{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852961","patent":{"patent_number":"US-9852961","title":"Packaged semiconductor device having an encapsulated semiconductor chip","assignee":null,"inventors":[],"filing_date":"2013-08-28T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":6,"abstract":"A packaged semiconductor device includes a semiconductor component, first and second heat dissipation means disposed between the semiconductor component and the first and second main faces, respectively, encapsulated by an encapsulant, the shape of the packaged semiconductor device being non-rectangular cuboid."},"analysis":{"summary":"The patent titled \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip\" introduces a significant innovation in semiconductor packaging, addressing critical challenges in thermal management and form factor design. At its core, this invention describes a semiconductor component integrated with both first and second heat dissipation means, strategically placed between the component and the package's main faces. This entire assembly is then encapsulated by a specialized encapsulant. The most distinguishing feature of this technology is its non-rectangular cuboid shape.\n\nThe primary problem this innovation solves is the limitation of traditional, rectangular semiconductor packages in efficiently dissipating heat and adapting to modern, compact device designs. As electronic devices become smaller and more powerful, managing the internal heat generated by semiconductor chips becomes paramount for performance, reliability, and lifespan. Conventional designs often require bulky external heat sinks or compromise on form factor.\n\nThe key technical approach involves embedding thermal management directly within the package structure and liberating the package from the rigid constraints of a rectangular cuboid. By integrating heat dissipation means adjacent to the semiconductor component and allowing for a non-rectangular shape, the device can optimize thermal pathways, increase surface area for cooling, and conform to highly irregular internal spaces. The encapsulant serves not only for protection but also as a medium for this integrated thermal transfer.\n\nFrom a business perspective, the value and applications of this patent are substantial. It enables the creation of more compact, ergonomic, and higher-performing electronic products. Industries such as consumer electronics (smartphones, wearables), automotive (ECUs, sensors), IoT devices, and medical technology can leverage this innovation to develop next-generation products that are thinner, lighter, more durable, and capable of sustained high performance. This technology facilitates advanced industrial design without sacrificing functionality or thermal integrity.\n\nThe market opportunity for this kind of packaging innovation is vast, driven by the continuous demand for miniaturization, increased power density, and improved reliability across the entire electronics sector. Companies adopting this approach can gain a competitive edge by offering products with superior thermal characteristics and unique form factors, potentially unlocking new market segments and enhancing user experience.","layman_explanation":"In today's fast-paced world of technology, everyone wants smarter, smaller, and more powerful electronic devices. Think about your smartphone, smartwatch, or even the advanced systems in your car. These devices rely on tiny 'brains' called semiconductor chips to function. However, there's a constant battle engineers face: these powerful chips generate a lot of heat, and heat is the enemy of performance and longevity. This is where the patent for the \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip\" comes into play, offering a clever solution to a fundamental problem.\n\n**1. What Problem Does This Solve?**\n\nHistorically, semiconductor chips have been packaged in standard, blocky, rectangular shapes. While easy to manufacture, these traditional packages present two major hurdles. First, they're not very good at getting rid of heat efficiently, often requiring bulky external cooling components that add size and weight. This leads to devices getting hot, slowing down (a process called 'thermal throttling'), and potentially failing sooner. Second, their rigid rectangular form limits industrial designers. If you want to create a sleek, curved smartwatch or a uniquely shaped sensor for a specific industrial application, a square chip package can be a significant constraint, forcing design compromises or inefficient use of space. This patent directly addresses these limitations by rethinking the very form and function of the chip package.\n\n**2. How Does It Work?**\n\nImagine a tiny, high-performance engine (that's our semiconductor chip) that needs to stay cool to run at its best. In this innovation, instead of just putting the engine in a standard box and hoping for the best, we do two smart things. First, we place two 'cooling plates' – one on top and one on the bottom – directly next to our engine. These plates are designed to quickly pull heat away from the engine as soon as it's generated. Second, and this is the really clever part, the entire 'engine-plus-cooling-plates' assembly is then sealed within a protective, specially designed casing, and this casing isn't a boring rectangle. It can be *any shape you need it to be* – round, oval, tapered, or something completely custom.\n\nThis protective casing, called an encapsulant, not only shields the sensitive components from damage and moisture but also helps transfer the heat from the cooling plates to the outside world more effectively. So, the system works like a custom-fitted, highly efficient heat-management suit for the chip. It's not just about adding external cooling; it's about building the cooling capability directly into the chip's very structure and allowing that structure to be optimized for both thermal performance and physical integration.\n\n**3. Why Does This Matter?**\n\nThis patent matters because it unlocks new possibilities across numerous industries. For **consumer electronics**, it means thinner, lighter, and more powerful smartphones, wearables, and smart home devices that can run demanding applications without overheating. Imagine a smartwatch that's truly ergonomic, perfectly molded to your wrist, and never feels hot. In the **automotive sector**, this technology could lead to more robust and compact electronic control units (ECUs) and sensors that can withstand harsh engine bay temperatures while fitting into intricate vehicle designs. For the **Internet of Things (IoT)**, it enables the creation of highly specialized sensors and devices with unique form factors that can be deployed in previously inaccessible locations. From a business perspective, companies adopting this approach can differentiate their products through superior performance, innovative design, and enhanced reliability, potentially capturing new market segments and commanding premium prices. It's about moving beyond incremental improvements to truly redefine product capabilities.\n\n**4. What's Next?**\n\nThe future applications of this technology are vast. We could see a new era of 'shape-optimized' electronics, where the form of the component is dictated by the product's design and thermal needs, rather than the other way around. This could accelerate the development of flexible electronics, advanced medical implants, and even more sophisticated robotics. As demand for high-performance computing at the edge continues to grow, solutions like the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip will become increasingly crucial. For investors, this signals a significant shift in semiconductor packaging, representing a valuable opportunity in companies specializing in advanced materials, precision manufacturing, and integrated thermal solutions. It's an investment in the foundational technology that will power the next wave of innovation.","technical_analysis":"The patent \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip\" presents a sophisticated solution for enhancing the thermal management and geometric flexibility of semiconductor devices. This technical analysis delves into the architectural and functional specifics described in the patent, highlighting its implications for modern electronic design.\n\n**Technical Architecture and Component Integration:**\nAt its foundation, this patent describes a packaged semiconductor device that deviates significantly from conventional cuboid structures. The core components include:\n1.  **Semiconductor Component:** This refers to the active electronic chip (e.g., CPU, GPU, ASIC, sensor) that generates heat during operation.\n2.  **First and Second Heat Dissipation Means:** These are critical elements strategically positioned. The 'first' is disposed between the semiconductor component and one main face of the package, while the 'second' is between the component and the opposite main face. This dual-sided, internal placement is key. These means could manifest as thin layers of high thermal conductivity materials (e.g., copper, aluminum, diamond-like carbon), embedded heat pipes, vapor chambers, or even micro-fluidic channels. Their proximity to the heat source (the semiconductor component) ensures minimal thermal resistance in the initial heat transfer path.\n3.  **Encapsulant:** The entire assembly, including the semiconductor component and both heat dissipation means, is encapsulated. This encapsulant, typically a polymer compound, serves multiple purposes: mechanical protection against shock and vibration, environmental sealing against moisture and contaminants, and electrical insulation. Crucially, in this design, it also plays a role in facilitating heat transfer from the dissipation means to the outer surfaces of the package, or to a secondary cooling solution.\n\n**The Non-Rectangular Cuboid Advantage:**\nPerhaps the most defining technical characteristic is the 'non-rectangular cuboid' shape of the packaged device. This is a profound departure from industry norms. Traditional rectangular packages simplify manufacturing and board layout but restrict thermal optimization and industrial design. A non-rectangular shape allows for:\n*   **Optimized Thermal Pathways:** Complex geometries can be designed to maximize surface area for convective cooling or to create specific heat flow directions, guiding thermal energy away from sensitive areas or towards an external heat sink more efficiently. For example, a package could have fins, curves, or tapered edges that are not possible with a simple cuboid.\n*   **Enhanced Volumetric Efficiency:** In devices with irregular internal spaces (e.g., curved wearables, automotive modules with constrained cavities), a custom-shaped package can fit precisely, minimizing wasted volume and enabling more compact product designs.\n*   **Improved Structural Integrity:** Non-uniform shapes can sometimes offer better mechanical stability and stress distribution, especially when molded with specific encapsulants, potentially reducing issues like warpage or delamination under thermal cycling.\n\n**Implementation Details and Performance Characteristics:**\nImplementing this patent would involve advanced manufacturing processes, including precision molding for the non-rectangular encapsulant, sophisticated assembly techniques for integrating the heat dissipation layers, and potentially novel material science for encapsulants with tailored thermal and mechanical properties. The performance implications are significant:\n*   **Superior Thermal Performance:** By integrating heat dissipation directly at the source and optimizing package geometry, the overall thermal resistance from junction to ambient (Rja) can be substantially reduced compared to conventional packages. This allows the semiconductor component to operate at lower temperatures, leading to higher sustained clock speeds (less thermal throttling) and extended component lifespan.\n*   **Miniaturization and Design Freedom:** The ability to customize package shapes directly impacts product design, enabling sleeker, more ergonomic, and smaller devices without sacrificing computational power. This is particularly valuable for portable, wearable, and embedded systems.\n*   **Increased Reliability:** Lower operating temperatures and robust encapsulation contribute to improved long-term reliability and robustness against environmental stressors, crucial for critical applications in automotive, industrial, and medical sectors.\n\n**Integration Patterns and Code-Level Implications:**\nWhile primarily a hardware innovation, the benefits of this packaged device have downstream implications. For software and firmware engineers, enhanced thermal performance means less need for aggressive power management algorithms that throttle CPU/GPU frequencies. This can simplify power management unit (PMU) firmware, allowing for more consistent performance profiles. For system architects, the flexible form factor opens up new possibilities for component layout on PCBs or within system-on-package (SOP) designs, potentially leading to shorter interconnects, reduced signal integrity issues, and optimized impedance matching. This technology enables a more holistic approach to system design, where hardware and software can be optimized together for peak performance within innovative form factors.","business_analysis":"The patent \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip\" represents a compelling business opportunity, poised to disrupt multiple sectors by addressing critical limitations in semiconductor packaging: thermal management and form factor flexibility. This innovation offers significant competitive advantages and opens new revenue streams for companies willing to integrate its principles.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion-dollar industry, driven by the relentless demand for smaller, faster, and more reliable electronic devices. The specific segment addressing advanced thermal solutions and heterogeneous integration is growing rapidly due to trends like AI at the edge, 5G, IoT, and high-performance computing. This patent positions itself squarely within this high-growth area. The ability to create custom-shaped, thermally optimized packages unlocks markets where traditional rectangular components are limiting, such as advanced wearables, compact medical devices, automotive electronics in confined spaces, and next-gen drones or robotics. The total addressable market for devices benefiting from superior thermal performance and flexible form factors is substantial and expanding.\n\n**Competitive Advantages:**\nCompanies adopting the principles of the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip can gain several potent competitive advantages:\n1.  **Superior Product Performance:** Devices incorporating this technology can achieve higher sustained operating frequencies and better performance under load due to enhanced heat dissipation. This directly translates to faster processing, more responsive user experiences, and improved functional capabilities.\n2.  **Innovative Form Factors:** The non-rectangular cuboid design liberates product designers from traditional constraints, enabling the creation of truly ergonomic, aesthetically pleasing, and highly compact devices. This differentiation can be a powerful market differentiator in consumer electronics and specialized industrial applications.\n3.  **Enhanced Reliability and Lifespan:** Lower operating temperatures and robust encapsulation lead to increased component longevity and reduced failure rates, significantly improving product quality and reducing warranty costs.\n4.  **Reduced System-Level Costs:** By integrating thermal management within the package, the need for external, often bulky and expensive, cooling solutions can be minimized or eliminated, leading to overall system cost reductions and simpler assembly processes.\n5.  **First-Mover Advantage:** Early adoption of this patented technology can establish a company as a leader in advanced packaging and product innovation, capturing significant market share.\n\n**Revenue Potential and Business Models:**\nRevenue generation from this patent could stem from various business models:\n*   **Licensing:** Semiconductor foundries or packaging houses could license the technology to offer advanced packaging services to their clients.\n*   **Product Differentiation:** OEMs (Original Equipment Manufacturers) in consumer electronics, automotive, or medical devices could integrate this technology into their products to command premium pricing due to superior performance, design, and reliability.\n*   **Custom Packaging Solutions:** Specialized packaging firms could offer bespoke Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip solutions tailored to unique client requirements, acting as a high-value service provider.\n*   **Component Sales:** Manufacturers of the heat dissipation means or encapsulant materials could see increased demand for products compatible with this advanced packaging method.\n\n**Strategic Positioning and ROI Projections:**\nStrategically, this patent allows companies to move beyond incremental improvements to offer genuinely disruptive products. It enables a positioning as an innovator, a problem-solver for complex thermal and design challenges. The ROI for investing in this technology is projected to be high, driven by:\n*   **Increased Sales and Market Share:** Through product differentiation and performance advantages.\n*   **Reduced Manufacturing Costs:** Due to streamlined thermal solutions and optimized material use.\n*   **Lower Warranty and Support Costs:** Resulting from enhanced product reliability.\n*   **New Market Entry:** Access to segments previously constrained by packaging limitations.\n\nCompanies that embrace the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip will be well-positioned to lead in the evolving landscape of high-performance, compact, and reliable electronics, securing long-term growth and profitability.","faqs":[{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip is a patented invention (US-9852961) that introduces a novel approach to semiconductor packaging. At its core, it describes a semiconductor component (the microchip) integrated with first and second heat dissipation means, which are strategically placed between the chip and the package's main faces. This entire assembly is then encapsulated by a protective material called an encapsulant.\n\nThe most distinctive feature of this innovation is that the overall shape of the packaged device is a non-rectangular cuboid. This means it departs from the traditional square or rectangular chip packages, allowing for custom, irregular, or contoured shapes. This flexibility in form factor, combined with integrated thermal management, addresses critical limitations of conventional semiconductor packaging.\n\nEssentially, it's a smarter, cooler, and more adaptable way to encase a microchip, enabling higher performance and greater design freedom for electronic products. This patent represents a significant advancement in the field of electronics manufacturing and design. Keywords: semiconductor packaging, encapsulated chip, non-rectangular, heat dissipation, patent US-9852961.","question":"What is Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip works by integrating thermal management directly into the package structure and allowing for unique geometries. When the semiconductor component (the chip) generates heat during operation, this heat is immediately captured by the 'first and second heat dissipation means' that are strategically positioned on both sides of the chip.\n\nThese heat dissipation means act like efficient thermal pathways, drawing heat away from the sensitive chip. The entire assembly, including the chip and these cooling elements, is then sealed within a protective encapsulant. This encapsulant not only protects the components from environmental factors and physical damage but also helps to transfer the absorbed heat from the internal dissipation means to the exterior surfaces of the package.\n\nThe key functional aspect is the non-rectangular cuboid shape of the package. This allows the package to be designed with optimized surface areas or contours that can more efficiently release heat to the ambient environment, or to perfectly fit into the irregular internal spaces of a product. This integrated and shape-optimized approach ensures superior thermal performance and greater flexibility in product design compared to traditional methods. Keywords: how it works, integrated cooling, thermal management, encapsulant, non-rectangular shape.","question":"How does Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip work?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip patent primarily solves two critical problems in modern electronics:\n\n1.  **Inefficient Thermal Management:** As semiconductor chips become more powerful and densely packed, they generate more heat. Traditional rectangular packages often struggle to dissipate this heat effectively, leading to high operating temperatures. This causes 'thermal throttling' (where the chip slows down to prevent damage), reduces the chip's lifespan, and can lead to device instability. This invention's integrated heat dissipation means and optimized package shape directly address this by providing a more efficient thermal pathway.\n2.  **Design and Form Factor Limitations:** Conventional rectangular chip packages impose rigid constraints on product designers. If a designer wants to create a sleek, curved wearable, an ultra-thin smartphone, or a uniquely shaped component for a specific industrial application, the standard square or rectangular chip forces compromises in aesthetics, ergonomics, or volumetric efficiency. The non-rectangular cuboid shape of this patented device liberates designers, allowing for more innovative and compact product forms without sacrificing performance. Keywords: thermal problems, design constraints, overheating, product miniaturization, form factor flexibility.","question":"What problem does Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip solve?"},{"answer":"The patent data provided indicates that the inventors and assignee information for US-9852961, \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip,\" are not available in the abstract. Patent records typically list the inventors and the assignee (the entity or company that owns the patent). Without this specific information, we cannot identify the individuals or organization responsible for this particular innovation.\n\nHowever, the invention itself focuses on a generalized packaging method rather than a specific product from a particular company. The principles outlined in this patent could be applied or licensed by various semiconductor manufacturers or packaging service providers. The innovation's value lies in its technical approach to thermal management and package geometry, regardless of its original creators. Keywords: inventors, assignee, patent ownership, US-9852961, semiconductor innovation.","question":"Who invented Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip offers several significant benefits for the electronics industry:\n\n1.  **Superior Thermal Performance:** By integrating heat dissipation means directly adjacent to the semiconductor chip and optimizing the package's non-rectangular shape, this invention significantly improves heat removal efficiency. This leads to lower operating temperatures, reduced thermal throttling, and sustained high performance for electronic devices.\n2.  **Unprecedented Design Flexibility:** The ability to create non-rectangular cuboid packages frees product designers from the constraints of traditional square or rectangular components. This enables the development of highly ergonomic, aesthetically pleasing, and uniquely shaped devices, maximizing internal space utilization.\n3.  **Enhanced Reliability and Lifespan:** Lower operating temperatures reduce stress on the semiconductor component and associated materials, extending the device's operational lifespan and improving its overall reliability, leading to fewer failures and lower warranty costs.\n4.  **Miniaturization and Compactness:** By efficiently managing heat internally and allowing for custom shapes, this technology facilitates the creation of smaller, lighter, and more compact electronic products, critical for wearables, portable devices, and integrated systems. Keywords: key benefits, thermal efficiency, design freedom, device reliability, miniaturization, performance.","question":"What are the key benefits of Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip significantly differentiates itself from prior art in two fundamental ways:\n\n1.  **Integrated Dual-Sided Heat Dissipation:** Much of the prior art in semiconductor packaging relies on single-sided heat removal (e.g., a heat spreader on top of the chip) or external cooling solutions. This patent explicitly describes 'first and second heat dissipation means' positioned on *both* sides of the semiconductor component, directly between the chip and the package's main faces. This dual-sided, integrated approach provides a much more efficient and direct pathway for heat extraction right at the source, dramatically reducing thermal resistance compared to conventional methods.\n2.  **Non-Rectangular Cuboid Package Shape:** The vast majority of existing semiconductor packages are rectangular cuboids. The defining feature of this patent is its explicit declaration that the 'shape of the packaged semiconductor device being non-rectangular cuboid.' This departure from the standard allows for custom, irregular, or contoured package geometries that can be optimized for specific thermal profiles or to fit perfectly into complex, non-orthogonal product designs, offering a level of flexibility not found in traditional packaging. Keywords: prior art, differentiation, dual-sided cooling, non-rectangular package, packaging innovation, thermal advantage.","question":"How is Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip different from prior art?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip is poised to have a transformative impact across a wide range of industries due to its ability to enhance performance, enable new designs, and improve reliability:\n\n1.  **Consumer Electronics:** This includes smartphones, wearables (smartwatches, AR/VR headsets), laptops, and gaming devices. The patent enables thinner, lighter, more ergonomic products with sustained high performance, reducing issues like overheating during intensive use.\n2.  **Automotive:** Electronic control units (ECUs), sensors for autonomous driving, and infotainment systems can benefit from compact, robust, and thermally stable components that fit into constrained vehicle spaces and withstand harsh operating conditions.\n3.  **Internet of Things (IoT):** Devices for smart homes, industrial monitoring, and smart cities can be designed with unique, custom shapes to blend seamlessly into their environments, while also offering improved thermal performance and reliability in diverse deployment scenarios.\n4.  **Medical Devices:** Miniaturized, highly reliable components are crucial for implantable devices, portable diagnostic equipment, and surgical tools. The custom form factors and enhanced thermal management can lead to less invasive and more effective healthcare technologies.\n5.  **Aerospace and Defense:** High-performance, lightweight, and extremely reliable components are essential for avionics, satellite systems, and defense applications, where space and thermal stability are critical. Keywords: industry impact, consumer electronics, automotive, IoT, medical devices, aerospace, technology transformation.","question":"What industries will Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip impact?"},{"answer":"The patent for the \"Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip\" (US-9852961) was officially filed on **2013-08-28** (August 28, 2013). This marks the date when the application was submitted to the patent office, initiating the examination process.\n\nSubsequently, the patent was granted and published on **2017-12-26** (December 26, 2017). This publication date signifies when the patent was officially issued, making the details of the invention publicly available and granting the patent holder exclusive rights to the invention for a specified period. The period between filing and publication allows for examination, potential revisions, and public review. Keywords: filing date, publication date, patent timeline, US-9852961, patent grant.","question":"When was Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip filed/granted?"},{"answer":"The commercial applications of the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip are extensive, driven by the increasing demand for high-performance, compact, and reliable electronics across sectors:\n\n1.  **Next-Generation Wearables:** Smartwatches, fitness trackers, and AR/VR glasses can be made significantly thinner, lighter, and more comfortable, with improved battery life and sustained performance for demanding applications like continuous health monitoring or immersive computing.\n2.  **Compact Computing Devices:** Ultra-thin laptops, mini-PCs, and embedded systems can achieve higher power densities without thermal throttling, enabling more powerful performance in smaller form factors.\n3.  **Advanced Automotive Sensors and ECUs:** Components for electric vehicles, autonomous driving, and driver-assistance systems can be custom-shaped to fit into tight spaces, withstand high temperatures, and offer enhanced reliability, crucial for vehicle safety and performance.\n4.  **Specialized Industrial IoT:** Sensors and control modules for smart factories, smart agriculture, or infrastructure monitoring can be designed with unique shapes to integrate seamlessly into machinery or environmental structures, while ensuring robust thermal performance in harsh conditions.\n5.  **Medical Implants and Portable Diagnostics:** Miniaturized and custom-shaped components can enable less invasive medical implants, smaller and more powerful diagnostic tools, and ergonomic portable healthcare devices, improving patient comfort and treatment efficacy. Keywords: commercial applications, wearables, automotive electronics, IoT devices, medical technology, compact computing.","question":"What are the commercial applications of Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip?"},{"answer":"The Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip lays a strong foundation for several exciting future developments in semiconductor packaging and electronics:\n\n1.  **Advanced Material Integration:** Future iterations could see the incorporation of even more sophisticated thermal materials, such as graphene-based composites or phase-change materials, within the heat dissipation means or encapsulant to further enhance thermal conductivity and efficiency. This could lead to 'self-healing' encapsulants or dynamic thermal management materials.\n2.  **Multi-Chip Module (MCM) and Heterogeneous Integration:** The non-rectangular, integrated thermal management concept could be extended to multi-chip modules, allowing for the efficient packaging of diverse chiplets (e.g., CPU, GPU, memory, specialized accelerators) within a single, custom-shaped package. This will be crucial for next-generation systems-on-package (SoP) and chiplets architectures.\n3.  **Additive Manufacturing for Packaging:** The flexibility in package shape lends itself well to additive manufacturing (3D printing) techniques for creating complex internal thermal structures or external package geometries that are impossible with traditional molding. This could enable rapid prototyping and highly customized, low-volume production.\n4.  **Smart Packaging with Integrated Sensors:** Future developments might include embedding micro-sensors directly within the encapsulant to monitor temperature, stress, or environmental factors in real-time, allowing for predictive maintenance or dynamic performance optimization of the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip. Keywords: future developments, advanced materials, heterogeneous integration, additive manufacturing, smart packaging, thermal management evolution, chiplet technology.","question":"What are the future developments expected for Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip?"}],"topics":["packaged semiconductor device","encapsulated semiconductor chip","US-9852961","thermal management","non-rectangular cuboid","relentless","march","towards"],"tech_cluster":null},"seo":{"title":"Packaged Semiconductor Device - US-9852961: Enhanced Thermal Mgmt","description":"Discover the Packaged Semiconductor Device Having an Encapsulated Semiconductor Chip patent. Features non-rectangular shape & integrated heat dissipation for superior thermal management.","keywords":["packaged semiconductor device","encapsulated semiconductor chip","US-9852961","thermal management","non-rectangular cuboid","semiconductor packaging","heat dissipation","electronics innovation","chip design","advanced packaging","patent analysis","thermal solutions","form factor flexibility"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852961","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852961","citation_suggestion":"Patentable. \"Packaged semiconductor device having an encapsulated semiconductor chip\" (US-9852961). https://patentable.app/patents/US-9852961","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852961","json":"https://patentable.app/api/llm-context/US-9852961","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T11:38:36.337Z"}