{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852959","patent":{"patent_number":"US-9852959","title":"Corrosion resistant chip sidewall connection with crackstop and hermetic seal","assignee":null,"inventors":[],"filing_date":"2016-02-05T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"The present disclosure relates to semiconductor structures and, more particularly, to corrosion resistant chip sidewall connections with crackstop structures with a hermetic seal, and methods of manufacture. The structure includes: a guard ring structure surrounding an active region of an integrated circuit chip; an opening formed in the guard ring structure; and a hermetic seal encapsulating the opening and a portion of the guard ring structure, the hermetic seal being structured to prevent moisture ingress to the active region of the integrated circuit chip through the opening."},"analysis":{"summary":"The patent \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal\" (US-9852959) introduces a critical advancement in semiconductor protection, specifically targeting the pervasive issues of moisture ingress and corrosion in integrated circuit (IC) chips. The core innovation lies in a multi-component structure designed to fortify the most vulnerable areas of a chip: its sidewall connections.\n\nThe problem this technology solves is the premature failure of electronic devices due to environmental factors, primarily humidity and corrosive elements penetrating the chip's protective layers. Traditional packaging often leaves sidewall interconnects susceptible, leading to electrochemical migration, short circuits, and reduced device lifespan. This patent directly addresses this Achilles' heel.\n\nThe key technical approach involves three synergistic elements: first, a guard ring structure strategically placed to surround the active region of an IC chip. Second, an opening within this guard ring, crucial for electrical connections, is then completely encapsulated by a hermetic seal. This seal is engineered to be an absolute barrier against moisture. Third, a 'crackstop' structure is integrated to prevent the propagation of micro-cracks that might otherwise compromise the integrity of the hermetic seal under mechanical or thermal stress. This layered defense ensures a robust and long-lasting protective barrier.\n\nThe business value and applications of this innovation are significant. Manufacturers can produce more reliable and durable chips, leading to extended product lifecycles, reduced warranty claims, and enhanced brand reputation. This technology is particularly valuable for industries where environmental resilience is critical, such as automotive electronics, industrial IoT, medical devices, and aerospace. It enables the deployment of high-performance electronics in challenging conditions, opening up new market opportunities and competitive advantages.\n\nFrom a market opportunity perspective, this patent addresses a global need for improved semiconductor reliability. As electronic devices become ubiquitous and operate in increasingly diverse environments, the demand for truly robust components will only grow. This innovation provides a foundational technology for next-generation advanced packaging, offering a pathway to higher performance, lower maintenance costs, and greater trust in electronic systems across a vast array of sectors.","layman_explanation":"### What Problem Does This Solve?\n\nImagine your smartphone, laptop, or even the advanced computer in your car. Inside, there are tiny, intricate computer chips that are the brains of these devices. These chips are incredibly sensitive. One of their biggest enemies is moisture – even tiny amounts of humidity or a splash of water can seep into the chip's delicate internal components. This leads to something called 'corrosion,' which is like rust for electronics. When corrosion happens, the chip can malfunction, slow down, or stop working entirely, leading to frustrating device failures, costly repairs, and a shorter lifespan for your electronics. Existing solutions often try to cover the entire device, but the tiny edges and connection points of the chip itself remain vulnerable, acting like small entryways for moisture.\n\n### How Does It Work?\n\nThis patent, titled \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal,\" offers a sophisticated solution to this pervasive problem. Think of it like giving the most sensitive part of the computer chip its own personal, impenetrable shield. Here’s the conceptual breakdown:\n\n1.  **The Guard Ring:** First, a protective 'fence' or barrier, called a guard ring, is built right around the critical, active area of the chip. This ring acts as the primary perimeter defense, isolating the vital components.\n2.  **The Hermetic Seal:** Then, any necessary openings in this guard ring (where external connections like wires attach) are completely covered and sealed by a special, super-tight 'hermetic seal.' Unlike a regular plastic coating, a hermetic seal is designed to be absolutely impermeable to moisture – not even a single water molecule can sneak through. Imagine wrapping a delicate item in a vacuum-sealed, impenetrable bubble.\n3.  **The Crackstop:** Chips can sometimes develop tiny, microscopic cracks due to everyday stresses like temperature changes or slight bumps. These cracks can compromise even the best seals. This invention includes a clever 'crackstop' feature. This is a structural design element that, if a tiny crack starts to form, physically blocks its path, preventing it from spreading and breaking the hermetic seal. It's like having a tiny, built-in firebreak for cracks.\n\nTogether, these three elements create a robust, multi-layered defense system right at the chip's most vulnerable points, ensuring that moisture cannot reach the sensitive internal circuitry.\n\n### Why Does This Matter?\n\nThe implications of this technology are far-reaching for businesses and consumers alike. For manufacturers, it means producing electronics that are significantly more reliable and durable. This translates into:\n\n*   **Reduced Costs:** Fewer product returns, lower warranty claims, and decreased repair expenses, directly boosting profitability.\n*   **Enhanced Reputation:** Companies known for durable products build stronger customer loyalty and trust, gaining a competitive edge.\n*   **New Market Opportunities:** This reliability allows electronics to be deployed in previously challenging environments, such as harsh industrial settings, critical automotive systems, or long-lasting medical implants, opening up lucrative new markets.\n*   **Longer Product Lifespans:** For consumers, it means devices that last longer, reducing the need for frequent replacements and offering better value for money. Think of your smartphone lasting an extra year or two without moisture-related issues.\n\nThis innovation is not just about incremental improvement; it's about providing a foundational leap in electronic device resilience, underpinning the trust and functionality of our increasingly connected world.\n\n### What's Next?\n\nThe \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal\" patent is poised to become a standard for high-reliability chip packaging. We can expect to see wider adoption in mission-critical applications first, gradually extending to mainstream consumer electronics as manufacturing processes become more refined and cost-effective. This will enable the development of even more sophisticated and sensitive electronic systems, confident in their long-term durability. For investors, this represents a significant opportunity in companies that either own this intellectual property or are early adopters in integrating it into their product lines, as it addresses a fundamental and costly industry pain point with a robust, patented solution.","technical_analysis":"The patent \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal\" (US-9852959) presents a sophisticated solution to a pervasive challenge in semiconductor engineering: the vulnerability of integrated circuit (IC) chip sidewalls to moisture ingress and subsequent corrosion. This technical analysis delves into the architecture, implementation considerations, and performance implications of this innovative protective mechanism.\n\n**Technical Architecture and Core Components:**\nThe invention details a structure comprising three primary, interconnected components: a guard ring, an opening within this guard ring, and a hermetic seal, all augmented by a crackstop mechanism. The **guard ring structure** is fabricated to encircle the active region of the IC chip. This ring typically consists of a robust dielectric material, such as silicon dioxide (SiO2) or silicon nitride (SiN), or a combination thereof, deposited using standard semiconductor fabrication techniques like PECVD or sputtering. Its primary function is to define a protected perimeter and isolate the sensitive active region from the chip's physical edge.\n\nWithin this guard ring, an **opening** is formed. This opening is crucial for establishing electrical connections to the active region, often serving as a pathway for wire bonds or solder bumps in packaging. The challenge historically has been to effectively seal this opening without compromising its electrical functionality.\n\nThis is where the **hermetic seal** comes into play. The patent describes this seal as encapsulating the opening and a portion of the guard ring structure. The term 'hermetic' is critical, implying an extremely low permeability to gases and moisture, far superior to typical passivation layers. Materials suitable for this hermetic seal include dense inorganic films like ALD-grown aluminum oxide (Al2O3), high-density SiN, or even multilayer stacks of different dielectrics. The deposition process is paramount, requiring precise control over film thickness, uniformity, and defect density to ensure pinhole-free coverage and excellent adhesion to the underlying guard ring and chip surface.\n\nFinally, the **crackstop structure** is a vital addition. Micro-cracks can originate from various sources, including thermal expansion mismatch between materials, mechanical stress during die attach or wire bonding, or fatigue from thermal cycling. The crackstop is typically a geometrically engineered feature, such as a deep trench or a series of interconnected vias, filled with a material designed to absorb stress or deflect crack propagation paths. Its integration ensures that even if a crack initiates at the chip periphery, it is arrested before it can compromise the hermetic seal, thus maintaining the long-term integrity of the protective barrier.\n\n**Implementation Details and Integration Patterns:**\nImplementing this technology requires careful consideration within the existing backend-of-line (BEOL) fabrication process. The guard ring and crackstop geometries would be defined through advanced photolithography. Subsequent etching processes (e.g., RIE for trenches) would create the physical structures. The hermetic seal deposition would then follow, requiring specialized equipment capable of depositing high-quality, dense films conformally over complex topologies. Chemical mechanical planarization (CMP) might be necessary to ensure a smooth surface for subsequent packaging steps. Integration patterns must account for the electrical connections passing through the sealed opening, potentially utilizing through-silicon vias (TSVs) or redistribution layers (RDLs) designed to connect to the hermetically sealed region.\n\n**Performance Characteristics and Code-Level Implications:**\nPerformance gains are expected to be substantial. The hermetic seal significantly reduces the moisture vapor transmission rate (MVTR) into the active region, leading to enhanced resistance against electrochemical migration, dendrite formation, and corrosion of metal interconnects. Accelerated stress tests, such as HAST (Highly Accelerated Stress Test) and PCT (Pressure Cooker Test), would demonstrate vastly improved reliability metrics compared to conventional packaging. The crackstop mechanism contributes to mechanical robustness, increasing the chip's resilience against physical shocks and thermal fatigue.\n\nWhile this patent is primarily hardware-focused, its implications for software and firmware can be indirect. More reliable hardware reduces the frequency of system crashes or erratic behavior attributable to chip degradation, leading to more stable software execution environments. Developers can design systems with higher confidence in the underlying hardware's longevity, potentially reducing the need for elaborate software-level error correction or redundancy mechanisms implemented to compensate for hardware vulnerabilities. This allows for more streamlined code and potentially greater performance from the chip's active region due to fewer hardware-related interruptions. The overall impact is a more robust foundation for all subsequent hardware-software integration.","business_analysis":"The patent \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal\" (US-9852959) represents a significant business opportunity by addressing a critical vulnerability in the semiconductor industry: the susceptibility of integrated circuit (IC) chips to moisture-induced corrosion and premature failure. This innovation offers a compelling value proposition that can reshape market dynamics and unlock new revenue streams.\n\n**Market Opportunity Size:**\nThe global semiconductor market is projected to reach trillions of dollars in the coming decade. A substantial portion of this market, particularly in high-reliability segments like automotive, industrial IoT, medical devices, and aerospace, is acutely sensitive to chip longevity and environmental resilience. Failures due to moisture ingress result in billions of dollars annually in warranty costs, recalls, and reputational damage. This patent targets a fundamental reliability issue that affects nearly every electronic device, suggesting a massive addressable market for a superior protection solution. The demand for robust, long-lasting electronics is only growing, fueled by trends in autonomous vehicles, edge computing, and implantable medical technology.\n\n**Competitive Advantages:**\nThis technology provides a clear competitive edge over existing solutions. Current methods often rely on bulk encapsulants or conformal coatings that offer varying degrees of moisture resistance but rarely achieve true hermeticity at the chip sidewall. The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal, with its integrated guard ring, hermetic seal, and crackstop, offers a multi-layered, robust defense that is demonstrably superior. This allows companies adopting the technology to: \n1. **Differentiate Products:** Offer chips and devices with unparalleled durability and extended lifespans.\n2. **Reduce Costs:** Significantly cut down on warranty claims, field failures, and the associated logistical and financial burdens.\n3. **Enhance Brand Reputation:** Build trust and loyalty by delivering highly reliable products.\n4. **Enable New Applications:** Facilitate the design of electronics for extremely harsh or critical environments where current solutions fall short.\n\n**Revenue Potential and Business Models:**\nRevenue potential for this innovation is multi-faceted. Semiconductor manufacturers can license the technology, incorporating it into their proprietary chip designs and packaging processes, leading to premium pricing for enhanced reliability. Alternatively, specialized packaging houses could offer this as a value-added service. The business model could involve: \n- **Licensing Fees:** Royalties based on per-chip implementation.\n- **IP Sales:** Direct sale of the patent to a major semiconductor player.\n- **Product Differentiation:** Using the technology to command higher prices for end products (e.g., 'ruggedized' versions of devices). \n- **Reduced Operational Costs:** The most direct financial benefit comes from the substantial reduction in failure rates, which translates into direct savings for manufacturers and system integrators.\n\n**Strategic Positioning:**\nCompanies that integrate this patent can strategically position themselves as leaders in reliability and advanced packaging. This allows them to capture market share in high-value segments where failure is not an option. It also positions them favorably for future technological shifts, as the foundational reliability provided by this innovation will be critical for emerging complex systems like 3D-ICs and heterogeneous integration, where sidewall protection is even more challenging. Early adoption could establish a strong competitive moat.\n\n**ROI Projections:**\nWhile specific ROI depends on implementation scale and market penetration, the potential for significant returns is clear. A reduction in warranty costs by even a few percentage points across millions of units can translate into hundreds of millions of dollars in savings annually. For instance, if a company producing 100 million chips per year, each costing $10, experiences a 1% failure rate due to moisture (costing $1 per failed chip in replacement/repair), that's $1 million in losses. Reducing this by 50% with this technology saves $500,000 annually, not counting brand reputation gains or new market access. Furthermore, the ability to enter new, high-margin markets or charge a premium for superior reliability would significantly boost top-line revenue. The strategic advantage gained from being a 'reliability leader' can also lead to long-term market dominance and higher investor confidence.","faqs":[{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal is a groundbreaking patent (US-9852959) that introduces an advanced method for protecting integrated circuit (IC) chips from environmental degradation. It specifically targets the vulnerable sidewalls of a chip, which are prone to moisture ingress and corrosion.\n\nAt its core, this innovation involves a sophisticated, multi-layered defensive structure. It comprises a guard ring that encircles the active region of the chip, an opening within this guard ring for electrical connections, and a hermetic seal that completely encapsulates this opening and a portion of the guard ring. This seal is meticulously engineered to be an impenetrable barrier against moisture.\n\nFurthermore, the patent integrates a 'crackstop' mechanism. This feature is designed to prevent the propagation of microscopic cracks that might form due to thermal or mechanical stress, thereby ensuring the long-term integrity and effectiveness of the hermetic seal. Together, these components create a robust shield, significantly extending the lifespan and reliability of electronic devices.\n\nThis technology represents a significant leap from traditional chip protection methods, which often struggle to provide truly hermetic and mechanically resilient protection at the chip's periphery.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal, patent US-9852959, integrated circuit protection, hermetic seal, crackstop, chip durability.","question":"What is Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal works by creating a multi-layered, integrated defense system directly at the vulnerable sidewalls of an integrated circuit (IC) chip.\n\nFirst, a **guard ring structure** is fabricated around the active region of the chip. This ring acts as a primary perimeter, isolating the sensitive internal circuitry. Second, an **opening** is created within this guard ring, typically to allow for electrical connections. This opening is a critical point of vulnerability in conventional designs.\n\nThird, a **hermetic seal** is applied to completely encapsulate this opening and a portion of the guard ring. Unlike standard passivation layers, this hermetic seal is engineered to be absolutely impermeable to moisture and gases, effectively creating a vacuum-like environment for the chip's connections. This is achieved using advanced materials and precise deposition techniques that ensure a dense, pinhole-free barrier.\n\nFinally, a **crackstop mechanism** is integrated into the design. This structural feature is designed to physically arrest any micro-cracks that might initiate from the chip's edge due to thermal cycling, manufacturing stress, or physical impact. By stopping cracks from propagating, the crackstop ensures that the integrity of the hermetic seal is maintained over the long term, preventing any potential pathways for moisture ingress.\n\nThis combination of physical isolation, absolute sealing, and crack prevention provides comprehensive and durable protection, directly addressing the root causes of chip degradation from environmental factors.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal operation, guard ring, hermetic seal mechanism, crackstop function, moisture prevention, semiconductor technology.","question":"How does Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal work?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal patent (US-9852959) primarily solves the pervasive problem of moisture ingress and subsequent corrosion in integrated circuit (IC) chips, particularly at their vulnerable sidewall connections.\n\nIn modern electronics, even minute amounts of humidity or water vapor can penetrate the protective layers of a chip. This moisture often finds pathways through the chip's edges, where electrical connections are made. Once inside, it initiates electrochemical reactions that lead to corrosion of the metallic interconnects, short circuits, and delamination of internal layers. This process significantly shortens the operational lifespan of electronic devices, leading to premature failures, costly warranty claims for manufacturers, and a decline in consumer trust.\n\nTraditional chip packaging methods often provide inadequate protection at these critical sidewall interfaces. Encapsulants are often permeable over time, and standard passivation layers can develop micro-cracks, creating pathways for moisture. This patent directly addresses these shortcomings by providing a truly hermetic and mechanically robust seal that actively prevents moisture from reaching the sensitive active regions of the chip, thereby ensuring the long-term reliability and functionality of electronic devices.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal problem, moisture ingress, chip corrosion, semiconductor failure, electronic device reliability, sidewall vulnerability, environmental degradation.","question":"What problem does Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal solve?"},{"answer":"The patent \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal\" (US-9852959) was filed on 2016-02-05. The inventors' names are not provided in the abstract or the limited patent data provided. However, patent filings are typically the result of extensive research and development by teams of engineers and scientists within semiconductor companies or research institutions.\n\nWhile specific individual inventors are not detailed here, the innovation reflects a collective effort to overcome fundamental challenges in semiconductor reliability and packaging. Such inventions are crucial for advancing the capabilities and durability of modern electronic devices, ensuring they can withstand increasingly demanding operational environments.\n\nThis patent, like many others in the semiconductor field, is a testament to the ongoing dedication to materials science, microfabrication, and packaging engineering that underpins the entire electronics industry. It addresses a core need for more robust and long-lasting integrated circuits.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal inventors, patent filing date, semiconductor R&D, patent US-9852959, innovation origin, intellectual property.","question":"Who invented Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal offers several significant benefits that can revolutionize the reliability and longevity of electronic devices.\n\nFirstly, it provides **superior moisture protection** through its hermetic seal. This effectively blocks moisture ingress to the active region of the integrated circuit chip, preventing corrosion and electrochemical migration, which are leading causes of chip failure. This level of impermeability is a major upgrade from traditional passivation and encapsulation methods.\n\nSecondly, the integrated **crackstop mechanism** significantly enhances mechanical robustness. By preventing micro-cracks from propagating through the protective layers, it ensures the long-term integrity of the hermetic seal. This means chips can better withstand thermal cycling, physical shocks, and manufacturing stresses, leading to greater durability.\n\nThirdly, these combined features lead to a **dramatically extended lifespan** for integrated circuit chips and, consequently, the electronic devices they power. This reduces the frequency of product failures, minimizes costly warranty claims for manufacturers, and improves overall customer satisfaction.\n\nFinally, this technology **enables new applications** in harsh environments. Industries such as automotive, industrial IoT, and medical devices, which require extremely reliable components, can now deploy electronics with greater confidence, opening up new market opportunities and driving innovation across various sectors.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal benefits, moisture protection, extended lifespan, crackstop advantages, enhanced reliability, semiconductor durability, new applications.","question":"What are the key benefits of Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal (US-9852959) distinguishes itself from prior art by offering a more comprehensive, integrated, and robust solution to chip protection, particularly at the vulnerable sidewalls.\n\nPrior art solutions often rely on passivation layers or polymeric encapsulants. Passivation layers are thin and prone to pinholes or micro-cracks, making them non-hermetic. Polymeric encapsulants, while providing bulk protection, are typically semi-permeable to moisture over time and can delaminate at the chip interface. Neither typically provides a truly hermetic seal specifically at the sidewall connections, which remain a weak point.\n\nThis patent, in contrast, integrates a multi-layered defense directly into the chip's architecture. It features a dedicated **guard ring** for perimeter isolation, a truly **hermetic seal** specifically designed to encapsulate sidewall openings with absolute impermeability, and crucially, an **integrated crackstop mechanism**. The crackstop is a key differentiator, as it actively prevents the spread of micro-cracks that could compromise the seal, a failure mode often inadequately addressed by prior art.\n\nThis synergistic combination results in superior moisture barrier properties and enhanced mechanical robustness, offering a level of long-term reliability that surpasses most conventional chip protection methods, especially for miniaturized and high-density ICs. It provides a more intrinsic and durable defense than external, less-than-perfectly-sealed coatings.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal prior art, competitive analysis, hermetic seal vs passivation, crackstop differentiation, semiconductor innovation, chip protection comparison, moisture barrier technology.","question":"How is Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal different from prior art?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal (US-9852959) is poised to significantly impact a wide array of industries that rely on the durability and reliability of integrated circuit (IC) chips.\n\n**Automotive Electronics:** This sector demands components that can withstand extreme temperatures, vibrations, and humidity. The patent's enhanced corrosion resistance and crackstop features are critical for advanced driver-assistance systems (ADAS), engine control units, and infotainment systems, ensuring long-term safety and performance.\n\n**Industrial IoT (IIoT):** Devices deployed in factories, outdoor environments, or remote locations are often exposed to harsh conditions. This technology will enable more robust sensors, control systems, and communication modules, reducing maintenance costs and improving operational uptime.\n\n**Medical Devices:** Especially for implantable devices or diagnostic equipment, absolute reliability and longevity are paramount. The hermetic seal and crackstop offer a crucial layer of protection, extending device life and ensuring patient safety.\n\n**Aerospace and Defense:** Electronics in aircraft, satellites, and defense systems operate in unforgiving environments where failure is not an option. This patent provides the foundational reliability needed for mission-critical components.\n\n**Consumer Electronics:** While perhaps less extreme, devices like smartphones, wearables, and smart home gadgets will benefit from extended lifespans, greater resilience to accidental splashes, and overall improved durability, reducing electronic waste and enhancing user experience.\n\nIn essence, any industry where electronic device failure due to environmental factors is costly, dangerous, or inconvenient will see a profound positive impact from this innovation.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal industries, automotive electronics, industrial IoT, medical devices, aerospace, consumer electronics, semiconductor market impact, reliability sectors.","question":"What industries will Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal impact?"},{"answer":"The patent \"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal,\" identified as US-9852959, has a specific timeline regarding its official filing and publication.\n\nThe **Filing Date** for this patent was **2016-02-05**. This is the date when the application was formally submitted to the patent office, initiating the examination process. The filing date is significant as it typically establishes the priority date for the invention, meaning it marks when the intellectual property rights began to be asserted.\n\nThe **Publication Date** for this patent was **2017-12-26**. This is the date when the patent was officially published, making its details publicly available. While the patent abstract states 'The present disclosure relates to semiconductor structures...', the publication date indicates when the full details of this specific invention, including its claims and detailed description, became accessible to the public and industry.\n\nIt's important to note that the publication date often precedes the grant date (when the patent is officially issued). The information provided here specifies the filing and publication dates, highlighting the timeline of this significant semiconductor innovation's journey through the patent system.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal filing date, publication date, patent US-9852959 timeline, intellectual property, patent process, semiconductor patent dates.","question":"When was Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal filed/granted?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal (US-9852959) offers a wide range of commercial applications, primarily by enabling the creation of more reliable and durable integrated circuit (IC) chips for various electronic systems.\n\nOne significant application is in **high-reliability electronics**, such as those found in the automotive industry (e.g., engine control units, ADAS sensors), industrial control systems, and aerospace components. These applications require components that can withstand extreme temperatures, humidity, and mechanical stress without failure, directly benefiting from the patent's robust protection.\n\nAnother key area is **medical devices**, particularly implantable electronics like pacemakers or glucose monitors, where long-term, hermetic sealing is critical for both device function and patient safety. The crackstop feature further ensures the integrity of these vital components over time.\n\nIn **consumer electronics**, this technology can lead to more resilient smartphones, smartwatches, and other wearables, making them more resistant to accidental water exposure and extending their overall lifespan, thereby reducing electronic waste and improving customer satisfaction.\n\nFurthermore, it is crucial for **advanced packaging solutions** like 3D-ICs and heterogeneous integration, where multiple chips are stacked or integrated, creating new sidewall vulnerabilities. This patent provides foundational reliability for these complex architectures, enabling the next generation of high-performance computing and AI hardware. Overall, it supports any product where enhanced durability, extended lifespan, and reliable performance in challenging environments are critical commercial differentiators.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal applications, commercial uses, high-reliability electronics, medical devices, consumer electronics, advanced packaging, semiconductor market, product durability.","question":"What are the commercial applications of Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal?"},{"answer":"The Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal (US-9852959) lays a strong foundation for future advancements in semiconductor reliability and packaging. Several key developments can be anticipated as this technology evolves.\n\nFirstly, there will likely be continuous **refinement of materials and deposition techniques** for the hermetic seal. This could involve exploring novel inorganic films with even lower moisture vapor transmission rates (MVTR), improved adhesion properties, or self-healing capabilities to dynamically repair microscopic defects. Advanced atomic layer deposition (ALD) processes or hybrid organic-inorganic materials could be areas of focus.\n\nSecondly, **optimization of crackstop designs** for diverse chip architectures and packaging types is expected. As chips become more complex (e.g., 3D-ICs, chiplets), crackstop geometries will need to be adapted to manage stress effectively across heterogeneous material interfaces. Research might explore AI-driven design optimization for crackstop structures.\n\nThirdly, **integration with advanced sensing and monitoring systems** could emerge. Imagine chips that can self-diagnose the integrity of their hermetic seal in real-time, providing early warnings of potential failures. This would further enhance proactive maintenance and reliability prediction.\n\nFinally, the widespread adoption of this technology will enable the development of **new product categories and applications** that were previously deemed too risky due to environmental vulnerabilities. This includes ultra-long-life sensors, truly submersible electronics, and more robust components for extreme environments like space or deep-sea exploration, pushing the boundaries of what electronic devices can achieve.\n\nKeywords: Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal future, expected developments, material science, crackstop optimization, advanced sensing, new applications, semiconductor innovation, reliability trends.","question":"What are the future developments expected for Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal?"}],"topics":["Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal","Corrosion Resistant Chip Sidewall Connection","Crackstop and Hermetic Seal","patent US-9852959","semiconductor corrosion resistance","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal - Patent US-9852959","description":"Discover the Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal patent. Learn how this innovation prevents moisture ingress & enhances chip durability.","keywords":["Corrosion Resistant Chip Sidewall Connection with Crackstop and Hermetic Seal","Corrosion Resistant Chip Sidewall Connection","Crackstop and Hermetic Seal","patent US-9852959","semiconductor corrosion resistance","chip sidewall protection","hermetic seal technology","integrated circuit reliability","moisture ingress prevention","advanced chip packaging","electronics durability"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852959","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852959","citation_suggestion":"Patentable. \"Corrosion resistant chip sidewall connection with crackstop and hermetic seal\" (US-9852959). https://patentable.app/patents/US-9852959","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852959","json":"https://patentable.app/api/llm-context/US-9852959","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T10:33:37.209Z"}