{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852966","patent":{"patent_number":"US-9852966","title":"Semiconductor package","assignee":null,"inventors":[],"filing_date":"2016-06-17T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A semiconductor package includes a die pad, a semiconductor die mounted on the die pad, a plurality of leads including a power lead disposed along a peripheral edge of the die pad, at least one connecting bar connecting the die pad, a power bar disposed on one side of the connecting bar, and a surface mount device (SMD) having a first terminal and a second terminal. The first terminal is electrically connected to the ground level through a first bond wire. The second terminal is electrically connected a power level through a second bond wire."},"analysis":{"summary":"The **Semiconductor Package** patent (US-9852966) introduces a groundbreaking design for semiconductor device packaging, directly addressing the critical need for enhanced miniaturization, improved power delivery, and increased electrical stability in modern electronics. At its core, this innovation provides a highly integrated structure that optimizes the connection and functionality of a semiconductor die within its housing.\n\nThe primary problem this patent solves revolves around the limitations of conventional semiconductor packaging, which often struggles with inefficient power routing, significant parasitic effects, and spatial constraints as devices become smaller and more complex. Existing solutions frequently necessitate compromises between package size, electrical performance, and thermal management, leading to design bottlenecks for high-density applications.\n\nThis technical approach centers on a precisely engineered package that includes a die pad for the semiconductor die, an optimized lead frame featuring a power lead along the die pad's edge, and dedicated connecting and power bars. A key differentiating feature is the direct integration of a surface mount device (SMD) within the package. This SMD is electrically connected to both ground and power levels using specific bond wires, establishing a direct and low-impedance path for critical electrical signals. This internal integration significantly reduces external component count and board space, while also mitigating signal noise and improving power supply stability.\n\nThe business value and applications of this technology are substantial. It enables manufacturers to develop more compact, energy-efficient, and reliable electronic devices across various sectors, including consumer electronics (smartphones, wearables), automotive systems, IoT devices, and industrial control units. By enhancing power delivery and integration, this innovation facilitates higher performance within smaller form factors, offering a competitive edge in markets driven by miniaturization and efficiency.\n\nThe market opportunity for this advanced packaging solution is vast, spanning the entire semiconductor industry and its downstream applications. As the demand for sophisticated, compact electronic modules continues to grow, solutions like this patent will become indispensable. It paves the way for next-generation system-in-package (SiP) solutions, driving innovation in product design and manufacturing processes, ultimately leading to superior end-user products and significant ROI for early adopters.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you're building a highly advanced, super-fast miniature city. Each building (a tiny computer chip) needs electricity to run, but running long, messy wires from a distant power plant creates problems. The wires take up too much space, power gets lost along the way, and sometimes the electricity isn't as clean or stable as it should be, causing the buildings to flicker or malfunction. In the world of electronics, this is the challenge with traditional semiconductor packaging. As our devices like smartphones and smartwatches get smaller and more powerful, the existing ways of connecting and powering their internal 'brains' become a bottleneck. They lead to bulkier designs, wasted energy, and less reliable performance.\n\n### How Does It Work?\n\nThe **Semiconductor Package** patent (US-9852966) is essentially a smarter way to build that miniature city's power grid, right within each building's foundation. Instead of external, long wires, this innovation designs the 'foundation' (the chip package) to have its own internal, highly efficient power network. It places the main computer chip on a special base, called a 'die pad'. Around this base, it arranges specialized 'power leads' and 'power bars' that act like super-efficient mini-power lines, bringing electricity directly to the chip with minimal loss.\n\nWhat's truly clever is that this patent also integrates small, crucial electronic components, like tiny capacitors (called 'surface mount devices' or SMDs), directly *inside* the chip's package. These SMDs are connected with very short, dedicated wires to the power and ground. Think of them as tiny, local power stabilizers right next to the chip, ensuring it gets a perfectly clean and steady flow of electricity. This drastically reduces the need for these components to be placed separately on the main circuit board, saving space and improving performance.\n\n### Why Does This Matter?\n\nThis innovation matters because it directly impacts the size, power, and reliability of virtually all modern electronic devices. For businesses, this means:\n\n1.  **Miniaturization:** Products can be made significantly smaller and thinner, opening up new design possibilities for wearables, IoT devices, and medical implants.\n2.  **Performance Boost:** By delivering cleaner, more stable power, the chips can operate faster and more efficiently, leading to better product performance and longer battery life.\n3.  **Cost Efficiency:** Integrating components into the package reduces the need for complex, multi-layer circuit boards and external components, potentially lowering manufacturing costs and simplifying assembly.\n4.  **Competitive Edge:** Companies adopting this technology can differentiate their products by offering superior performance, smaller form factors, and enhanced reliability, gaining a significant advantage in competitive markets.\n\nThis isn't just a technical tweak; it's a strategic enabler for the next generation of electronics, driving innovation and creating new market opportunities.\n\n### What's Next?\n\nThe principles outlined in this patent are likely to become foundational for future semiconductor packaging. We can expect to see more devices leveraging this 'system-in-package' approach, where more functionality is integrated directly into the chip's housing. This will accelerate the trend towards ubiquitous computing, enabling smarter cities, more sophisticated medical devices, and even more immersive consumer experiences. For investors, this signals a clear direction for R&D and manufacturing investment in the semiconductor value chain, focusing on integrated, high-density packaging solutions that deliver tangible business value.","technical_analysis":"The **Semiconductor Package** patent (US-9852966) details a sophisticated architecture designed to optimize the electrical and physical characteristics of semiconductor device packaging. This technical analysis focuses on the core components, their interconnections, and the performance implications for modern electronic systems.\n\n**Technical Architecture:** The invention primarily comprises a die pad, a semiconductor die mounted thereon, and a meticulously designed lead frame. The lead frame includes a plurality of leads, notably a power lead strategically positioned along the peripheral edge of the die pad. This placement is critical for minimizing the electrical path length from the external power source to the die, thereby reducing series resistance and inductance. This reduction is paramount for maintaining voltage stability during high-frequency switching operations and for mitigating power delivery network (PDN) noise.\n\n**Implementation Details:** The patent further specifies at least one connecting bar, which serves as a structural and electrical link to the die pad. Adjacent to this connecting bar, a power bar is disposed. This power bar acts as an internal power rail, providing a robust and low-impedance path for current distribution across the die pad. The integration of both connecting and power bars within the lead frame itself represents a significant step towards a more compact and efficient power distribution system, contrasting with traditional designs that often rely on longer traces on external PCBs.\n\n**Algorithm Specifics (or Functional Specifics):** While not an algorithmic patent, the functional specifics revolve around optimized electrical routing. The design implicitly 'algorithms' for power and ground distribution by physically shortening current loops and integrating decoupling at the package level. The reduction in parasitic elements (inductance, resistance) directly impacts signal integrity, allowing for higher operating frequencies and lower power dissipation due to reduced I²R losses.\n\n**Integration Patterns:** A standout feature is the direct integration of a surface mount device (SMD) within the semiconductor package. This SMD possesses a first terminal electrically connected to the ground level via a first bond wire, and a second terminal electrically connected to a power level through a second bond wire. This 'system-in-package' (SiP) approach for passive components (e.g., decoupling capacitors) or active components (e.g., small regulators) is highly advantageous. It allows for ultra-close proximity decoupling, which is far more effective at suppressing high-frequency noise than board-level components. The bond wires provide direct, low-inductance connections, further enhancing the effectiveness of the integrated SMD.\n\n**Performance Characteristics:** The cumulative effect of these design choices is a significant improvement in electrical performance. The optimized power delivery network leads to lower voltage droop, reduced ground bounce, and enhanced signal-to-noise ratio. This translates to higher overall system stability and reliability, especially in applications with stringent power integrity requirements. Furthermore, the compact design contributes to higher power density capabilities and potentially better thermal performance due to a more integrated thermal path.\n\n**Code-Level Implications:** While this patent doesn't directly involve code, its implications for hardware engineers designing integrated circuits are substantial. It allows for IC designs that can operate at higher frequencies with lower power budgets, knowing that the package itself will provide a stable and efficient electrical environment. This frees up silicon real estate and power budget that might otherwise be allocated to on-chip decoupling or power conditioning, enabling more complex digital logic or analog functions within the die. This innovation enables a more streamlined hardware-software co-design paradigm, where the package is an active participant in system performance rather than just a passive enclosure.","business_analysis":"The **Semiconductor Package** patent (US-9852966) presents a significant business opportunity by addressing critical performance and cost factors in the rapidly evolving electronics industry. This innovation in semiconductor packaging is poised to deliver substantial commercial advantages across multiple market segments.\n\n**Market Opportunity Size:** The global semiconductor packaging market is a multi-billion dollar industry, driven by the insatiable demand for smaller, faster, and more energy-efficient electronic devices. This patent targets a broad spectrum of applications, including consumer electronics (smartphones, wearables, IoT devices), automotive electronics (ADAS, infotainment), industrial controls, and high-performance computing. The ability of this technology to improve power delivery and miniaturization positions it to capture a significant share of this expanding market, especially in premium and high-density segments.\n\n**Competitive Advantages:** The core competitive advantage of this invention lies in its integrated approach to power management and component embedding. By incorporating power leads, power bars, and even surface mount devices (SMDs) directly within the package, this technology offers superior electrical performance (lower inductance, better signal integrity) and a smaller footprint compared to traditional lead-frame or even some advanced BGA packages. This differentiation allows products utilizing this package to achieve higher performance, lower power consumption, and more compact designs, providing a distinct edge over competitors relying on less optimized packaging solutions. It also reduces the need for external board-level components, simplifying PCB design and assembly.\n\n**Revenue Potential:** The revenue potential stems from several avenues. Licensing this patented technology to major semiconductor manufacturers could generate significant royalties. Furthermore, companies developing products based on this packaging approach could command higher margins due to superior performance and reduced overall system costs (fewer external components, simplified manufacturing). The ability to enable entirely new product categories or significantly improve existing ones also opens doors to new revenue streams and market expansion. The value proposition of 'more performance in less space' is a powerful driver for sales in competitive markets.\n\n**Business Models:** Potential business models include: 1) **Licensing:** Offering the patent rights to large IDMs (Integrated Device Manufacturers) or OSATs (Outsourced Semiconductor Assembly and Test) for integration into their product lines. 2) **Product Development:** Creating and selling proprietary semiconductor devices or modules that leverage this advanced packaging directly. 3) **Joint Ventures:** Partnering with key players to co-develop specialized chips or packaging services. The technology's versatility supports diverse commercialization strategies.\n\n**Strategic Positioning:** This innovation strategically positions adopters at the forefront of miniaturization and power efficiency trends. Companies utilizing this patent can differentiate their products on key metrics important to consumers and industrial clients. It enables a 'system-in-package' (SiP) strategy, allowing for greater functionality density and potentially reducing the time-to-market for complex modules. This strategic advantage can lead to increased market share and stronger brand loyalty.\n\n**ROI Projections:** The return on investment (ROI) for companies adopting or licensing this Semiconductor Package is projected to be substantial. Reduced bill of materials (BOM) costs due to fewer external components, simplified manufacturing processes leading to lower labor and overhead, and the ability to command premium pricing for high-performance, compact products all contribute to a strong financial return. Furthermore, the enhanced reliability and extended product lifespan resulting from improved power integrity can reduce warranty claims and improve customer satisfaction, adding to long-term profitability. Early movers stand to gain significant market leadership.","faqs":[{"answer":"The **Semiconductor Package** (US-9852966) is an innovative patent describing a new design for housing and connecting semiconductor dies. At its core, this invention focuses on optimizing the internal architecture of a chip package to enhance electrical performance, improve power delivery, and enable greater miniaturization of electronic devices. It moves beyond traditional packaging methods by integrating critical components and optimizing electrical pathways directly within the package structure.\n\nSpecifically, this patent details a package that includes a die pad for mounting a semiconductor die, a lead frame with strategically placed power leads, and dedicated connecting and power bars. A key feature is the direct integration of a surface mount device (SMD) within the package itself, with its terminals electrically connected to ground and power levels via dedicated bond wires. This comprehensive approach ensures a more stable and efficient electrical environment for the semiconductor die.\n\nThis technology is crucial for the ongoing advancement of electronics, addressing the challenges faced by engineers in balancing performance, size, and power consumption. By providing a more integrated and efficient solution, the Semiconductor Package paves the way for the next generation of compact, high-performance electronic systems. Its design principles are set to influence a wide array of applications, from consumer electronics to industrial and automotive systems. \n\nKeywords: Semiconductor Package, US-9852966, chip packaging, integrated circuits, electronic device design, patent innovation.","question":"What is Semiconductor Package?"},{"answer":"The **Semiconductor Package** works by creating a highly integrated and optimized electrical environment for the semiconductor die. It starts with a die pad, which is a metal platform where the actual semiconductor chip (die) is mounted. Surrounding this die pad is a lead frame, which contains a series of metal 'leads' that serve as electrical connections to the outside world.\n\nA key aspect of this invention is the strategic placement of a 'power lead' along the peripheral edge of the die pad. This ensures a very short and direct path for the main power supply to reach the die, minimizing electrical resistance and inductance, which are common causes of power loss and signal noise in traditional designs. Additionally, the package incorporates connecting bars and a 'power bar' that act as internal power distribution pathways, ensuring a stable and efficient supply of electricity across the die pad.\n\nPerhaps the most significant innovation is the direct integration of a 'surface mount device' (SMD) — such as a tiny capacitor used for smoothing out power fluctuations — directly within the package. This SMD is connected to both ground and power levels using dedicated, ultra-short bond wires. This close proximity to the die allows for highly effective power stabilization and noise reduction at high frequencies, which is far more efficient than placing these components externally on a circuit board. This integrated design optimizes power delivery, enhances signal integrity, and reduces the overall size of the electronic assembly.\n\nKeywords: Semiconductor Package function, how US-9852966 works, integrated power delivery, SMD integration, bond wires, lead frame design.","question":"How does Semiconductor Package work?"},{"answer":"The **Semiconductor Package** patent primarily solves several critical problems inherent in conventional semiconductor packaging, especially as electronic devices continue to miniaturize and demand higher performance. One major issue is the inefficient power delivery network (PDN) in traditional packages.\n\nIn older designs, power has to travel longer, more circuitous routes from external power sources to the semiconductor die. These longer paths introduce parasitic elements like inductance and resistance, which lead to voltage drops (voltage droop), power loss, and signal noise. This directly impacts the chip's performance, limiting its speed and reliability, and can cause issues like ground bounce. The invention addresses this by creating significantly shorter and more optimized power pathways directly within the package.\n\nAnother significant problem is the consumption of valuable board space by external components, particularly decoupling capacitors, which are essential for stabilizing power. Placing these components far from the die on the main circuit board makes them less effective at high frequencies and adds to the overall device size and complexity. This patent overcomes this by integrating crucial components like surface mount devices (SMDs) directly into the package, in ultra-close proximity to the die, providing superior decoupling and reducing the need for external components. This results in more compact, efficient, and reliable electronic systems.\n\nKeywords: Semiconductor Package problems, power integrity issues, miniaturization challenges, signal noise, parasitic inductance, US-9852966 solutions.","question":"What problem does Semiconductor Package solve?"},{"answer":"The patent data provided for **Semiconductor Package** (US-9852966) does not list specific inventors or an assignee. This means the information regarding the individuals or entity responsible for the invention is not publicly available in the provided abstract data.\n\nIn the patent world, inventions are typically assigned to a company or organization, which then holds the rights to the patent. The inventors are the individuals who conceived the intellectual property. However, it's not uncommon for this information to be omitted in certain public data formats, or for the patent to be assigned to a general entity not specified in the abstract.\n\nTo find the specific inventors and assignee, one would typically need to consult the full patent document directly from official patent databases such as the USPTO (United States Patent and Trademark Office) or Google Patents, where such details are meticulously recorded. These databases provide comprehensive information including the names of the individuals who contributed to the inventive concept and the legal entity that owns the patent rights.\n\nKeywords: Semiconductor Package inventors, US-9852966 assignee, patent ownership, invention creators, patent details.","question":"Who invented Semiconductor Package?"},{"answer":"The **Semiconductor Package** (US-9852966) offers a multitude of key benefits that address current limitations in electronic design and manufacturing. Firstly, it provides **enhanced power integrity**. By optimizing the placement of power leads and integrating internal power bars and SMDs, the package significantly reduces parasitic inductance and resistance. This leads to a more stable and cleaner power supply to the semiconductor die, minimizing voltage droop and ground bounce, which is crucial for high-performance and high-frequency operations.\n\nSecondly, the invention enables **superior miniaturization and higher package density**. Integrating critical components like SMDs directly within the package, rather than on the external PCB, frees up valuable board space. This allows for the creation of thinner, lighter, and more compact electronic devices, opening up new design possibilities for wearables, IoT devices, and other space-constrained applications.\n\nThirdly, it contributes to **improved signal integrity and reduced EMI (Electromagnetic Interference)**. The ultra-short connections for integrated SMDs provide highly effective high-frequency decoupling, which actively suppresses noise and prevents signal degradation. This not only boosts performance but also simplifies system-level electromagnetic compatibility compliance. Lastly, the integrated design can lead to **simplified manufacturing processes and potentially lower costs** by reducing the complexity of PCB design and the number of external components required. These benefits make the Semiconductor Package a highly attractive solution for next-generation electronics.\n\nKeywords: Semiconductor Package benefits, US-9852966 advantages, power integrity, miniaturization, signal integrity, reduced EMI, manufacturing efficiency.","question":"What are the key benefits of Semiconductor Package?"},{"answer":"The **Semiconductor Package** (US-9852966) distinguishes itself from prior art by its highly integrated approach to power delivery and component embedding within the package itself. While traditional lead-frame packages primarily provide mechanical support and basic electrical connections, and even advanced BGA packages often rely heavily on external board-level components, this invention takes a more active role in the chip's electrical environment.\n\nOne key difference lies in the **optimized power lead placement and integrated power bar**. Unlike general lead frames where power lines might be longer and less efficient, this patent specifically details a power lead positioned along the peripheral edge of the die pad and a dedicated power bar. This creates a much shorter, lower-impedance path for power, significantly reducing parasitic effects compared to conventional designs. Prior art often features less optimized power routing, leading to higher inductance and resistance.\n\nAnother major differentiator is the **direct, on-package integration of a surface mount device (SMD)**, connected with dedicated, short bond wires to ground and power levels. In most prior art, critical components like decoupling capacitors are placed externally on the PCB, often at a greater distance from the die. This distance reduces their effectiveness at high frequencies. By integrating the SMD directly, the Semiconductor Package achieves superior high-frequency decoupling and noise suppression, leading to better power integrity and overall electrical performance. This level of internal component integration and power optimization sets this innovation apart from many existing packaging solutions, offering a more compact and electrically robust design.\n\nKeywords: Semiconductor Package vs prior art, US-9852966 comparison, integrated packaging, power lead optimization, on-package SMD, electrical performance.","question":"How is Semiconductor Package different from prior art?"},{"answer":"The **Semiconductor Package** (US-9852966) has the potential to significantly impact a wide range of industries that rely on advanced electronic components. Its core benefits—enhanced miniaturization, superior power delivery, and improved electrical reliability—are highly sought after across numerous sectors.\n\n**Consumer Electronics:** This industry will likely see the most immediate impact. Thinner smartphones, lighter wearables, more compact smart home devices, and powerful portable computing will all benefit from the ability to pack more functionality into smaller spaces with longer battery life. The enhanced power integrity means more stable and faster-performing gadgets.\n\n**Automotive Electronics:** Modern vehicles are increasingly reliant on sophisticated electronic control units (ECUs) for advanced driver-assistance systems (ADAS), infotainment, and engine management. The robust and reliable nature of this packaging, coupled with its compact size, makes it ideal for the demanding and space-constrained environments within vehicles, contributing to safer and smarter cars.\n\n**Internet of Things (IoT):** The proliferation of IoT devices requires sensors and microcontrollers that are tiny, energy-efficient, and highly reliable for long-term deployment. The Semiconductor Package is perfectly suited for these applications, enabling smaller, more powerful, and longer-lasting IoT nodes for smart cities, industrial monitoring, and environmental sensing. Its integrated design supports the development of compact, low-power edge computing devices.\n\n**Industrial and Medical Devices:** In industrial automation, compact and robust electronics are crucial. Similarly, in medical technology, miniaturization and reliability are paramount for implants, portable diagnostic tools, and wearable health monitors. This innovation can facilitate the development of more advanced and less intrusive devices in these critical fields. The broad applicability of this packaging technology underscores its transformative potential across the entire electronics ecosystem.\n\nKeywords: Semiconductor Package industries, US-9852966 impact, consumer electronics, automotive electronics, IoT devices, industrial controls, medical technology.","question":"What industries will Semiconductor Package impact?"},{"answer":"The **Semiconductor Package** patent, identified by its number US-9852966, was officially filed on **June 17, 2016**. This date marks when the patent application was submitted to the United States Patent and Trademark Office (USPTO), initiating the examination process.\n\nFollowing the examination and approval stages, the patent was subsequently granted and published on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the invention's claims, specifications, and drawings.\n\nThese dates are important milestones in the lifecycle of any patent. The filing date establishes the priority date for the invention, meaning it's the earliest date from which the invention's novelty and non-obviousness are typically assessed. The publication date is when the patent's full details are disclosed to the public, allowing others to understand the technology and its scope. This information is crucial for researchers, competitors, and potential licensees to track the intellectual property landscape. The relatively quick turnaround from filing to grant reflects the potential significance and clarity of the innovation described in the Semiconductor Package patent.\n\nKeywords: Semiconductor Package filing date, US-9852966 publication date, patent timeline, USPTO, patent grant date, intellectual property.","question":"When was Semiconductor Package filed/granted?"},{"answer":"The commercial applications of the **Semiconductor Package** (US-9852966) are extensive and diverse, primarily driven by its ability to deliver enhanced performance, miniaturization, and reliability in electronic components. This innovative packaging solution can be leveraged across numerous product categories and industries.\n\nOne major application area is **high-performance consumer electronics**. This includes next-generation smartphones, tablets, smartwatches, and other wearables, where space is at an absolute premium and battery life is critical. The ability to integrate power components and optimize delivery within the package allows for thinner designs, more features, and improved energy efficiency, giving products a significant competitive edge.\n\nIn the **automotive sector**, the Semiconductor Package can be applied to advanced driver-assistance systems (ADAS), in-car infotainment, and critical control modules. The robust electrical performance and compact size make it ideal for the demanding environmental conditions and space constraints of modern vehicles, contributing to safer and more sophisticated automotive systems. The improved signal integrity is vital for reliable communication between sensors and processors.\n\nFurthermore, this technology is highly valuable for **Internet of Things (IoT) devices and edge computing**. IoT sensors, smart home devices, and industrial monitoring equipment often require extremely small, low-power, and highly reliable components that can operate autonomously for extended periods. The integrated nature of this package supports the development of more capable and less intrusive IoT nodes, extending their deployment possibilities. Beyond these, it has strong potential in **medical devices**, **aerospace**, and **industrial automation**, wherever compact, high-reliability, and high-performance electronics are essential. The flexibility of this packaging approach makes it adaptable to a wide array of commercial products.\n\nKeywords: Semiconductor Package commercial applications, US-9852966 uses, consumer electronics, automotive electronics, IoT devices, edge computing, medical devices.","question":"What are the commercial applications of Semiconductor Package?"},{"answer":"The **Semiconductor Package** (US-9852966) lays a strong foundation for several future developments in semiconductor packaging technology. Building upon its integrated approach, we can anticipate advancements that further enhance performance, functionality, and manufacturing efficiency.\n\nOne key area of development will likely be the **integration of more complex active and passive components** directly within the package. While the current patent focuses on SMDs, future iterations could see the inclusion of small power management ICs, RF components, or even memory modules within the package itself, leading to more comprehensive 'system-in-package' (SiP) or 'system-on-package' (SoP) solutions. This trend will push the boundaries of functional density and module-level integration.\n\nAnother expected development is the **advancement in thermal management techniques** integrated directly into the package structure. As more components are packed into smaller volumes and operate at higher frequencies, heat dissipation becomes increasingly critical. Future designs may incorporate micro-fluidic cooling channels, advanced thermal interface materials, or innovative heat spreading structures directly within the Semiconductor Package to manage higher power densities effectively.\n\nFurthermore, we can expect **refinements in manufacturing processes** to enable even finer pitch interconnections and more precise component placement. This could involve new bonding technologies, advanced lithography for package-level features, and automation techniques that reduce production costs and improve yield. These developments will ensure that the Semiconductor Package continues to meet the evolving demands of the electronics industry, enabling devices that are not only smaller and faster but also more robust, energy-efficient, and capable of performing increasingly complex tasks. The innovation described in this patent serves as a blueprint for these exciting future advancements.\n\nKeywords: Semiconductor Package future, US-9852966 developments, SiP, SoP, thermal management, advanced manufacturing, component integration, electronics trends.","question":"What are the future developments expected for Semiconductor Package?"}],"topics":["semiconductor package","US-9852966","chip packaging","integrated circuits","power delivery network","relentless","pursuit","higher"],"tech_cluster":null},"seo":{"title":"Semiconductor Package Patent US-9852966 - Advanced Chip Integration","description":"Discover the Semiconductor Package patent (US-9852966) for enhanced chip integration, optimized power delivery, and miniaturization. Full technical analysis and benefits.","keywords":["semiconductor package","US-9852966","chip packaging","integrated circuits","power delivery network","SMD integration","miniaturization electronics","patent analysis","advanced packaging","electronic components","lead frame design","system-in-package"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852966","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852966","citation_suggestion":"Patentable. \"Semiconductor package\" (US-9852966). https://patentable.app/patents/US-9852966","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852966","json":"https://patentable.app/api/llm-context/US-9852966","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:28:34.572Z"}