{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852963","patent":{"patent_number":"US-9852963","title":"Microprocessor assembly adapted for fluid cooling","assignee":null,"inventors":[],"filing_date":"2015-09-24T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L"],"num_claims":20,"abstract":"A microprocessor assembly adapted for fluid cooling can include a semiconductor die mounted on a substrate. The semiconductor die can include an integrated circuit with a two-dimensional and/or three-dimensional circuit architecture. The assembly can include a heat sink module in thermal communication with the semiconductor die. The heat sink module can include an inlet port fluidly connected to an inlet chamber, a plurality of orifices fluidly connecting the inlet chamber to an outlet chamber, and an outlet port fluidly connected to the outlet chamber. When pressurized coolant is delivered to the inlet chamber, the plurality of orifices can provide jet streams of coolant into the outlet chamber and against a surface to be cooled to provide fluid cooling suitable to control a semiconductor die temperature during operation."},"analysis":{"summary":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent (US-9852963) introduces a highly efficient thermal management solution for advanced semiconductor devices. The core innovation lies in its ability to precisely control the operating temperature of a semiconductor die, including those with complex two-dimensional and three-dimensional circuit architectures, by employing direct fluid cooling.\n\nThe primary problem this invention addresses is the escalating heat generation in modern microprocessors, which often leads to performance throttling, reduced reliability, and shorter component lifespans when relying on conventional air or less efficient liquid cooling methods. As chip densities and computational demands increase, effective heat dissipation becomes a critical bottleneck.\n\nThis patent's key technical approach involves a specialized heat sink module in direct thermal communication with the semiconductor die. This module is designed with an inlet port, an inlet chamber, a plurality of orifices, and an outlet chamber. When pressurized coolant is delivered to the inlet chamber, these orifices generate high-velocity jet streams that impinge directly onto the surface of the die requiring cooling. This direct jet impingement ensures highly localized and efficient heat transfer, effectively controlling the semiconductor die temperature during operation.\n\nThe business value and applications of this technology are substantial. It enables sustained peak performance for high-performance computing (HPC), artificial intelligence (AI) workloads, and advanced graphics processing by eliminating thermal throttling. For data centers, it promises increased rack density, reduced energy consumption for cooling, and enhanced hardware reliability, leading to significant operational cost savings and improved service delivery. In consumer electronics, it could facilitate more powerful yet thinner devices.\n\nThis technology presents a significant market opportunity in the rapidly expanding sectors of AI, cloud computing, gaming, and edge computing, where thermal management is a critical enabler for next-generation hardware. By offering a superior cooling solution, the Microprocessor Assembly Adapted for Fluid Cooling positions itself as a foundational technology for future computational advancements.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you have a super-powerful sports car engine. The faster it runs, the hotter it gets. If it gets too hot, it has to slow down or even shut off to prevent damage. Modern computer chips, especially those in high-performance servers, gaming machines, or AI systems, are exactly like that. They're incredibly powerful, but they generate a tremendous amount of heat. Traditional cooling methods, like fans blowing air, are like trying to cool that sports car engine with a small desk fan – it just doesn't cut it anymore. When chips get too hot, they 'throttle' (slow down) to protect themselves, which means your expensive, powerful hardware isn't performing at its best. This leads to slower operations, wasted energy, and even a shorter lifespan for the chip.\n\n### How Does It Work?\n\nThe **Microprocessor Assembly Adapted for Fluid Cooling** patent offers an ingenious solution. Think of it less like a conventional car radiator and more like a highly sophisticated, miniature sprinkler system built directly into the chip's housing. Instead of just air, this system uses a special cooling liquid. This liquid is pumped into a tiny chamber above the chip. From this chamber, it's forced through many tiny, precisely placed holes, creating powerful, focused 'jet streams' of coolant. These jets are aimed directly at the hottest parts of the chip's surface, like a surgeon precisely targeting an area. The high-speed liquid jets efficiently absorb the heat, cool down the chip, and then the now-warmer liquid flows into another chamber and out of the system to be re-cooled and reused. It's a direct, highly efficient, and localized cooling process.\n\n### Why Does This Matter?\n\nThis innovation is a game-changer for several reasons, particularly for businesses and investors:\n\n1.  **Unleashed Performance:** By keeping chips consistently cool, they can run at their maximum speed all the time. For data centers, this means AI models train faster, cloud services run smoother, and more computing power can be squeezed out of existing hardware. For consumers, it means faster, more reliable devices.\n2.  **Cost Savings:** Less heat means less energy wasted on cooling infrastructure (like massive air conditioners in data centers). It also means chips last longer, reducing replacement costs and downtime.\n3.  **Increased Density:** With superior cooling, more powerful chips can be packed into smaller spaces. This is critical for optimizing expensive data center real estate or creating thinner, more potent devices.\n4.  **Competitive Edge:** Companies that adopt this technology can offer superior performance and reliability, gaining a significant advantage in highly competitive markets like cloud computing, AI hardware, and high-end gaming.\n\n### What's Next?\n\nThe **Microprocessor Assembly Adapted for Fluid Cooling** is poised to become a foundational technology for the next generation of computing. We can expect to see its principles integrated into future server designs, professional workstations, and potentially even high-end consumer electronics. This innovation will enable the continued growth of AI and other data-intensive fields by removing a critical physical barrier. For investors, it signals a significant opportunity in the thermal management and high-performance computing sectors, as efficient cooling becomes increasingly valuable to unlock the full potential of advanced silicon.","technical_analysis":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent (US-9852963) outlines a sophisticated thermal management system that addresses the escalating heat flux challenges in modern semiconductor devices. This invention is particularly relevant for high-performance microprocessors, including those utilizing advanced two-dimensional (2D) and three-dimensional (3D) integrated circuit architectures, where conventional air cooling or less precise liquid cooling methods prove inadequate.\n\n**Technical Architecture and Core Components:**\nAt the heart of this system is a semiconductor die, which houses the integrated circuit, mounted on a substrate. Crucially, this die is in direct thermal communication with a specially designed heat sink module. The module's architecture is meticulously engineered for efficient fluid dynamics and heat transfer:\n\n1.  **Inlet Port:** Serves as the entry point for the pressurized coolant into the system.\n2.  **Inlet Chamber:** A plenum that distributes the incoming coolant uniformly to the subsequent orifices.\n3.  **Plurality of Orifices:** These are the critical elements. They are precisely sized and positioned channels that fluidly connect the inlet chamber to the outlet chamber. Their primary function is to transform the bulk coolant flow into high-velocity, localized jet streams.\n4.  **Outlet Chamber:** Collects the coolant after it has performed its cooling function and directs it out of the module.\n5.  **Outlet Port:** The exit point for the heated coolant, typically leading back to a cooling loop (e.g., a pump and radiator/chiller system).\n\n**Implementation Details and Algorithm Specifics (Heat Transfer):**\nThe core principle of heat transfer employed by this technology is **direct jet impingement cooling**. When pressurized coolant (e.g., deionized water, fluorocarbons, or other dielectric fluids) is fed into the inlet chamber, the pressure differential forces it through the array of orifices. This process accelerates the fluid, forming distinct, high-momentum jet streams.\n\nThese jet streams are directed perpendicularly (or at a carefully optimized angle) against the specific 'surface to be cooled,' which is the active surface of the semiconductor die. The high velocity of the impinging jets creates a very thin boundary layer and induces strong turbulence at the point of impact. This localized turbulence and high fluid velocity significantly enhance the convective heat transfer coefficient, leading to highly efficient removal of heat from the chip surface.\n\nFor 2D architectures, the orifices can be strategically placed to target known hot spots. For 3D architectures, this precision becomes even more vital. The design could potentially allow for inter-layer cooling, where coolant channels or micro-orifices are integrated between stacked die layers, addressing the complex thermal pathways inherent in 3D ICs. The coolant then spreads radially from the impingement points, collects in the outlet chamber, and exits, carrying away the absorbed thermal energy.\n\n**Integration Patterns and Performance Characteristics:**\nIntegration of this system would involve designing the heat sink module as an integral part of the microprocessor package, potentially replacing traditional IHS (Integrated Heat Spreader) and air cooler combinations. The fluidic connections would need to be robust and leak-proof, capable of handling pressurized coolant. The system would require an external pump and a heat exchanger (radiator/chiller) to circulate and re-cool the fluid.\n\nPerformance characteristics are expected to be significantly superior to conventional methods:\n*   **High Heat Flux Dissipation:** Capable of dissipating extremely high heat fluxes (e.g., >200 W/cm²) far exceeding what air cooling can manage.\n*   **Precise Temperature Control:** Enables tight control over the semiconductor die temperature, minimizing temperature gradients across the chip surface and preventing localized hot spots.\n*   **Reduced Thermal Resistance:** The direct nature of cooling minimizes thermal resistance between the heat source and the coolant.\n*   **Sustained Performance:** By maintaining optimal temperatures, the system virtually eliminates thermal throttling, allowing microprocessors to run at their maximum rated frequencies continuously.\n*   **Compactness:** Liquid cooling solutions, especially those with integrated heat sinks, can lead to more compact system designs compared to bulky air coolers.\n\n**Code-Level Implications:**\nWhile this patent is hardware-centric, its implications for software and firmware are significant. With more stable and predictable thermal performance, operating systems and application schedulers can be optimized to fully utilize available CPU/GPU cycles without needing to implement aggressive thermal management policies that throttle performance. This could simplify power management algorithms and allow for more consistent performance benchmarking. Furthermore, the ability to operate at higher sustained power levels could open doors for more aggressive overclocking or higher base clock frequencies in production hardware, directly impacting the performance capabilities exposed to software developers.","business_analysis":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent (US-9852963) represents a critical innovation poised to significantly impact several high-growth industries. As computing power demands continue to surge, particularly for Artificial Intelligence (AI), Machine Learning (ML), High-Performance Computing (HPC), and advanced data analytics, the challenge of efficiently dissipating heat from increasingly dense and powerful microprocessors has become a major bottleneck. This patent offers a sophisticated solution with substantial commercial implications.\n\n**Market Opportunity Size:**\nThe global data center cooling market alone is projected to reach tens of billions of dollars in the coming years, with liquid cooling segments showing the highest growth rates. The market for high-performance processors (CPUs, GPUs, AI accelerators) is also expanding rapidly. This invention targets a crucial intersection of these markets, offering a superior thermal solution for components that are at the heart of this growth. The market opportunity extends beyond data centers to include professional workstations, high-end gaming, edge computing devices, and potentially even specialized consumer electronics where thermal management is paramount for performance.\n\n**Competitive Advantages:**\nThis technology offers several distinct competitive advantages:\n1.  **Superior Thermal Efficiency:** Direct jet impingement cooling provides significantly higher heat transfer coefficients compared to traditional air cooling or even generic cold plate liquid cooling. This allows for the dissipation of much higher heat fluxes, enabling processors to operate at peak performance without throttling.\n2.  **Precision and Localization:** The ability to direct coolant jets precisely onto specific hot spots on the semiconductor die (including 2D and 3D architectures) ensures optimal temperature uniformity and prevents localized overheating, a common issue with less targeted methods.\n3.  **Performance Unleashed:** By effectively managing heat, this innovation allows microprocessors to sustain maximum clock speeds and power levels, directly translating to higher computational throughput and faster task completion for demanding applications.\n4.  **Enhanced Reliability and Longevity:** Reducing thermal stress on chips leads to increased hardware reliability, fewer failures, and extended product lifespans, which translates into lower total cost of ownership (TCO) for end-users and reduced warranty claims for manufacturers.\n5.  **Density and Footprint Optimization:** More efficient heat removal allows for higher power density in server racks and compact devices, optimizing valuable data center real estate and enabling smaller form factors for high-performance edge devices.\n\n**Revenue Potential and Business Models:**\nRevenue potential for this technology could be realized through several business models:\n*   **Licensing:** Semiconductor manufacturers, data center solution providers, and OEM component suppliers could license the patent for integration into their next-generation products.\n*   **Integrated Solutions:** Development and sale of integrated microprocessor-cooling modules or complete server solutions incorporating this technology.\n*   **Specialized Cooling Systems:** Manufacturing and selling the heat sink modules as standalone components for system integrators.\n\n**Strategic Positioning:**\nCompanies adopting this technology can strategically position themselves as leaders in high-performance computing, offering solutions that outperform competitors hampered by thermal limitations. This could be a key differentiator in bids for large-scale AI projects, government contracts for supercomputing, and the competitive gaming hardware market. It enables a 'performance-first, no-compromise' product strategy.\n\n**ROI Projections:**\nFor data center operators, the ROI could be substantial, driven by:\n*   **Reduced Energy Costs:** Significant savings on cooling electricity (e.g., 20-40% reduction in cooling energy).\n*   **Increased Revenue per Rack:** Higher computational density means more services can be hosted per rack, increasing revenue potential from existing physical infrastructure.\n*   **Lower Maintenance & Replacement Costs:** Extended hardware lifespan reduces capital expenditure on replacement parts and operational costs associated with downtime.\n*   **Enhanced Service Level Agreements (SLAs):** Consistent performance allows for more aggressive SLAs, potentially commanding higher prices for cloud services.\n\nIn essence, the Microprocessor Assembly Adapted for Fluid Cooling is not just a technical improvement; it's an economic enabler. It addresses a fundamental physical barrier to computational progress, unlocking new levels of performance and efficiency that will drive the next wave of technological advancement across numerous industries.","faqs":[{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** (US-9852963) is an innovative patent describing a advanced thermal management system for semiconductor dies. At its core, this invention focuses on a microprocessor assembly that incorporates a specialized heat sink module designed for direct fluid cooling.\n\nThis technology addresses the critical challenge of heat dissipation in modern, high-performance microprocessors, including those with complex two-dimensional and three-dimensional circuit architectures. By moving beyond traditional air-cooling methods, the patent introduces a highly efficient and targeted approach to maintain optimal operating temperatures for computer chips.\n\nEssentially, it's a sophisticated system that uses liquid to cool microprocessors with unprecedented precision and effectiveness, ensuring sustained performance and enhanced reliability for demanding computational tasks.","question":"What is Microprocessor Assembly Adapted for Fluid Cooling?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** operates on the principle of direct jet impingement cooling. Here's a breakdown of its mechanism:\n\nFirst, a semiconductor die, which is the heat-generating component, is mounted on a substrate and placed in direct thermal communication with a specially designed heat sink module. This module is the heart of the cooling system.\n\nSecond, pressurized coolant (a liquid like deionized water or a dielectric fluid) is delivered to an 'inlet chamber' within the heat sink module. From this chamber, the coolant is forced through a 'plurality of orifices' – these are tiny, precisely engineered holes.\n\nThird, as the coolant exits these orifices, it forms high-velocity 'jet streams.' These jets are directed specifically against the surface of the semiconductor die that needs cooling, providing highly localized and efficient heat transfer. The direct impact of these jets creates turbulence, which is highly effective at stripping away heat.\n\nFinally, the now-warmed coolant collects in an 'outlet chamber' and exits the module via an 'outlet port,' typically to be recirculated and re-cooled by an external system. This continuous cycle ensures that the semiconductor die temperature is consistently controlled during operation.","question":"How does Microprocessor Assembly Adapted for Fluid Cooling work?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent primarily solves the escalating problem of heat generation in modern microprocessors. As computer chips become more powerful, denser, and integrate advanced 2D and 3D architectures, they generate immense amounts of heat. This heat poses several critical problems:\n\nFirstly, excessive heat leads to 'thermal throttling,' where the chip automatically slows down its operations to prevent damage. This means users and systems don't get the full performance potential of their expensive hardware.\n\nSecondly, high and fluctuating temperatures significantly reduce the reliability and lifespan of semiconductor components. Thermal stress can lead to premature failures, increasing maintenance costs and downtime.\n\nThirdly, for large-scale computing environments like data centers, managing this heat with traditional air cooling is incredibly energy-intensive and expensive, consuming a large portion of operational budgets. The Microprocessor Assembly Adapted for Fluid Cooling offers a solution that addresses these performance, reliability, and cost issues by providing highly efficient and precise thermal management.","question":"What problem does Microprocessor Assembly Adapted for Fluid Cooling solve?"},{"answer":"The patent **Microprocessor Assembly Adapted for Fluid Cooling** (US-9852963) was filed by inventors whose names are not provided in the prompt data. The assignee, or the entity to whom the patent rights are assigned, is also not specified in the provided information.\n\nTypically, the inventors are the individuals who conceived the inventive subject matter, while the assignee is usually a company or organization that employs the inventors or purchases the rights to the invention. Without this information, specific names cannot be provided.\n\nHowever, the innovation itself, as described in the patent, reflects deep expertise in thermal engineering, fluid dynamics, and semiconductor design, indicative of a team focused on solving critical challenges in high-performance computing.","question":"Who invented Microprocessor Assembly Adapted for Fluid Cooling?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** offers several significant benefits that address critical limitations in modern computing:\n\n1.  **Sustained Peak Performance:** By effectively controlling the semiconductor die temperature, this technology virtually eliminates thermal throttling. This means microprocessors can operate at their maximum clock frequencies and power levels continuously, leading to higher sustained computational throughput for demanding applications like AI, HPC, and gaming.\n\n2.  **Enhanced Reliability and Lifespan:** Maintaining optimal and consistent operating temperatures reduces thermal stress on the chip. This minimizes component degradation and failure, extending the mean time between failures (MTBF) and overall product longevity, which translates to lower total cost of ownership.\n\n3.  **Increased Energy Efficiency:** Direct fluid cooling is significantly more efficient than air cooling. This can lead to substantial reductions in energy consumption for cooling infrastructure, especially in data centers, resulting in lower operational costs.\n\n4.  **Higher Density and Smaller Footprint:** More efficient heat removal allows for higher power densities in server racks and enables the design of more compact, yet powerful, computing devices. This optimizes valuable real estate in data centers and allows for thinner, more capable consumer electronics.\n\n5.  **Future-Proofing for Advanced Architectures:** The system is explicitly designed to handle both 2D and complex 3D circuit architectures, making it well-suited for the thermal demands of next-generation microprocessors and advanced packaging technologies.","question":"What are the key benefits of Microprocessor Assembly Adapted for Fluid Cooling?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** distinguishes itself from prior art thermal management solutions primarily through its unique direct jet impingement mechanism and precision:\n\n1.  **Vs. Air Cooling:** Traditional air cooling (fans and heat sinks) relies on the low thermal conductivity of air. This patent's fluid-based approach offers vastly superior heat transfer capabilities, effectively dissipating much higher heat fluxes that air cooling simply cannot handle, especially for modern high-power chips.\n\n2.  **Vs. Cold Plate Liquid Cooling (Indirect):** While cold plates use liquid, they typically cool the Integrated Heat Spreader (IHS) of a chip, which then cools the die. This involves multiple thermal interface layers, adding resistance. This invention uses direct jet streams impinging *directly* on the semiconductor die, eliminating these intermediate resistances and providing much more efficient, localized heat removal.\n\n3.  **Vs. Immersion Cooling:** Immersion cooling involves submerging components or entire systems in a dielectric fluid. While effective overall, it can be complex to implement, costly, and makes maintenance challenging. The Microprocessor Assembly Adapted for Fluid Cooling offers a more integrated, localized, and potentially less infrastructure-intensive solution by focusing cooling at the chip level rather than the entire system.\n\n4.  **Precision and Targeting:** The key differentiator is the 'plurality of orifices' creating targeted 'jet streams.' This allows for surgical precision in cooling specific hot spots on the die, a capability often lacking in more generalized liquid or spray cooling methods, making it highly effective for complex 2D and 3D chip architectures.","question":"How is Microprocessor Assembly Adapted for Fluid Cooling different from prior art?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent is poised to have a transformative impact across a wide range of industries that rely on high-performance computing:\n\n1.  **Data Centers and Cloud Computing:** This is perhaps the most significant immediate impact. The technology will enable denser server racks, reduce massive energy consumption for cooling, and ensure sustained peak performance for cloud services, AI training, and big data analytics.\n\n2.  **Artificial Intelligence (AI) and Machine Learning (ML):** AI accelerators and GPUs, known for their high heat output, will benefit immensely. Faster and more reliable cooling will accelerate AI model training, inference, and overall research and development in AI.\n\n3.  **High-Performance Computing (HPC):** Supercomputers and scientific research facilities will be able to push computational boundaries further, enabling more complex simulations and discoveries in fields like climate modeling, drug discovery, and astrophysics.\n\n4.  **Gaming and Consumer Electronics:** High-end gaming PCs, laptops, and consoles will be able to run demanding titles at higher frame rates and resolutions without thermal throttling, offering a superior user experience. It could also enable more powerful and thinner mobile devices.\n\n5.  **Edge Computing:** As more processing moves closer to the data source, the ability to efficiently cool powerful chips in compact, often challenging environments will be crucial for industrial IoT, autonomous vehicles, and smart infrastructure.","question":"What industries will Microprocessor Assembly Adapted for Fluid Cooling impact?"},{"answer":"The patent for **Microprocessor Assembly Adapted for Fluid Cooling** (US-9852963) has a specific timeline for its filing and publication:\n\n**Filing Date:** The patent application was filed on **September 24, 2015**.\n\n**Publication Date:** The patent was subsequently published (granted) on **December 26, 2017**.\n\nThese dates mark the official record of the intellectual property. The filing date establishes the priority date of the invention, meaning it's the date from which the invention is considered novel. The publication date signifies when the patent was officially granted and its details made public, providing legal protection for the disclosed technology. This timeline indicates a relatively swift examination and granting process, often characteristic of innovations addressing pressing industry needs.","question":"When was Microprocessor Assembly Adapted for Fluid Cooling filed/granted?"},{"answer":"The commercial applications of the **Microprocessor Assembly Adapted for Fluid Cooling** are diverse and far-reaching, primarily driven by its ability to unlock unprecedented levels of performance and efficiency in computing hardware:\n\n1.  **High-Density Server Racks:** Data center operators can deploy servers with significantly higher computational power per rack unit, maximizing their physical footprint and reducing infrastructure costs. This is crucial for cloud service providers and hyperscalers.\n\n2.  **Next-Generation AI Accelerators:** Manufacturers of GPUs and specialized AI chips can integrate this cooling solution to ensure their products deliver sustained peak performance for AI training and inference, appealing to enterprise and research clients.\n\n3.  **Gaming and Professional Workstations:** High-end gaming PC builders and workstation manufacturers can offer systems that provide stable, maximum performance without thermal throttling, a key selling point for enthusiasts and professionals.\n\n4.  **Compact, Powerful Edge Devices:** The ability to cool powerful chips in smaller form factors will enable the development of more capable edge computing devices for applications like autonomous vehicles, industrial automation, and smart city infrastructure.\n\n5.  **Specialized Computing Modules:** The technology could be licensed for use in custom computing modules for aerospace, defense, or scientific instruments where performance and reliability in constrained environments are paramount. Its precision and efficiency make it ideal for any application where heat is a limiting factor for high-performance processors.","question":"What are the commercial applications of Microprocessor Assembly Adapted for Fluid Cooling?"},{"answer":"The **Microprocessor Assembly Adapted for Fluid Cooling** patent lays a robust foundation, and future developments are likely to build upon its core principles to further enhance efficiency and applicability:\n\n1.  **Integration with Two-Phase Cooling:** Expect research into combining direct jet impingement with two-phase cooling (boiling and condensation). Leveraging the latent heat of vaporization could enable even higher heat flux dissipation, pushing thermal limits further.\n\n2.  **Adaptive Cooling Systems:** Future iterations might incorporate sensors and intelligent control algorithms to dynamically adjust coolant flow rates and jet patterns based on real-time thermal maps of the semiconductor die. This would optimize energy consumption and cooling precisely where and when needed.\n\n3.  **Advanced Coolant Chemistries:** Development of new dielectric fluids with improved thermal properties, lower environmental impact, and enhanced material compatibility will be crucial for broader adoption and sustainability.\n\n4.  **Microfluidic Integration at Die Level:** For 3D stacked ICs, future developments could involve integrating microfluidic channels and jet impingement structures directly within the inter-die layers, providing truly embedded and ultra-efficient cooling for multi-chip modules.\n\n5.  **Standardization and Modularity:** As the technology matures, efforts will likely focus on standardization of interfaces and modular designs to facilitate easier integration into various computing platforms, from server racks to consumer electronics. This will drive down costs and accelerate adoption across industries. The Microprocessor Assembly Adapted for Fluid Cooling will continue to evolve as a cornerstone of next-generation computing.","question":"What are the future developments expected for Microprocessor Assembly Adapted for Fluid Cooling?"}],"topics":["Microprocessor Assembly Adapted for Fluid Cooling","fluid cooling","chip cooling","thermal management","semiconductor cooling","incessant","drive","towards"],"tech_cluster":null},"seo":{"title":"Microprocessor Assembly Adapted for Fluid Cooling - Patent US-9852963","description":"Discover the groundbreaking Microprocessor Assembly Adapted for Fluid Cooling patent. Featuring direct jet impingement for superior chip thermal management, boosting performance and reliability.","keywords":["Microprocessor Assembly Adapted for Fluid Cooling","fluid cooling","chip cooling","thermal management","semiconductor cooling","jet impingement","high-performance computing","3D IC cooling","patent US-9852963","data center cooling"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852963","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852963","citation_suggestion":"Patentable. \"Microprocessor assembly adapted for fluid cooling\" (US-9852963). https://patentable.app/patents/US-9852963","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852963","json":"https://patentable.app/api/llm-context/US-9852963","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:35:55.112Z"}