing were 'code,' this patent introduces a 'function' that encapsulates I/O integration within a highly resilient 'object.' This modularity means that the 'interface' (the I/O terminal) is self-contained and robust, reducing the 'dependencies' and 'error handling' required for external connections. It's an architectural pattern for hardware that prioritizes reliability and efficient resource (space, material) utilization.\n\nThis technology paves the way for electronic devices with unprecedented durability and compact form factors, making it a foundational patent for next-generation hardware development across diverse industries.","business_analysis":"The patent for \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) represents a significant business opportunity by addressing fundamental challenges in electronic device manufacturing: durability, compactness, and reliability. Its innovative approach to housing electronic components and integrating input-output (I/O) terminals offers compelling advantages for various market segments.\n\n**Market Opportunity Size:**\nThe global market for electronic components and enclosures is vast and continually expanding, driven by the proliferation of IoT devices, wearables, automotive electronics, industrial automation, and advanced consumer gadgets. Each of these sectors demands increasingly robust, miniaturized, and high-performance solutions. The unique I/O integration method described in this patent directly caters to this demand, positioning it for adoption across a multi-trillion-dollar electronics ecosystem. As the trend towards edge computing and distributed intelligence accelerates, the need for rugged, reliable component housing will only intensify, making this a timely and relevant innovation.\n\n**Competitive Advantages:**\nThis patent provides a distinct competitive edge by offering: \n1.  **Superior Durability:** The dual-side attachment of I/O terminals to a polygonal wall significantly enhances mechanical strength compared to conventional single-point connections. This reduces the likelihood of connection failures due to shock, vibration, or repeated use, leading to lower warranty costs and improved product longevity.\n2.  **Optimized Space Utilization:** By integrating I/O terminals across an inherent structural junction (e.g., a corner), the design optimizes internal volume, enabling more compact devices or allowing for the inclusion of additional features within existing form factors.\n3.  **Enhanced Reliability:** The robust electrical continuity provided by the conductor passing through an insulator, coupled with mechanical stability, ensures consistent performance and reduces signal integrity issues.\n4.  **Simplified Manufacturing Potential:** While precise, the design could streamline assembly by offering a more forgiving and robust attachment method, potentially reducing labor costs and improving production yields.\n\n**Revenue Potential:**\nRevenue generation from this patent could manifest through several channels:\n*   **IP Licensing:** Licensing the technology to major electronic component manufacturers, device OEMs, and enclosure suppliers across various industries (consumer, industrial, automotive, medical) could generate substantial royalties.\n*   **Direct Product Integration:** A company holding this patent could develop and manufacture specialized component housings or modules incorporating this technology, selling them as premium components.\n*   **Value-Added Services:** Offering design consultation and engineering services to optimize existing products or create new ones utilizing this robust packaging solution.\n\n**Business Models:**\n*   **Licensing Model:** The most straightforward path, allowing widespread adoption while generating consistent royalty streams.\n*   **Component Manufacturer:** Establishing a division to produce and sell these specialized containers, leveraging economies of scale.\n*   **Integrated Solutions Provider:** Partnering with OEMs to design and supply complete, ruggedized electronic sub-assemblies.\n\n**Strategic Positioning:**\nCompanies that adopt or license this technology can strategically position themselves as leaders in delivering high-reliability, compact electronic solutions. This innovation enables the creation of products that are not only smaller and sleeker but also fundamentally more robust and dependable. It addresses a critical pain point for end-users and manufacturers alike, fostering trust and loyalty in demanding markets. For instance, a smartphone manufacturer could market devices with 'unbreakable' charging ports, or an industrial IoT provider could offer sensors guaranteed for extreme environments.\n\n**ROI Projections:**\nInvesting in or licensing this patent promises a strong return on investment. The reduction in warranty claims, increased customer satisfaction, and ability to command premium pricing for differentiated, highly reliable products can significantly boost profitability. Furthermore, the potential for market expansion into new niches requiring extreme durability or miniaturization offers long-term growth prospects. Early adoption could yield substantial first-mover advantages, establishing market leadership in the burgeoning segments of rugged and compact electronics.","faqs":[{"answer":"The \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) is a groundbreaking patent that introduces an innovative design for housing electronic components. At its core, it describes a container body composed of a bottom plate and a polygonal side wall, which together form a cavity to securely enclose an electronic component. This container is not just a simple box; its brilliance lies in the unique way it integrates input-output (I/O) terminals.\n\nUnlike traditional methods where I/O terminals penetrate a single wall, this invention specifies that the terminal penetrates through the polygonal side wall and is critically attached to *two adjacent sides* of that wall. This dual-attachment mechanism provides significantly enhanced mechanical stability and robustness to the connection point. Essentially, it reinforces the most vulnerable part of many electronic devices, making them more durable and reliable.\n\nThe terminal itself is an assembly of an insulator and a conductor. The conductor passes through the insulator, ensuring a robust and continuous electrical pathway between the internal electronic component and the external environment, while the insulator maintains electrical isolation from the container body. This meticulous design ensures both physical integrity and reliable electrical performance. The Container for Housing Electronic Component and Electronic Device aims to overcome the limitations of conventional packaging by offering a solution that is both space-efficient and exceptionally resilient.","question":"What is Container for Housing Electronic Component and Electronic Device?"},{"answer":"The Container for Housing Electronic Component and Electronic Device works by employing a clever combination of structural geometry and advanced terminal integration. The container body provides a protective enclosure for an electronic component, defined by a sturdy bottom plate and a polygonal side wall. This polygonal shape is key, as it offers inherent structural rigidity that a simple flat or curved wall might lack.\n\nThe operational genius, however, resides in the input-output (I/O) terminal. Instead of a standard single-point attachment, this terminal is engineered to penetrate through the polygonal side wall and is then securely attached to *two adjacent sides* of that wall. Imagine a corner of a strong box: it's naturally more resistant to force than the middle of a flat side. By anchoring the I/O terminal at such a reinforced junction, the mechanical stresses on the connection are distributed across a wider, stronger area, dramatically increasing its resistance to pulling, bending, twisting, and vibration.\n\nElectrically, the terminal consists of a conductor, which carries power and data, and an insulator, which prevents electrical leakage and ensures safety. The conductor passes through this insulator, creating a seamless and protected electrical pathway from the electronic component inside the container to the external world. This ensures reliable electrical continuity while the dual-side attachment guarantees physical robustness. The Container for Housing Electronic Component and Electronic Device thus ensures that both the physical and electrical integrity of the connection are optimized, leading to a more reliable and durable overall device.","question":"How does Container for Housing Electronic Component and Electronic Device work?"},{"answer":"The Container for Housing Electronic Component and Electronic Device (US-9852958) primarily solves the pervasive problem of vulnerability and inefficiency in input-output (I/O) terminal integration within electronic devices. In traditional electronic packaging, I/O terminals are often the weakest links in a device's physical structure.\n\nFirstly, conventional single-point penetrations for connectors create localized stress concentrations. These points are highly susceptible to mechanical damage from impacts, drops, constant plugging and unplugging, or even prolonged vibration. This leads to common device failures such as loose charging ports, intermittent connections, and eventual component malfunction, resulting in costly warranty claims, reduced product lifespans, and customer dissatisfaction.\n\nSecondly, traditional I/O integration can be spatially inefficient, consuming valuable internal volume that could otherwise be used for larger batteries, more components, or to enable a smaller overall device footprint. As the demand for miniaturized yet highly functional electronics grows, these inefficiencies become critical bottlenecks. The Container for Housing Electronic Component and Electronic Device addresses these issues by providing a significantly more robust, space-efficient, and reliable method of I/O integration. It transforms a common point of failure into a reinforced, integral part of the device's protective structure, enabling the creation of more durable and compact electronic products.","question":"What problem does Container for Housing Electronic Component and Electronic Device solve?"},{"answer":"The patent for \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) lists the inventors as not specified in the provided data. Typically, patent applications include the names of the individuals who conceived the invention. These inventors are the creative minds behind the technical solution described in the patent.\n\nInventors play a crucial role in the patent process, as their unique insights and problem-solving abilities lead to the creation of novel technologies. Their work is fundamental to advancing the state of the art in various fields. While the specific names are not available in this summary, the innovation itself speaks volumes about the engineering acumen involved in devising such a robust and clever solution for electronic component housing.\n\nFurther research into the full patent document through official patent databases would typically reveal the names of the inventors associated with the Container for Housing Electronic Component and Electronic Device, providing due credit to the individuals responsible for this significant contribution to electronic packaging technology. Their work underpins the ability to create more durable, compact, and reliable electronic devices across a wide range of applications.","question":"Who invented Container for Housing Electronic Component and Electronic Device?"},{"answer":"The Container for Housing Electronic Component and Electronic Device (US-9852958) offers several transformative benefits for electronic device design and manufacturing:\n\n1.  **Enhanced Durability and Reliability:** The primary benefit is significantly improved mechanical robustness. By attaching the input-output (I/O) terminal to two adjacent sides of a polygonal wall, the connection point becomes far more resistant to physical stresses like impacts, vibrations, and repeated plugging/unplugging. This translates to longer device lifespans, fewer failures, and reduced warranty claims, ultimately boosting customer satisfaction and brand reputation.\n\n2.  **Optimized Space Utilization:** The clever integration of the I/O terminal at a structural corner or edge allows for more efficient use of internal volume. This enables designers to create more compact devices without sacrificing functionality, or to incorporate additional features (e.g., larger batteries, more sensors) within existing form factors. This is crucial for miniaturization trends in consumer electronics, IoT, and wearables.\n\n3.  **Superior Electrical Continuity:** The design ensures a robust and stable electrical pathway between the internal component and the exterior. By minimizing mechanical movement and providing secure insulation, the risk of intermittent connections or signal degradation is greatly reduced, leading to more consistent and reliable device performance, especially in high-frequency or sensitive applications.\n\n4.  **Improved Environmental Protection:** The dual-side attachment and integral insulation contribute to better sealing against environmental factors like dust and moisture. This can lead to higher Ingress Protection (IP) ratings, making devices suitable for harsher operating conditions, such as industrial or outdoor environments.\n\n5.  **Competitive Advantage:** For manufacturers, adopting this technology provides a strong differentiator. It enables the production of products that are not only more aesthetically pleasing due to their compactness but are also fundamentally more robust and dependable, allowing companies to capture market share in demanding segments and command premium pricing. The Container for Housing Electronic Component and Electronic Device provides a foundational improvement that impacts the entire product lifecycle.","question":"What are the key benefits of Container for Housing Electronic Component and Electronic Device?"},{"answer":"The Container for Housing Electronic Component and Electronic Device (US-9852958) distinguishes itself significantly from prior art in electronic packaging, primarily through its innovative approach to input-output (I/O) terminal integration. The key differentiating factor is its **dual-side attachment mechanism** for the I/O terminal.\n\nIn most prior art, I/O terminals are typically integrated by penetrating a *single* wall of an enclosure. This creates a localized stress point that is vulnerable to mechanical forces such as bending, shear, and pull-out. Examples include simple through-hole connectors, panel-mount jacks, or edge connectors. While these methods are common and cost-effective, they inherently compromise the structural integrity and long-term reliability of the connection, especially in rugged applications or devices subjected to frequent handling.\n\nIn contrast, the Container for Housing Electronic Component and Electronic Device specifies that its I/O terminal penetrates through a polygonal side wall and is critically attached to *two adjacent sides* of that wall. This leverages the inherent strength of a corner or an edge, where two surfaces meet and mutually reinforce each other. By distributing mechanical loads across two axes, this design offers vastly superior resistance to external stresses compared to single-point attachments. It transforms a common point of failure into a robust, structurally integrated component.\n\nFurthermore, this innovation enhances environmental sealing and optimizes internal space more effectively than many prior art solutions. While some prior art might use robust materials or additional sealing, the fundamental design of the connection point in the Container for Housing Electronic Component and Electronic Device provides an inherent, geometric advantage in both mechanical stability and electrical reliability. This makes the invention a significant departure from and improvement upon existing methods for electronic component housing and connectivity.","question":"How is Container for Housing Electronic Component and Electronic Device different from prior art?"},{"answer":"The Container for Housing Electronic Component and Electronic Device (US-9852958) is poised to have a transformative impact across a wide array of industries that rely on robust, compact, and reliable electronic devices. Its core innovation in enhancing I/O terminal durability and space efficiency addresses universal needs in modern technology.\n\n1.  **Consumer Electronics:** This patent will significantly benefit products like smartphones, tablets, laptops, and portable audio devices. It can lead to more durable charging ports, headphone jacks, and data connectors, reducing common failure points and extending product lifespans. Wearables such as smartwatches and fitness trackers will also gain from enhanced resilience against daily wear and tear.\n\n2.  **Internet of Things (IoT) and Industrial IoT (IIoT):** This is a prime beneficiary. IoT sensors and devices often operate in challenging environments—outdoors, in factories, or remote locations—where exposure to dust, moisture, vibration, and physical impacts is common. The robust I/O integration of the Container for Housing Electronic Component and Electronic Device ensures reliable data transmission and power delivery in such demanding conditions, crucial for smart cities, agriculture, and industrial automation.\n\n3.  **Automotive Electronics:** Modern vehicles are packed with sophisticated electronic control units (ECUs) and sensors. These components are subjected to constant vibration, extreme temperatures, and moisture. The enhanced durability provided by this patent can lead to more reliable infotainment systems, advanced driver-assistance systems (ADAS), and engine management units, improving vehicle safety and longevity.\n\n4.  **Medical Devices:** In the medical field, reliability is non-negotiable. Portable diagnostic equipment, patient monitoring devices, and even some implantable technologies require extremely robust and secure connections. The Container for Housing Electronic Component and Electronic Device offers a pathway to minimize failure risks in critical healthcare applications.\n\n5.  **Aerospace and Defense:** Equipment used in these sectors must withstand extreme conditions, including high G-forces, temperature fluctuations, and harsh environments. This patent's focus on structural integrity and reliable electrical continuity makes it highly relevant for mission-critical avionic and defense systems.\n\nIn essence, any industry demanding compact, high-performance electronics that must also withstand significant physical stress will find the Container for Housing Electronic Component and Electronic Device to be a foundational technology for future product development.","question":"What industries will Container for Housing Electronic Component and Electronic Device impact?"},{"answer":"The patent for \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) was filed on **2017-02-08** (February 8, 2017). The filing date marks the official submission of the patent application to the patent office, establishing the priority date for the invention.\n\nFollowing the examination process by patent examiners, which assesses novelty, inventiveness, and industrial applicability, the patent was subsequently published. The publication date for this patent is **2017-12-26** (December 26, 2017). This date typically signifies when the patent document becomes publicly accessible, allowing others to review its details and learn about the innovation. While the prompt does not specify a grant date, the publication date is often a key milestone for public awareness of a patent's existence.\n\nThese dates are important for intellectual property analysis, as they define the timeline of the patent's legal protection and its entry into the public domain of technical knowledge. The relatively quick publication after filing suggests the patent office recognized the clear innovation presented by the Container for Housing Electronic Component and Electronic Device. Understanding these dates is crucial for anyone looking to license, develop, or conduct freedom-to-operate analyses related to this electronic component housing technology.","question":"When was Container for Housing Electronic Component and Electronic Device filed/granted?"},{"answer":"The commercial applications of the \"Container for Housing Electronic Component and Electronic Device\" (US-9852958) are extensive and diverse, spanning numerous sectors due to its ability to create more robust, compact, and reliable electronic devices. Its core benefit of enhanced I/O terminal durability and space efficiency directly translates into tangible market advantages.\n\n1.  **Ruggedized Consumer Devices:** Manufacturers can develop premium smartphones, tablets, and laptops featuring significantly more durable charging ports, headphone jacks, and data connectors. This reduces warranty costs, improves customer satisfaction, and enables marketing differentiation based on superior physical resilience. Portable gaming devices and outdoor-focused gadgets also benefit greatly.\n\n2.  **Industrial and Outdoor Electronics:** This patent is ideal for industrial control systems, factory automation sensors, and outdoor monitoring equipment (e.g., smart agriculture, environmental sensors). Its ability to withstand vibration, dust, moisture, and impacts ensures reliable operation in harsh environments, reducing downtime and maintenance costs for businesses.\n\n3.  **Medical and Healthcare Devices:** Portable medical diagnostic tools, patient monitoring systems, and even some wearable health trackers require uncompromising reliability. The Container for Housing Electronic Component and Electronic Device can lead to more dependable devices where connection failure could have serious consequences, enhancing safety and trust.\n\n4.  **Automotive and Transportation:** Vehicle electronics are exposed to constant vibration, temperature extremes, and potential moisture. Implementing this technology can improve the reliability of in-car infotainment systems, advanced driver-assistance systems (ADAS), and critical engine control units, contributing to safer and more robust vehicles.\n\n5.  **Smart Home and Building Automation:** Devices like smart thermostats, security cameras, and integrated home hubs can become more robust, resisting accidental damage and ensuring long-term, reliable operation in residential and commercial settings.\n\n6.  **Wearable Technology:** For smartwatches, fitness bands, and augmented reality (AR) glasses, the patent enables sleeker designs without sacrificing durability, making these devices more comfortable, resilient, and appealing to active users. The commercial viability of the Container for Housing Electronic Component and Electronic Device lies in its foundational improvement to electronic packaging, allowing for higher quality, more reliable products across virtually every market segment that utilizes electronics.","question":"What are the commercial applications of Container for Housing Electronic Component and Electronic Device?"},{"answer":"The future developments for the Container for Housing Electronic Component and Electronic Device (US-9852958) are promising, building upon its foundational innovation in robust input-output (I/O) terminal integration. We can anticipate several directions for its evolution and application:\n\n1.  **Advanced Material Integration:** Future iterations may explore novel composite materials for both the container body and the insulator, offering even higher strength-to-weight ratios, enhanced thermal conductivity (for better heat dissipation), or specialized electrical properties (e.g., integrated EMI shielding). This could lead to enclosures that are not only more durable but also lighter and more thermally efficient.\n\n2.  **Modular and Standardized Connectors:** The principles of dual-side attachment could be extended to create standardized, modular I/O connector systems. This would allow for easier interchangeability and customization across different device platforms, accelerating product development cycles and reducing manufacturing complexity. Imagine a 'universal rugged port' standard enabled by this patent.\n\n3.  **Smart Integration and Sensing:** Future developments might embed micro-sensors directly within the I/O terminal assembly. These sensors could monitor critical parameters such as connection integrity, temperature, humidity, or even detect physical stress in real-time. This 'smart connection' could provide predictive maintenance alerts or enable adaptive performance adjustments, further enhancing device reliability and longevity.\n\n4.  **Scalability to Micro- and Nano-Electronics:** As electronics continue to miniaturize, the principles of the Container for Housing Electronic Component and Electronic Device could be adapted for micro- and nano-scale component packaging. This would be crucial for future advancements in biomedical implants, advanced MEMS devices, and quantum computing components, where even microscopic connections require extreme robustness.\n\n5.  **Integration with Wireless Charging/Data:** While focused on physical terminals, the robust housing could also be designed to seamlessly integrate with advanced wireless charging coils or high-speed wireless data transfer modules, providing a comprehensive, durable, and future-proof connectivity solution. The Container for Housing Electronic Component and Electronic Device thus serves as a critical enabler for the next generation of highly resilient and intelligent electronic systems.","question":"What are the future developments expected for Container for Housing Electronic Component and Electronic Device?"}],"topics":["electronic component housing","I/O terminal integration","polygonal sidewall design","robust electronics","compact devices","landscape","modern","electronics"],"tech_cluster":null},"seo":{"title":"Container for Housing Electronic Component and Electronic Device - Patent US-9852958","description":"Discover the Container for Housing Electronic Component and Electronic Device patent, revolutionizing electronic component housing with robust, space-saving I/O integration. Explore its technical brilliance and market potential.","keywords":["electronic component housing","I/O terminal integration","polygonal sidewall design","robust electronics","compact devices","electrical continuity","patent US-9852958","Container for Housing Electronic Component and Electronic Device","electronic device packaging","miniaturization","device durability","tech patent"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852958","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852958","citation_suggestion":"Patentable. \"Container for housing electronic component and electronic device\" (US-9852958). https://patentable.app/patents/US-9852958","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852958","json":"https://patentable.app/api/llm-context/US-9852958","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:46:10.611Z"}