{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852960","patent":{"patent_number":"US-9852960","title":"Underfill dispensing using funnels","assignee":null,"inventors":[],"filing_date":"2016-03-17T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate."},"analysis":{"summary":"The patent Underfill Dispensing Using Funnels (US-9852960) introduces a groundbreaking method and system for achieving void-free underfill layers in advanced electronic packaging. Its core innovation lies in precisely forming a uniform, protective underfill material layer between a substrate and an array of multiple objects, such as semiconductor chips, ensuring complete encapsulation without air pockets.\n\nThe primary problem this invention solves is the pervasive issue of voids within underfill material. These microscopic air bubbles in traditional underfill processes significantly compromise the structural integrity, thermal management, and long-term reliability of electronic components, leading to solder joint fatigue, delamination, and premature device failures. As electronic devices become more compact and complex, the challenge of achieving defect-free underfill has intensified, directly impacting manufacturing yields and product lifespans.\n\nThe key technical approach described by this patent involves methods and systems that facilitate the formation of this void-free layer. While the abstract mentions 'funnels' conceptually, the essence is a highly controlled dispensing mechanism that ensures the underfill material completely fills the intricate spaces beneath arrayed objects. This precise application prevents air entrapment, allowing the material to cure into a robust, protective layer that provides superior structural support to the critical connections between the objects and the substrate.\n\nFrom a business perspective, the Underfill Dispensing Using Funnels patent offers substantial value. It enables manufacturers to significantly enhance the reliability and durability of their electronic products, reducing warranty claims and improving customer satisfaction. The technology can lead to higher manufacturing yields by minimizing defects related to underfill, thereby lowering production costs and accelerating time-to-market. Its applications are broad, impacting high-reliability sectors like automotive, aerospace, medical devices, and high-performance computing, where component failure is not an option.\n\nThe market opportunity for this innovation is considerable, given the universal need for enhanced reliability in the ever-growing electronics industry. Companies adopting this technology can gain a significant competitive advantage by offering more robust and long-lasting products, solidifying their position in a fiercely competitive landscape. This patent represents a critical step forward in addressing fundamental packaging challenges, paving the way for the next generation of more powerful and reliable electronic devices.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you're building a very intricate model, say, a tiny city made of delicate components. To make sure everything stays together and can withstand bumps and shakes, you'd use a special kind of protective glue. In the world of microelectronics, this 'glue' is called 'underfill,' and it's essential for protecting the tiny electrical connections between a computer chip (like the brain of your phone) and the circuit board it sits on. The big problem? Sometimes, when this underfill material is applied, tiny air bubbles get trapped inside. These bubbles are like weak spots in your model's glue. Over time, these weak spots can lead to cracks, breaks, or even complete failure of the chip, causing your expensive phone or car electronics to stop working prematurely. This not only frustrates consumers but also costs manufacturers billions in warranty claims and reputation damage.\n\n### How Does It Work?\n\nThe patent Underfill Dispensing Using Funnels tackles this exact problem with a clever, precise approach. Instead of traditional methods that might just squeeze the underfill material into place, this innovation describes a system designed to ensure the underfill flows perfectly, leaving no room for air bubbles. Think of it like a highly sophisticated watering system for your tiny city. Instead of just spraying water haphazardly (which would create air pockets), this system uses 'invisible funnels' or guided paths to ensure the water flows smoothly and completely into every nook and cranny. For underfill, this means the material is meticulously guided between the chip and the circuit board. It essentially pushes all the air out as it fills the space, ensuring a solid, uniform, and 'void-free' layer. Once this perfect layer is in place, it's cured (hardened) to form a robust shield that provides exceptional structural support, making the connections between the chip and the board incredibly strong and resilient.\n\n### Why Does This Matter?\n\nThis innovation matters immensely because it directly addresses a fundamental vulnerability in modern electronics manufacturing. For businesses, this translates into several key advantages:\n\n*   **Increased Reliability:** Products built with this technology will be significantly more durable and less prone to failure, especially under stress from heat, cold, or physical impact. This is critical for industries like automotive (self-driving cars need to be ultra-reliable), medical devices (life-saving equipment can't fail), and consumer electronics (who wants their new phone to break in a year?).\n*   **Cost Savings:** Fewer product failures mean fewer warranty claims, less rework on the production line, and lower scrap rates. These savings can run into millions, if not billions, for large manufacturers.\n*   **Competitive Edge:** Companies adopting this patented approach can offer superior products, gaining a significant advantage over competitors still struggling with traditional underfill issues. It allows them to meet stricter quality standards and build a reputation for excellence.\n*   **Market Expansion:** With higher reliability, electronics can be deployed in more demanding environments or for longer lifecycles, opening up new market opportunities.\n\n### What's Next?\n\nThe Underfill Dispensing Using Funnels patent represents a foundational improvement that will likely become a standard in high-end electronics manufacturing. We can expect to see its principles integrated into next-generation dispensing equipment, enabling even finer pitch components and more complex 3D chip stacking. As electronics continue to miniaturize and integrate more functions into smaller packages, the need for perfect underfill will only grow. This innovation will play a crucial role in enabling those advancements, leading to more robust, powerful, and long-lasting devices across every sector of technology. For investors, this signals a clear trend towards quality and reliability driving market value in the semiconductor industry.","technical_analysis":"The patent Underfill Dispensing Using Funnels (US-9852960) presents a significant technical advancement in the field of microelectronic packaging, specifically addressing the critical issue of underfill integrity. The invention describes methods and systems for forming a 'void-free layer of underfill material' between a substrate and an array of multiple objects, which are subsequently cured to provide structural support to interconnections.\n\n**Technical Architecture and Problem Statement:**\nModern electronic packages, particularly flip-chip and chip-scale packages (CSPs), rely on underfill encapsulants to provide mechanical coupling, stress distribution, and environmental protection for solder bumps or copper pillars. The primary technical challenge is the consistent formation of a defect-free underfill layer. Traditional underfill processes, which typically involve dispensing a bead of viscous liquid and relying on capillary action, are highly susceptible to trapping air bubbles (voids). These voids compromise the mechanical strength, thermal conductivity, and dielectric properties of the underfill, leading to premature failures like solder joint fatigue, delamination, and crack propagation, especially under thermal cycling or mechanical stress. The patent aims to overcome these inherent limitations by ensuring a truly void-free application.\n\n**Implementation Details and Algorithm Specifics:**\nWhile the abstract uses the term 'funnels' conceptually, the technical implementation likely involves a sophisticated dispensing system that precisely controls the flow and spread of the underfill material. This could manifest in several ways:\n\n1.  **Precision Dispensing Head:** A specialized nozzle or applicator head designed to create a localized, controlled environment for material delivery. This 'funnel' could be a physical micro-channel or a dynamic pressure field that guides the underfill front.\n2.  **Optimized Dispensing Parameters:** The system would employ algorithms to precisely control dispensing speed, material volume, dispense pattern, and temperature. For arrays of objects, the dispensing path would be meticulously calculated to ensure sequential and complete filling of each inter-component gap without entrapping air. This might involve multi-pass dispensing or specific corner-fill strategies.\n3.  **Vacuum-Assisted Dispensing:** In some advanced systems, a localized vacuum might be integrated into the dispensing head or chamber to actively remove air ahead of the underfill front, ensuring complete wetting and void elimination.\n4.  **Material Rheology Management:** The system would likely incorporate precise temperature control for the underfill material to maintain optimal viscosity and flow characteristics throughout the dispensing process, crucial for consistent capillary action and void prevention.\n5.  **Real-time Monitoring:** Advanced implementations could include in-situ optical or acoustic sensors to monitor the underfill flow front and detect potential void formation in real-time, allowing for immediate process adjustments.\n\n**Integration Patterns and Performance Characteristics:**\nThis technology integrates seamlessly into existing semiconductor assembly lines. The dispensing system would typically be placed after the chip-attach process and before the final curing step. Its primary integration points would be:\n\n*   **Automated Material Handling:** Robotic systems to pick and place substrates and components.\n*   **Vision Systems:** For precise alignment of the dispensing head relative to the array of objects.\n*   **Curing Ovens:** Post-dispensing, the void-free underfill layer is cured, often using thermal or UV processes, to form a solid, protective encapsulant.\n\nThe performance characteristics of a system based on this patent would be marked by:\n\n*   **Near 100% Void-Free Underfill:** The primary metric, leading to significantly improved package reliability.\n*   **High Throughput:** Optimized dispensing patterns and speeds for array processing maintain or improve production rates.\n*   **Process Repeatability:** Consistent quality across large batches of components, reducing variability.\n*   **Enhanced Reliability:** Direct translation to improved package drop test performance, thermal cycle endurance, and moisture resistance.\n\n**Code-Level Implications:**\nFor engineers developing such a system, code-level implications would include:\n\n*   **Advanced Motion Control Algorithms:** Precisely orchestrating multi-axis robotic movement for dispensing heads.\n*   **Fluid Dynamics Simulation:** Software models to predict underfill flow behavior in complex geometries, optimizing dispensing parameters.\n*   **Sensor Data Fusion:** Integrating data from vision systems, pressure sensors, and temperature probes for real-time process control and feedback loops.\n*   **Recipe Management Systems:** Software to manage and optimize dispensing parameters for different chip sizes, substrate materials, and underfill chemistries.\n\nIn essence, the Underfill Dispensing Using Funnels patent provides a robust technical framework for overcoming one of the most persistent reliability challenges in microelectronics, paving the way for more durable and high-performing electronic devices.","business_analysis":"The patent Underfill Dispensing Using Funnels (US-9852960) introduces a pivotal innovation in semiconductor packaging, presenting significant commercial applications and market implications for the electronics industry. This invention’s core value proposition revolves around enhancing the reliability and structural integrity of electronic components by ensuring a void-free underfill layer.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion dollar industry, driven by increasing demand for smaller, more powerful, and more reliable electronic devices across various sectors. The underfill material market alone is substantial and growing, as virtually all advanced packages (flip-chip, CSP, WLP, 3D ICs) require underfill. The persistent challenge of underfill voids represents a significant pain point for manufacturers, leading to costly failures and reduced yields. This patent addresses a universal need for improved underfill quality, positioning it to capture a substantial share of the market for advanced dispensing equipment and potentially licensing opportunities for its methodology.\n\n**Competitive Advantages:**\nThis technology offers several compelling competitive advantages:\n\n1.  **Superior Reliability:** By guaranteeing a void-free underfill, the invention dramatically improves the long-term reliability of electronic components. This is a critical differentiator in markets where product lifespan and performance under harsh conditions are paramount (e.g., automotive, aerospace, medical, industrial IoT).\n2.  **Reduced Manufacturing Defects:** Eliminating voids directly translates to higher manufacturing yields, reducing scrap rates and rework costs. This operational efficiency provides a significant cost advantage over competitors struggling with traditional underfill limitations.\n3.  **Enabling Advanced Packaging:** As chip architectures become more complex (e.g., finer pitches, 3D stacking, heterogeneous integration), achieving void-free underfill becomes even more challenging for conventional methods. This innovation positions adopters at the forefront of advanced packaging capabilities.\n4.  **Brand Reputation:** Companies utilizing this patented technology can build a reputation for producing highly reliable and durable products, fostering customer loyalty and market leadership.\n\n**Revenue Potential and Business Models:**\nRevenue generation from this patent could stem from multiple avenues:\n\n*   **Equipment Sales:** Developing and selling specialized dispensing equipment that incorporates the 'funneling' methodology for void-free underfill.\n*   **Licensing:** Licensing the patent to existing dispensing equipment manufacturers or large semiconductor foundries and OSATs (Outsourced Semiconductor Assembly and Test) for integration into their own processes.\n*   **Material Sales/Optimization:** Potentially developing optimized underfill materials specifically designed to work best with this dispensing approach, creating a synergistic product offering.\n*   **Consulting/Services:** Offering expertise and services to help companies implement and optimize the Underfill Dispensing Using Funnels process.\n\n**Strategic Positioning:**\nCompanies that adopt or license this technology can strategically position themselves as leaders in high-reliability electronics manufacturing. This allows them to target premium markets and applications where the cost of failure is extremely high. It also enables them to meet increasingly stringent quality and reliability standards set by industries such as automotive (AEC-Q100/200), aerospace, and healthcare.\n\n**ROI Projections:**\nThe Return on Investment (ROI) for adopting this technology can be substantial. For a typical electronics manufacturer, the investment in new dispensing equipment or licensing fees could be offset by:\n\n*   **Reduced Warranty Costs:** A significant drop in field failures directly impacts warranty expenses.\n*   **Increased Yields:** Even a few percentage points improvement in manufacturing yield can lead to millions in savings for high-volume production.\n*   **Faster Time-to-Market:** More reliable processes mean faster qualification and less rework, accelerating product launches.\n*   **Enhanced Brand Value:** Intangible benefits from improved reputation and customer trust.\n\nIn conclusion, the Underfill Dispensing Using Funnels patent represents a high-impact innovation with clear business value. It addresses a critical industry pain point, offers strong competitive advantages, and opens multiple revenue streams, making it a compelling opportunity for investors and industry players alike to enhance product quality and gain market leadership.","faqs":[{"answer":"Underfill Dispensing Using Funnels (US-9852960) is a patent for an innovative method and system designed to create a perfectly void-free layer of underfill material in electronic assemblies. Underfill is a protective polymer used to fill the tiny gap between a semiconductor chip and its substrate, providing structural support and protecting delicate electrical connections from mechanical stress and environmental factors.\n\nTraditional underfill processes often struggle with trapping microscopic air bubbles, or 'voids,' within this protective layer. These voids significantly compromise the reliability and longevity of electronic devices. The core of this invention lies in its ability to precisely control the flow and application of the underfill material, ensuring complete encapsulation without any trapped air.\n\nThis technology is crucial for modern microelectronics, as it directly enhances the structural integrity and performance of devices, leading to fewer failures and longer product lifespans. It represents a significant advancement in manufacturing precision for high-reliability electronic components. The patent describes forming a protective cured underfill layer that provides robust structural support to connections between arrays of objects and their substrate.","question":"What is Underfill Dispensing Using Funnels?"},{"answer":"The Underfill Dispensing Using Funnels patent works by employing a highly controlled and precise method to apply underfill material, fundamentally preventing the formation of air bubbles (voids). While the term 'funnels' is used conceptually in the title, it implies a system that guides the underfill material with extreme accuracy into the microscopic spaces between a chip and its substrate.\n\nInstead of relying solely on passive capillary action, which can lead to air entrapment, this invention utilizes a dynamic flow management approach. This likely involves a specialized dispensing head or mechanism that creates an optimized flow path for the underfill. As the material is dispensed, it systematically displaces air, ensuring a complete and uniform fill. The system is designed to handle arrays of multiple objects on a substrate, ensuring consistent void-free application across complex component layouts.\n\nOnce the void-free layer of underfill material is formed, it undergoes a curing process, typically thermal or UV, to solidify into a robust, protective layer. This cured layer then provides superior structural support to the electrical connections, effectively shielding them from physical stress and environmental degradation, thereby enhancing overall device reliability.","question":"How does Underfill Dispensing Using Funnels work?"},{"answer":"The Underfill Dispensing Using Funnels patent primarily solves the critical problem of void formation within the underfill layer of electronic packages. Voids, which are microscopic air bubbles trapped during the underfill application process, are a major cause of failure in modern electronic devices.\n\nThese voids create weak points in the protective underfill layer, leading to several detrimental effects:\n\n1.  **Reduced Structural Support:** Voids compromise the mechanical coupling between the chip and the substrate, making the connections vulnerable to stress.\n2.  **Delamination and Cracking:** They act as initiation sites for cracks and delamination, especially under thermal cycling (heating and cooling) or mechanical shock (drops).\n3.  **Moisture Ingress:** Voids can provide pathways for moisture and contaminants to reach delicate connections, leading to corrosion and electrical failures.\n4.  **Lower Manufacturing Yields:** Defective underfill due to voids results in scrapped components, rework, and increased production costs.\n\nBy ensuring a consistently void-free underfill, Underfill Dispensing Using Funnels dramatically improves product reliability, extends device lifespan, and reduces manufacturing defects, addressing a long-standing challenge in the microelectronics industry.","question":"What problem does Underfill Dispensing Using Funnels solve?"},{"answer":"The specific inventors of the Underfill Dispensing Using Funnels patent (US-9852960) are not publicly listed in the provided patent data. Often, patents are assigned to companies, and the inventor details are part of the full patent document available from official patent offices.\n\nHowever, the innovation itself is a testament to ongoing research and development in advanced materials and manufacturing processes within the semiconductor industry. Such breakthroughs typically stem from teams of engineers, material scientists, and process experts working to overcome critical challenges in electronic packaging. The focus on 'Underfill Dispensing Using Funnels' indicates a deep understanding of fluid dynamics, material science, and micro-assembly techniques required to achieve void-free encapsulation. The assignee, if known, would typically be the company that owns the intellectual property rights to this groundbreaking technology.","question":"Who invented Underfill Dispensing Using Funnels?"},{"answer":"The Underfill Dispensing Using Funnels patent offers several significant benefits that are poised to transform the electronics manufacturing industry:\n\n1.  **Enhanced Device Reliability and Durability:** The primary benefit is the elimination of voids, which are major failure points. This leads to significantly more robust devices that can withstand thermal cycling, mechanical shock, and environmental stresses more effectively, extending their operational lifespan.\n2.  **Higher Manufacturing Yields and Reduced Costs:** By preventing defects related to underfill voids, manufacturers can achieve higher production yields, reduce scrap rates, and minimize costly rework. This translates directly into substantial cost savings and improved operational efficiency.\n3.  **Enabling Advanced Packaging Technologies:** As chip designs become more complex (e.g., finer interconnect pitches, 3D stacking, heterogeneous integration), achieving void-free underfill becomes even more challenging. This technology provides the reliable foundation necessary to enable the mass production of these next-generation packages.\n4.  **Improved Product Performance:** A uniform, void-free underfill ensures optimal stress distribution, thermal management, and electrical insulation, contributing to better overall device performance.\n5.  **Competitive Advantage:** Companies adopting this patented technology can differentiate their products by offering superior reliability, leading to increased customer satisfaction, stronger brand reputation, and leadership in high-reliability markets.","question":"What are the key benefits of Underfill Dispensing Using Funnels?"},{"answer":"Underfill Dispensing Using Funnels distinguishes itself from prior art by fundamentally shifting the approach to underfill application from 'minimizing voids' to 'guaranteeing a void-free layer.' Traditional methods, such as capillary flow underfill (CFU) or no-flow underfill (NFU), despite their widespread use, inherently struggle with air entrapment and inconsistent filling, particularly in complex or high-density packages.\n\nPrior art often focuses on optimizing material properties or process parameters to reduce the *likelihood* of voids. In contrast, this patent describes a system and method that *actively controls* the underfill flow to systematically displace air, ensuring complete encapsulation without any trapped bubbles. The 'funneling' concept implies a precision-guided mechanism that is more proactive and deterministic in preventing voids, rather than relying on passive capillary action or post-application inspection for defect detection.\n\nThis proactive void elimination capability is a significant leap. It offers greater process predictability, higher reliability, and the ability to confidently produce advanced electronic packages that were previously challenging due to underfill integrity issues. It sets a new benchmark for quality that surpasses the limitations of conventional underfill techniques.","question":"How is Underfill Dispensing Using Funnels different from prior art?"},{"answer":"The Underfill Dispensing Using Funnels patent is set to have a profound impact across a wide array of industries that rely heavily on advanced and reliable electronic components. Its ability to ensure void-free underfill translates directly into enhanced product durability and performance, which is critical for many sectors.\n\nKey industries that will be significantly impacted include:\n\n1.  **Automotive:** Essential for advanced driver-assistance systems (ADAS), infotainment, and future autonomous vehicles, where component reliability is paramount for safety and performance under demanding environmental conditions.\n2.  **Aerospace and Defense:** Critical for high-reliability systems in aircraft, satellites, and military equipment, where failure is not an option and components must withstand extreme temperatures, vibrations, and shocks.\n3.  **Medical Devices:** Enhancing the longevity and dependability of life-critical equipment such as pacemakers, implantable devices, diagnostic tools, and surgical robots, where component integrity is directly linked to patient safety.\n4.  **High-Performance Computing (HPC) and Data Centers:** Improving the reliability of server CPUs, GPUs, and memory modules, reducing downtime and maintenance costs in critical infrastructure.\n5.  **Consumer Electronics:** Leading to more durable and longer-lasting smartphones, laptops, wearables, and other personal devices, reducing warranty claims and improving customer satisfaction.\n6.  **Industrial IoT and Smart Infrastructure:** Enabling robust sensors and control systems that can operate reliably in harsh industrial environments for extended periods, crucial for automation and smart city applications.\n\nIn essence, any industry where electronic component failure is costly, dangerous, or detrimental to operations will benefit from the enhanced reliability provided by Underfill Dispensing Using Funnels.","question":"What industries will Underfill Dispensing Using Funnels impact?"},{"answer":"The patent Underfill Dispensing Using Funnels, identified by its number US-9852960, was officially filed on **March 17, 2016**. This date marks the initial submission of the invention to the patent office, formally establishing its priority date.\n\nFollowing the examination process, the patent was subsequently published and granted on **December 26, 2017**. The publication date typically signifies when the patent document becomes publicly accessible, detailing the claims, abstract, and often figures of the invention. The granting date confirms the legal protection afforded to the inventors or assignee for their novel underfill dispensing method.\n\nThese dates are important for understanding the timeline of the invention's development and its entry into the public domain of intellectual property. The period between filing and granting allows for thorough review by patent examiners to ensure the invention meets criteria for novelty, non-obviousness, and utility, confirming the unique contribution of Underfill Dispensing Using Funnels to the field of microelectronics manufacturing.","question":"When was Underfill Dispensing Using Funnels filed/granted?"},{"answer":"The commercial applications of the Underfill Dispensing Using Funnels patent are extensive and diverse, spanning across various segments of the electronics industry due to its ability to dramatically enhance product reliability and manufacturing efficiency.\n\nKey commercial applications include:\n\n1.  **High-Reliability Product Manufacturing:** Companies producing components for automotive, aerospace, defense, and medical sectors can leverage this technology to meet stringent quality standards and reduce field failures, enhancing their market position and reducing warranty costs.\n2.  **Advanced Packaging Solutions:** Manufacturers of advanced semiconductor packages such as flip-chip, chip-scale packages (CSPs), wafer-level packages (WLPs), and 3D stacked ICs can utilize this method to achieve previously unattainable levels of underfill integrity, enabling more complex and higher-performance designs.\n3.  **Dispensing Equipment Market:** The patent provides a basis for developing and selling specialized precision dispensing equipment that incorporates the 'funneling' methodology. This creates a new segment or significantly upgrades existing offerings in the semiconductor manufacturing equipment market.\n4.  **Licensing Opportunities:** The intellectual property can be licensed to existing equipment manufacturers or large outsourced semiconductor assembly and test (OSAT) providers, allowing them to integrate the void-free underfill process into their production lines.\n5.  **Material Science Development:** The precision of this dispensing method could also drive innovation in underfill material formulations, allowing for the use of materials with specific thermal, electrical, or mechanical properties that were previously difficult to apply without voids.\n\nUltimately, any business involved in the assembly of microelectronic components that prioritizes quality, reliability, and manufacturing yield stands to benefit significantly from the commercialization of Underfill Dispensing Using Funnels.","question":"What are the commercial applications of Underfill Dispensing Using Funnels?"},{"answer":"The Underfill Dispensing Using Funnels patent lays a robust foundation for numerous future developments in microelectronics manufacturing. Its core principle of achieving void-free underfill opens doors for significant advancements in both process technology and electronic product design.\n\nExpected future developments include:\n\n1.  **Integration with AI and Machine Learning:** Future dispensing systems could incorporate AI to dynamically optimize dispensing parameters in real-time, adapting to variations in material rheology or component geometry. Machine learning algorithms could analyze sensor data (e.g., vision systems, pressure sensors) to predict and prevent void formation before it occurs, further enhancing process robustness.\n2.  **Adaptive 'Smart' Underfill Materials:** The precision afforded by Underfill Dispensing Using Funnels could enable the use of 'smart' underfill materials with self-healing properties or embedded sensors. These materials could detect micro-cracks or environmental changes and respond, further extending device lifespan and providing diagnostic data.\n3.  **Enhanced 3D and Heterogeneous Integration:** As 3D stacked ICs and heterogeneous integration become more prevalent, the challenge of underfilling complex, multi-layered structures will intensify. Future iterations of this technology will likely be adapted to handle these intricate geometries, potentially incorporating multi-nozzle systems or specialized micro-dispensing techniques.\n4.  **In-Situ Curing and Process Acceleration:** Integration of localized, rapid curing methods (e.g., UV or flash thermal curing) directly into the dispensing head could significantly accelerate the underfill process, reducing cycle times and increasing throughput for high-volume manufacturing.\n5.  **Miniaturization and Ultra-Fine Pitch Application:** Continued refinement of the 'funneling' mechanism will allow for underfill application in even smaller gaps and finer interconnect pitches, enabling the next generation of ultra-compact and high-density electronic packages. This will push the boundaries of miniaturization further, allowing for more powerful devices in smaller footprints.\n\nThese developments will collectively contribute to a future where electronic devices are not only more powerful and compact but also inherently more reliable, sustainable, and capable of operating in increasingly demanding environments.","question":"What are the future developments expected for Underfill Dispensing Using Funnels?"}],"topics":["underfill dispensing","void-free underfill","semiconductor packaging","electronic assembly","chip packaging","reliability","advanced","electronic"],"tech_cluster":null},"seo":{"title":"Underfill Dispensing Using Funnels - Patent US-9852960","description":"Discover the Underfill Dispensing Using Funnels patent (US-9852960) for void-free underfill layers, enhancing electronic reliability and manufacturing efficiency.","keywords":["underfill dispensing","void-free underfill","semiconductor packaging","electronic assembly","chip packaging","microelectronics reliability","patent US-9852960","advanced packaging","material dispensing","structural support","component reliability","manufacturing efficiency","defect reduction","underfill technology"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852960","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852960","citation_suggestion":"Patentable. \"Underfill dispensing using funnels\" (US-9852960). https://patentable.app/patents/US-9852960","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852960","json":"https://patentable.app/api/llm-context/US-9852960","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T08:59:50.882Z"}