{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852964","patent":{"patent_number":"US-9852964","title":"Through-body via formation techniques","assignee":null,"inventors":[],"filing_date":"2014-03-24T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":25,"abstract":"Techniques are disclosed for forming a through-body-via (TBV) in a semiconductor die. In accordance with some embodiments, a TBV provided using the disclosed techniques includes a polymer-based barrier layer and an electrically conductive seed layer formed by applying an electrically conductive ink directly to the barrier layer and then curing it in situ. In some embodiments, after curing, the resultant seed layer may be a thin, substantially conformal, electrically conductive metal film over which the TBV interconnect metal can be deposited. In some example cases, a polyimide, parylene, benzocyclobutene (BCB), and/or polypropylene carbonate (PPC) barrier layer and an ink containing copper (Cu) and/or silver (Ag), of nanoparticle-based or metal complex-based formulation, may be used in forming the TBV. In some instances, the disclosed techniques may be used to address poor step coverage, low run rate, and/or high cost issues associated with existing physical vapor deposition (PVD)-based far-back-end-of-line (FBEOL) processes."},"analysis":{"summary":"The Through-body Via Formation Techniques patent (US-9852964) introduces a revolutionary approach to manufacturing through-body vias (TBVs) in semiconductor dies, a critical component for advanced 3D integrated circuits. At its core, this innovation addresses the significant challenges posed by existing physical vapor deposition (PVD)-based methods, which suffer from poor step coverage, low run rates, and high costs in far-back-end-of-line (FBEOL) processes.\n\nThe core innovation of this technology involves two key elements: a polymer-based barrier layer and an electrically conductive seed layer formed by applying an electrically conductive ink directly to this barrier layer, followed by in-situ curing. This direct application and curing process results in a thin, substantially conformal, electrically conductive metal film, which serves as an ideal foundation for subsequent deposition of the TBV interconnect metal.\n\nSpecific embodiments detail the use of various polymer materials for the barrier layer, such as polyimide, parylene, benzocyclobutene (BCB), or polypropylene carbonate (PPC). For the conductive ink, formulations containing copper (Cu) and/or silver (Ag), either nanoparticle-based or metal complex-based, are employed. These material choices and the novel process flow ensure superior electrical performance and mechanical integrity of the vias.\n\nFrom a business perspective, this patent offers substantial value by significantly reducing manufacturing costs and improving the efficiency of TBV production. It opens up greater market opportunities for 3D ICs and advanced packaging solutions, enabling higher yields and faster time-to-market for next-generation electronic devices. The market for advanced packaging is rapidly expanding, and this innovation provides a competitive edge for companies seeking to lead in this space. This approach promises to accelerate the adoption of high-performance computing, AI, and mobile technologies by making their foundational components more accessible and reliable.","layman_explanation":"### What Problem Does This Solve?\n\nImagine building a skyscraper, but instead of just stacking floors, you need to run tiny, super-fast elevators vertically through every single floor to connect them all. In the world of advanced computer chips, these 'elevators' are called Through-Body Vias (TBVs). They are crucial for making chips smaller, faster, and more powerful by allowing them to be stacked on top of each other, creating 3D Integrated Circuits (3D ICs).\n\nThe old way of making these tiny elevators was like trying to paint the inside of a very narrow, tall pipe with a spray can. It was expensive, slow, and often resulted in an uneven coating, making the 'elevator shaft' wobbly or unreliable. This led to high manufacturing costs, slow production, and sometimes faulty chips, which was a huge bottleneck for companies trying to build the next generation of smartphones, AI processors, and data centers.\n\n### How Does It Work?\n\nThe **Through-body Via Formation Techniques** patent introduces a clever new way to build these crucial connections. Instead of the 'spray painting' method, think of it more like a precision art project:\n\n1.  **Preparation with a Special Liner:** First, after the tiny 'holes' (vias) are made in the chip, a special, super-smooth, non-conductive 'liner' (called a polymer-based barrier layer) is applied to the inside of these holes. Imagine lining your tiny pipe perfectly with a smooth, insulating plastic film. This liner ensures electrical isolation and creates a perfect surface for the next step.\n2.  **Magic Conductive Ink:** Next, instead of using a complex, expensive vacuum process, a special 'magic ink' is used. This ink is electrically conductive and can contain tiny particles of metals like copper or silver. This ink is precisely applied directly onto the smooth polymer liner inside the via. Think of it like using a very fine pen to draw a perfect, even, conductive line inside your pipe.\n3.  **Instant Curing:** Once the ink is applied, it's quickly 'baked' or 'cured' on the spot (this is 'in-situ curing'). This process transforms the liquid ink into a solid, super-thin, perfectly even, and highly conductive metal layer. This new metal layer acts as the perfect starter base (a 'seed layer') for the final, bulk metal to be deposited, completing the robust 'elevator shaft'.\n\nThis approach is like having a custom-designed, fast-drying, perfectly adhering paint for those tiny pipes, making the process much more efficient and reliable.\n\n### Why Does This Matter?\n\nThis innovation matters immensely for several reasons:\n\n*   **Cost Savings:** By replacing expensive, energy-intensive traditional equipment and processes with a simpler, more direct method, manufacturers can significantly reduce the cost of producing each chip. This means more affordable high-tech devices for consumers and better profit margins for companies.\n*   **Faster Production:** The new method is much quicker, allowing chip factories to produce more chips in less time. This helps companies bring new, powerful products to market faster, gaining a competitive edge and meeting consumer demand for cutting-edge technology.\n*   **Better, More Reliable Chips:** The 'magic ink' method creates smoother, more consistent connections, reducing the chances of defects. This leads to more reliable chips that perform better and last longer, enhancing the quality of everything from your smartphone to advanced AI servers.\n*   **Unlocking New Possibilities:** By making 3D ICs easier and cheaper to produce, this patent helps unleash the full potential of next-generation electronics. It supports advancements in artificial intelligence, high-performance computing, augmented reality, and more, pushing the boundaries of what technology can do.\n\n### What's Next?\n\nThis patent lays the groundwork for a new era in semiconductor manufacturing. We can expect to see widespread adoption of these Through-body Via Formation Techniques in factories producing advanced 3D ICs. This will likely lead to a new wave of innovative products that are smaller, faster, and more energy-efficient than ever before. For investors, this represents a significant opportunity in companies that either hold the patent, license the technology, or develop the specialized materials and equipment needed for this new process, as it promises substantial returns on investment by solving a critical industry challenge.","technical_analysis":"The Through-body Via Formation Techniques patent (US-9852964) details a sophisticated methodology for creating through-body vias (TBVs) in semiconductor dies, specifically targeting the limitations of traditional far-back-end-of-line (FBEOL) processes. The fundamental technical problem addressed is the difficulty in achieving high-quality, cost-effective, and high-throughput seed layer deposition for TBVs, particularly in high aspect ratio structures where physical vapor deposition (PVD) struggles.\n\n**Technical Architecture and Process Flow:**\n\nThe core of this innovation lies in a two-stage deposition process that replaces conventional PVD: a polymer-based barrier layer followed by a directly applied, curable electrically conductive ink. The process flow can be broadly outlined as:\n\n1.  **Via Formation:** Initial etching or drilling of vias through the semiconductor die, typically using standard lithographic and etching techniques, creating the desired high aspect ratio openings.\n2.  **Polymer-Based Barrier Layer Deposition:** A dielectric polymer material is applied to line the sidewalls and bottom of the formed vias. The patent specifies suitable polymers such as polyimide, parylene, benzocyclobutene (BCB), and polypropylene carbonate (PPC). These materials are chosen for their excellent dielectric properties, thermal stability, and adhesion characteristics. Deposition methods can include spin-coating, spray coating, chemical vapor deposition (CVD), or atomic layer deposition (ALD), ensuring a conformal and pinhole-free insulating layer.\n3.  **Electrically Conductive Ink Application:** This is a critical departure from prior art. Instead of PVD, an electrically conductive ink is applied directly onto the polymer barrier layer. The patent describes two primary types of ink formulations:\n    *   **Nanoparticle-based formulations:** These inks contain metal nanoparticles (e.g., copper (Cu) and/or silver (Ag) nanoparticles) dispersed in a solvent with binders. Upon application, the solvent evaporates, and subsequent curing leads to the sintering of nanoparticles, forming a continuous metallic film.\n    *   **Metal complex-based formulations:** These inks contain organometallic precursors of copper or silver. During the curing process, these precursors decompose, leaving behind a pure metal film.\n    The application method for the ink can be highly flexible, including inkjet printing, spray coating, dispensing, or screen printing, allowing for precise and selective deposition.\n4.  **In-situ Curing:** Following ink application, the material is cured in situ. This step is crucial for transforming the liquid ink into a solid, electrically conductive metal film. Curing can involve thermal annealing, UV exposure, or other energy sources, depending on the specific ink formulation. The in-situ nature ensures that the seed layer is formed directly within the via, minimizing post-processing steps and potential contamination. The resultant film is described as thin, substantially conformal, and electrically conductive, providing an excellent base for subsequent electroplating.\n5.  **TBV Interconnect Metal Deposition:** Once the conductive seed layer is established, the final TBV interconnect metal (typically copper) is deposited, usually via electroplating, to fill the via and form the complete vertical electrical connection.\n\n**Technical Innovations and Advantages:**\n\n*   **Superior Step Coverage:** The liquid nature of the conductive ink and its direct application methods (e.g., inkjet, spray) inherently provide better conformality within high aspect ratio vias compared to the line-of-sight limitations of PVD. This minimizes voids and ensures a more uniform and reliable seed layer.\n*   **Enhanced Throughput:** Eliminating the vacuum and batch processing requirements of PVD significantly reduces cycle times and increases the overall run rate for TBV formation, accelerating production.\n*   **Cost Efficiency:** The capital cost of ink application and curing equipment is generally lower than PVD systems. Furthermore, material utilization can be more efficient, reducing waste and overall manufacturing expenses.\n*   **Material Science Optimization:** The flexibility in choosing various polymer barrier materials and tailoring ink formulations (nanoparticle vs. metal complex) allows for fine-tuning electrical, mechanical, and adhesion properties to meet specific device requirements.\n*   **Addressing FBEOL Challenges:** This system directly tackles the persistent issues of poor step coverage, low run rates, and high costs that plague existing PVD-based FBEOL processes, making it highly relevant for advanced 3D IC packaging.\n\n**Performance Characteristics and Implications:**\n\nThe disclosed techniques promise TBVs with reduced electrical resistance due to improved conformality and material purity. The enhanced reliability stems from fewer defects like voids, which can lead to open circuits or increased resistance over time. The process is scalable for high-volume manufacturing, crucial for the widespread adoption of 3D ICs in applications ranging from high-performance computing to consumer electronics. This innovation provides a robust, alternative pathway for creating critical vertical interconnects, fostering greater design flexibility and accelerating the miniaturization and integration trends in microelectronics.","business_analysis":"The Through-body Via Formation Techniques patent (US-9852964) represents a significant business opportunity within the rapidly expanding semiconductor and advanced packaging industries. This innovation directly addresses critical bottlenecks in the manufacturing of through-body vias (TBVs) for 3D integrated circuits (3D ICs), offering compelling advantages in cost, efficiency, and performance.\n\n**Market Opportunity Size:**\n\nThe global semiconductor packaging market is projected to reach well over $50 billion by the mid-2020s, with advanced packaging segments like 3D ICs and chiplets being key growth drivers. TBVs are fundamental to these advanced architectures, enabling higher transistor density, shorter interconnects, and improved power efficiency. Any technology that can streamline TBV formation directly taps into this massive and growing market. The demand for compact, high-performance computing solutions in AI, IoT, automotive, and high-end mobile devices will continue to fuel the need for efficient 3D packaging, making this patent highly relevant.\n\n**Competitive Advantages:**\n\nThis patent provides several distinct competitive advantages over existing methods, primarily physical vapor deposition (PVD):\n\n1.  **Cost Reduction:** By replacing capital-intensive PVD equipment and its associated high operational costs (vacuum, energy, target materials) with a polymer-based barrier and conductive ink application, the invention promises substantial reductions in manufacturing expenses per TBV. This cost-effectiveness can be a game-changer for companies operating on thin margins or seeking to make 3D ICs more accessible.\n2.  **Improved Throughput and Yield:** The elimination of slow, batch-oriented PVD processes and the adoption of faster, in-situ curing ink application significantly boosts production run rates. Simultaneously, the superior step coverage provided by the ink-based method reduces defects and improves overall manufacturing yield, leading to higher output and lower waste.\n3.  **Enhanced Performance and Reliability:** Better step coverage translates directly to more uniform and robust TBVs, leading to improved electrical performance (lower resistance) and enhanced long-term reliability of the 3D ICs. This is a critical differentiator in high-performance and mission-critical applications.\n4.  **Process Flexibility:** The ability to select from various polymer barrier materials and tailor ink formulations (nanoparticle or metal complex, Cu/Ag) offers manufacturers greater flexibility in optimizing the process for specific product requirements and material compatibility.\n\n**Revenue Potential and Business Models:**\n\nThe revenue potential for this technology is multi-faceted:\n\n*   **Licensing:** The patent holder can license the Through-body Via Formation Techniques to major semiconductor manufacturers, foundries (fabs), and OSAT (Outsourced Semiconductor Assembly and Test) providers, generating significant royalty income.\n*   **Equipment Sales:** Developing and selling specialized equipment for polymer barrier application, conductive ink dispensing/spraying, and in-situ curing could establish a new revenue stream for equipment manufacturers.\n*   **Material Sales:** Companies specializing in advanced materials could develop and supply the specific polymer barrier precursors and conductive ink formulations (e.g., Cu/Ag nanoparticle inks) required by this process.\n*   **In-house Manufacturing Advantage:** For integrated device manufacturers (IDMs), implementing this technology in their own fabs would provide a direct competitive advantage through lower costs and higher performance products.\n\n**Strategic Positioning:**\n\nCompanies adopting or licensing this innovation can strategically position themselves as leaders in advanced packaging, capable of delivering next-generation 3D ICs with superior cost-performance ratios. This patent enables a shift from high-cost, niche 3D IC production to more scalable and mainstream adoption, impacting markets from data centers and AI accelerators to premium consumer electronics.\n\n**ROI Projections:**\n\nWhile specific ROI depends on implementation scale, the potential for significant returns is clear. A 30% reduction in TBV manufacturing costs, coupled with a 2-3x increase in throughput and improved yields, could translate into millions, if not billions, in savings and increased revenue for major players. Faster time-to-market for advanced products further enhances ROI by capturing early market share and premium pricing. This invention offers a compelling value proposition for investment and adoption, promising to reshape the economics of advanced semiconductor manufacturing.","faqs":[{"answer":"The **Through-body Via Formation Techniques** patent (US-9852964) describes a set of innovative methods for creating through-body vias (TBVs) in semiconductor dies. TBVs are tiny, vertical electrical connections that pass through a silicon wafer or chip, enabling the stacking of multiple chips to form 3D integrated circuits (3D ICs). This technology is crucial for making electronic devices smaller, faster, and more powerful.\n\nUnlike traditional approaches that often rely on expensive and complex physical vapor deposition (PVD) processes, this patent introduces a more efficient and cost-effective solution. It focuses on using a polymer-based barrier layer combined with a directly applied, curable electrically conductive ink.\n\nThe core idea is to simplify and improve the creation of the 'seed layer'—a thin conductive film that serves as the foundation for the final metal filling of the via. By addressing the limitations of existing methods, this innovation aims to accelerate the production and reduce the cost of advanced semiconductor devices, pushing the boundaries of what's possible in electronics manufacturing.\n\nEssentially, it's a new recipe for building the vital internal connections that power our most advanced gadgets, making them better and more accessible. Keywords: TBV, 3D IC, semiconductor manufacturing, conductive ink, polymer barrier, US-9852964.","question":"What is Through-body Via Formation Techniques?"},{"answer":"The **Through-body Via Formation Techniques** patent outlines a two-primary-step process that deviates significantly from conventional methods. First, after the initial holes (vias) are etched into the semiconductor die, a polymer-based barrier layer is applied. This layer serves as an electrical insulator and provides a smooth, receptive surface for the subsequent materials.\n\nSecond, an electrically conductive ink is directly applied onto this polymer barrier layer. This ink is specially formulated, often containing copper (Cu) or silver (Ag) in nanoparticle or metal complex forms. Following its application, the ink is cured in situ—meaning it hardens and becomes conductive right there within the via. This curing process transforms the liquid ink into a thin, substantially conformal, electrically conductive metal film.\n\nThis newly formed conductive film then acts as a 'seed layer,' providing an ideal base over which the final, bulk TBV interconnect metal (typically copper) can be deposited, usually via electroplating. The direct application and in-situ curing of the ink solve issues like poor step coverage and slow processing rates associated with older techniques, leading to more reliable and cost-effective TBVs. Keywords: TBV process, conductive ink, polymer barrier, in-situ curing, seed layer, semiconductor fabrication.","question":"How does Through-body Via Formation Techniques work?"},{"answer":"The **Through-body Via Formation Techniques** patent primarily solves several critical problems inherent in existing physical vapor deposition (PVD)-based far-back-end-of-line (FBEOL) processes for forming through-body vias (TBVs). These issues have been significant bottlenecks in the mass production of advanced 3D integrated circuits (3D ICs).\n\nSpecifically, the invention addresses:\n\n1.  **Poor Step Coverage:** Traditional PVD struggles to uniformly coat the high aspect ratio sidewalls of deep, narrow vias, leading to thin spots or voids. This compromises the electrical integrity and reliability of the TBV.\n2.  **Low Run Rate:** PVD is often a batch process that requires high vacuum, resulting in slow processing times and hindering manufacturing throughput.\n3.  **High Cost:** PVD equipment is capital-intensive, and its operational costs (energy, vacuum maintenance, target materials) are substantial, driving up the overall cost of 3D IC production.\n\nBy offering a more conformal, faster, and less expensive method for creating the electrically conductive seed layer, this innovation removes these barriers, enabling more efficient, reliable, and cost-effective manufacturing of advanced semiconductor devices. Keywords: PVD limitations, TBV challenges, step coverage, manufacturing cost, run rate, 3D IC bottleneck.","question":"What problem does Through-body Via Formation Techniques solve?"},{"answer":"The patent data provided does not list the specific inventors for **Through-body Via Formation Techniques** (US-9852964). However, patents are typically the result of extensive research and development efforts by teams of engineers and scientists within companies or research institutions. The absence of inventor names in this specific data snippet is not uncommon in public summaries, as the focus is often on the technology itself and its assignee.\n\nPatents like this are crucial intellectual property assets that protect the inventive work behind new technologies. They represent significant investments in R&D, often by leading organizations in the semiconductor industry, to overcome complex technical challenges and push the boundaries of electronic device capabilities. The innovation embodied in this patent contributes to the collective knowledge base of the industry, regardless of the individual names of its creators. Keywords: patent inventors, US-9852964, semiconductor R&D, intellectual property, innovation teams.","question":"Who invented Through-body Via Formation Techniques?"},{"answer":"The **Through-body Via Formation Techniques** patent offers several significant benefits that can revolutionize semiconductor manufacturing and the broader electronics industry:\n\n1.  **Reduced Manufacturing Costs:** By replacing expensive PVD equipment and processes with more cost-effective polymer and conductive ink application methods, this innovation can substantially lower the per-unit cost of producing through-body vias (TBVs). This makes advanced 3D ICs more economically viable.\n2.  **Increased Throughput and Efficiency:** The direct application and in-situ curing of the conductive ink are much faster than traditional PVD, leading to significantly higher production run rates. This allows manufacturers to produce more chips in less time, accelerating time-to-market for new products.\n3.  **Improved Via Quality and Reliability:** The method achieves superior step coverage, ensuring a more uniform and robust conductive seed layer within the vias. This minimizes defects like voids, leading to more reliable electrical connections and overall higher-performing 3D integrated circuits.\n4.  **Enhanced Material Flexibility:** The ability to choose from various polymer barrier materials (e.g., polyimide, parylene) and conductive ink formulations (e.g., copper or silver nanoparticle-based) allows for greater optimization and customization to meet specific device requirements and integration challenges.\n\nThese benefits collectively position the technology to drive the next wave of innovation in advanced packaging, enabling smaller, faster, and more powerful electronic devices across various sectors. Keywords: TBV benefits, cost reduction, manufacturing efficiency, chip reliability, advanced packaging, material flexibility.","question":"What are the key benefits of Through-body Via Formation Techniques?"},{"answer":"The **Through-body Via Formation Techniques** patent fundamentally differentiates itself from prior art, primarily traditional physical vapor deposition (PVD) methods, in its approach to forming the electrically conductive seed layer within through-body vias (TBVs).\n\n**Prior Art (PVD):**\n*   Relies on a high-vacuum, line-of-sight deposition process, which inherently struggles with poor step coverage in high aspect ratio vias. This often leads to non-uniform films, defects, and compromised reliability.\n*   Is typically a batch process, meaning it's slow and has a low run rate, acting as a bottleneck in high-volume manufacturing.\n*   Involves expensive equipment and high operational costs due to vacuum requirements and energy consumption.\n\n**Through-body Via Formation Techniques:**\n*   **Employs a polymer-based barrier layer:** This acts as an excellent insulator and a superior surface for subsequent layers, a key difference from just bare silicon or other inorganic liners.\n*   **Utilizes direct application of conductive ink:** Instead of PVD, an electrically conductive ink (nanoparticle or metal complex-based Cu/Ag) is applied directly onto the polymer barrier. This liquid-phase deposition offers significantly better conformality and step coverage, virtually eliminating the defects associated with PVD.\n*   **Features in-situ curing:** The ink is cured on the spot, transforming into a robust seed layer without the need for complex, time-consuming vacuum processes.\n\nIn essence, this innovation replaces a costly, slow, and often imperfect vacuum-based physical process with a faster, more precise, and more cost-effective chemical-based deposition, leading to superior TBVs. Keywords: PVD vs. Through-body Via Formation Techniques, prior art, conductive ink technology, step coverage improvement, semiconductor innovation, manufacturing difference.","question":"How is Through-body Via Formation Techniques different from prior art?"},{"answer":"The **Through-body Via Formation Techniques** patent is poised to significantly impact a wide array of industries that rely on advanced semiconductor technology. Its ability to create more efficient, cost-effective, and reliable through-body vias (TBVs) directly translates into better, more accessible electronic devices.\n\nKey industries to be impacted include:\n\n1.  **Consumer Electronics:** Smartphones, tablets, wearables, and smart home devices will benefit from smaller, more powerful, and potentially more affordable 3D integrated circuits (3D ICs), leading to enhanced performance and new functionalities.\n2.  **High-Performance Computing (HPC) & Data Centers:** AI accelerators, graphics processing units (GPUs), and server processors demand extremely high bandwidth and low latency. This technology will enable denser, more efficient 3D ICs for these applications, accelerating data processing and reducing energy consumption.\n3.  **Automotive:** Advanced driver-assistance systems (ADAS), in-car infotainment, and autonomous driving platforms require robust, high-performance, and compact electronics. The improved reliability and cost-effectiveness of TBVs will be crucial here.\n4.  **Internet of Things (IoT):** The proliferation of connected devices demands ultra-small, low-power, and cost-efficient chips. This innovation can facilitate the creation of such devices, expanding the reach of IoT.\n5.  **Aerospace and Defense:** High-reliability and extreme-performance applications in these sectors will benefit from the enhanced integrity and durability of TBVs.\n\nUltimately, any sector leveraging advanced microelectronics for innovation will feel the positive ripple effects of this technology, driving forward the capabilities and accessibility of next-generation devices. Keywords: industry impact, 3D IC applications, consumer electronics, AI, HPC, automotive, IoT, semiconductor market.","question":"What industries will Through-body Via Formation Techniques impact?"},{"answer":"The **Through-body Via Formation Techniques** patent, identified as US-9852964, has specific dates associated with its journey through the intellectual property system.\n\nThe **Filing Date** for this patent was **2014-03-24**. This is the date when the patent application was initially submitted to the patent office, marking the beginning of the examination process and establishing the priority date for the invention.\n\nThe **Publication Date** for this patent was **2017-12-26**. This is the date when the patent was officially published, signifying that the patent office has granted the protection sought by the applicant. From this date, the details of the invention became publicly accessible, and the patent holder gained the exclusive rights associated with the patent for its duration.\n\nThese dates are crucial for understanding the timeline of the innovation, its prior art implications, and the period of its enforceability. The time between filing and publication often reflects the complexity of the invention and the thoroughness of the patent examination process. Keywords: patent filing date, patent publication date, US-9852964, patent timeline, intellectual property, invention history.","question":"When was Through-body Via Formation Techniques filed/granted?"},{"answer":"The commercial applications of the **Through-body Via Formation Techniques** patent are extensive, primarily driven by its ability to make 3D integrated circuits (3D ICs) more cost-effective, efficient, and reliable. This opens up new possibilities for mass production and broader market penetration of advanced electronic devices.\n\nKey commercial applications include:\n\n1.  **High-Density Memory Products:** The patent is highly relevant for manufacturing high-bandwidth memory (HBM) and other stacked memory solutions, which are critical for high-performance computing, AI, and graphics processing units (GPUs). Its efficiency can lower the cost of these premium memory modules.\n2.  **Advanced Processors (CPUs/GPUs/AI Accelerators):** By enabling more efficient 3D stacking of logic and specialized processing units, this technology facilitates the creation of more powerful and compact processors for data centers, servers, and edge AI devices.\n3.  **Miniaturized Consumer Devices:** The ability to create smaller, more integrated chips will lead to even sleeker and more functional smartphones, smartwatches, augmented reality (AR)/virtual reality (VR) headsets, and other portable electronics.\n4.  **Automotive Electronics:** For advanced driver-assistance systems (ADAS), autonomous vehicles, and complex in-car computing, the enhanced reliability and performance of TBVs are crucial, making safer and more sophisticated automotive systems possible.\n5.  **IoT and Edge Devices:** The cost-efficiency and miniaturization benefits will accelerate the development of a vast array of Internet of Things (IoT) devices, enabling more pervasive connectivity and intelligence at the edge.\n\nEssentially, any product that benefits from higher computing density, improved power efficiency, and a smaller form factor can leverage this innovation, making it a foundational technology for future electronic product development. Keywords: commercial applications, 3D ICs, HBM, AI accelerators, consumer electronics, automotive tech, IoT devices, semiconductor market.","question":"What are the commercial applications of Through-body Via Formation Techniques?"},{"answer":"The **Through-body Via Formation Techniques** patent lays a robust foundation for future innovation in semiconductor manufacturing. Based on its core principles, several key developments can be anticipated:\n\n1.  **Material Advancements:** Expect continuous research into novel polymer barrier materials with even better dielectric properties, thermal stability, and adhesion. Similarly, conductive ink formulations will evolve, potentially incorporating new metallic nanoparticles or complex chemistries for enhanced conductivity, lower curing temperatures, or improved environmental profiles.\n2.  **Process Refinement and Integration:** Future efforts will focus on optimizing the deposition techniques for both the polymer barrier and the conductive ink to achieve even finer pitches and higher aspect ratios. Tighter integration with existing FBEOL processes and equipment, potentially through advanced automation and in-line quality control, will be a priority.\n3.  **Hybrid Approaches:** While the patent offers an alternative to PVD, future developments might explore hybrid processes that combine the strengths of ink-based deposition with other techniques (e.g., selective ALD for ultra-thin barriers) to achieve specific performance or cost targets.\n4.  **Scalability to Larger Wafer Sizes:** Adapting these techniques for increasingly larger wafer sizes (e.g., 300mm to 450mm) will be crucial for high-volume manufacturing, requiring advancements in large-area ink dispensing and uniform curing systems.\n5.  **New Application Spaces:** As the technology matures, it may find applications beyond traditional 3D ICs, potentially in flexible electronics, advanced sensors, or novel packaging architectures that demand highly conformal and cost-effective vertical interconnects.\n\nUltimately, the future of this technology will be driven by the relentless demand for more powerful, compact, and energy-efficient electronics, pushing the boundaries of material science and manufacturing engineering. Keywords: future developments, material science, process optimization, hybrid manufacturing, wafer scale, advanced packaging, electronics innovation.","question":"What are the future developments expected for Through-body Via Formation Techniques?"}],"topics":["Through-body Via Formation Techniques","TBV","semiconductor manufacturing","3D IC","conductive ink","intricate","world","semiconductor"],"tech_cluster":null},"seo":{"title":"Through-body Via Formation Techniques - Patent US-9852964","description":"Discover Through-body Via Formation Techniques: a patent revolutionizing TBV creation in semiconductors with conductive ink and polymer barriers, cutting costs and boosting efficiency.","keywords":["Through-body Via Formation Techniques","TBV","semiconductor manufacturing","3D IC","conductive ink","polymer barrier","advanced packaging","FBEOL","PVD alternative","chip manufacturing","US-9852964","patent"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852964","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852964","citation_suggestion":"Patentable. \"Through-body via formation techniques\" (US-9852964). https://patentable.app/patents/US-9852964","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852964","json":"https://patentable.app/api/llm-context/US-9852964","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T05:33:56.352Z"}