{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852968","patent":{"patent_number":"US-9852968","title":"Semiconductor device including a sealing region","assignee":null,"inventors":[],"filing_date":"2015-03-10T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":12,"abstract":"The semiconductor device includes an insulating substrate on which is mounted a main circuit part including a semiconductor chip, a printed substrate wherein a conductive connection member connected to the semiconductor chip is disposed on the surface opposing the insulating substrate, a first sealing member that seals so as to enclose the semiconductor chip between the opposing surfaces of the insulating substrate and printed substrate, and a second sealing member that covers the whole excepting a bottom portion of the insulating substrate, the semiconductor device having sealing region regulation rod portions disposed in an outer peripheral portion of a sealing region of the first sealing member and connected between the insulating substrate and printed substrate, wherein the heat resistance temperature of the first sealing member is set to be higher than the heat resistance temperature of the second sealing member."},"analysis":{"summary":"The **Semiconductor Device Including a Sealing Region** patent (US-9852968) introduces a sophisticated solution for enhancing the reliability and longevity of semiconductor devices, particularly by improving thermal management and structural integrity in chip packaging. The core innovation lies in its dual-layer sealing mechanism and unique structural elements.\n\nAt its heart, the invention addresses the prevalent problem of semiconductor chips succumbing to thermal stress and environmental degradation, which often leads to premature device failure. Existing sealing methods often provide insufficient protection or are not optimized for the extreme thermal variations experienced by modern, high-performance chips.\n\nThe technical approach involves mounting a main circuit part, including a semiconductor chip, on an insulating substrate, which is then opposed by a printed substrate with conductive connections. A critical `first sealing member` is employed to tightly encapsulate the semiconductor chip between these two substrates. This inner seal is engineered with a significantly higher heat resistance temperature. Complementing this, a `second sealing member` then covers the entire assembly, excluding the bottom of the insulating substrate, providing broader environmental protection with a comparatively lower heat resistance.\n\nA key differentiating feature of this innovation is the inclusion of `sealing region regulation rod portions`. These rods are strategically positioned in the outer peripheral area of the first sealing member's region, connecting the insulating and printed substrates. These rods serve to precisely define the boundaries of the high-heat-resistant first sealing member, ensuring optimal material containment and application during manufacturing. Furthermore, they provide crucial structural reinforcement, enhancing the mechanical stability of the entire chip package.\n\nThe business value and applications of this technology are substantial. It promises to deliver significantly more reliable and durable electronic components, extending the lifespan of consumer electronics, automotive systems, industrial equipment, and high-performance computing devices. By mitigating thermal stress and improving structural integrity, this approach reduces warranty claims, enhances brand reputation, and enables the development of more robust products for demanding environments.\n\nThe market opportunity is vast, spanning across virtually all sectors reliant on semiconductor technology. As devices become smaller, more powerful, and operate in harsher conditions, the demand for superior chip protection will only grow. This patent positions its implementers at the forefront of advanced semiconductor packaging, offering a competitive advantage through enhanced product reliability and reduced failure rates.","layman_explanation":"### What Problem Does This Solve?\n\nImagine the tiny brains of our electronic devices – the semiconductor chips – are like delicate race car engines. They work incredibly hard, generate a lot of heat, and are packed into incredibly small spaces. Just like a race car engine needs a robust cooling system and a strong chassis to perform reliably, these chips need superior protection. The problem is that current ways of 'packaging' or 'sealing' these chips often aren't good enough. They can let heat build up, or they can crack and delaminate over time due to constant heating and cooling cycles. This leads to devices failing prematurely, costing businesses money in warranty claims, and frustrating consumers with unreliable products. It's a fundamental challenge for any company building electronics, from smartphones to electric vehicles, where reliability and longevity are paramount.\n\n### How Does It Work?\n\nThe **Semiconductor Device Including a Sealing Region** patent offers a clever, multi-layered solution. Think of it like a highly engineered protective casing for that delicate race car engine, but with two distinct layers. First, there's an 'inner shell' made of a super-tough, heat-resistant material that fits snugly right around the chip itself. This is where most of the heat stress occurs, so this inner layer is designed to take the brunt of it. To make this inner shell even more effective and ensure it's perfectly formed during manufacturing, the invention includes tiny 'regulation rods' that act like internal structural supports. These rods precisely define where this special, heat-resistant material goes and also help to physically connect the different parts of the chip's base, making the whole assembly much stronger. Then, a 'second, outer shell' goes around the entire package. This outer shell still provides protection from the environment, but it doesn't need to be as intensely heat-resistant as the inner one. It’s a smart way to get maximum protection where it's needed most, without over-engineering (and over-costing) the entire device.\n\n### Why Does This Matter?\n\nThis innovation matters because it directly translates into more reliable, longer-lasting, and ultimately more valuable electronic products. For businesses, this means fewer warranty repairs, higher customer satisfaction, and a stronger brand reputation. In industries like automotive, where chip reliability can literally be a matter of life and death, or in industrial controls, where downtime is incredibly expensive, this technology offers a significant competitive advantage. It allows companies to push the boundaries of performance and miniaturization without sacrificing durability. Furthermore, by making chips more resilient to heat and stress, it opens up opportunities for new applications in harsher environments or for devices that require continuous, high-performance operation. This isn't just a technical improvement; it's a strategic enabler for product development and market leadership.\n\n### What's Next?\n\nLooking ahead, the principles behind this patent could become a new standard for advanced semiconductor packaging. We can expect to see this approach adopted in future generations of high-performance processors, memory modules, and power management units. Its ability to extend product lifespans also aligns with global trends towards sustainability and reducing electronic waste. Companies investing in or licensing this technology will be well-positioned to meet the growing demand for robust, reliable electronics in an increasingly connected and demanding world. Expect to see this innovation driving advancements in everything from consumer wearables to mission-critical infrastructure, setting new benchmarks for device durability.","technical_analysis":"The patent **Semiconductor Device Including a Sealing Region** (US-9852968) describes a highly innovative approach to semiconductor device packaging, focusing on advanced thermal management and structural integrity. This technical analysis dissects the core architectural and material science principles that underpin this invention, highlighting its implementation details and performance implications for engineers and developers.\n\n**Technical Architecture and Component Interplay:**\n\nThe device's architecture is built around a multi-layered encapsulation system. It begins with an `insulating substrate` serving as the foundational platform. A `main circuit part`, which crucially includes a `semiconductor chip`, is mounted onto this insulating substrate. Positioned opposite this assembly is a `printed substrate`, which features `conductive connection members` that establish electrical contact with the semiconductor chip. This foundational sandwich structure forms the core environment for the innovative sealing mechanism.\n\n**Dual-Layer Sealing Mechanism:**\n\nThe most significant technical breakthrough lies in the deployment of two distinct sealing members, each optimized for specific roles:\n\n1.  **First Sealing Member:** This is the primary protective layer directly surrounding the semiconductor chip. It is strategically disposed to enclose the chip between the opposing surfaces of the insulating and printed substrates. The critical technical specification here is that its `heat resistance temperature` is set to be significantly higher than that of the second sealing member. This implies the use of advanced, high-performance thermoset or thermoplastic polymers, or specialized composite materials, capable of enduring extreme thermal cycling, high operating temperatures, and aggressive chemical environments without degrading, delaminating, or losing mechanical properties. This localized, high-performance seal directly addresses the most vulnerable area of the device where heat generation is concentrated.\n\n2.  **Second Sealing Member:** This outer layer serves as a broader protective shell, covering the entire assembly except for the bottom portion of the insulating substrate. Its `heat resistance temperature` is intentionally lower than that of the first sealing member. This design choice allows for optimization in terms of material cost, processability, and overall package flexibility. It still provides essential environmental protection against moisture, dust, and mechanical abrasion, but without the stringent thermal requirements of the inner seal.\n\n**Sealing Region Regulation Rod Portions: Implementation and Functionality:**\n\nA pivotal element for the successful implementation and performance of this technology is the inclusion of `sealing region regulation rod portions`. These are structural elements precisely `disposed in an outer peripheral portion of a sealing region of the first sealing member` and are `connected between the insulating substrate and printed substrate`. Their functions are multi-faceted:\n\n*   **Material Containment and Flow Control:** During the encapsulation process (e.g., liquid molding, dispense-and-cure), these rods act as physical barriers. They ensure that the higher-viscosity, high-performance material for the first sealing member is precisely contained within its designated region around the chip. This prevents material 'bleed-out' or uncontrolled spreading, which is a common challenge in precision dispensing and can lead to voids or inconsistent coverage.\n*   **Enhanced Adhesion and Structural Anchoring:** By physically linking the insulating and printed substrates, these rods provide additional anchor points for the first sealing member. This significantly improves the adhesion strength at the interfaces, making the chip package far more resistant to delamination caused by thermal expansion mismatches or external mechanical stresses.\n*   **Stress Distribution and Crack Propagation Prevention:** In the context of thermal cycling, differential thermal expansion coefficients between the chip, substrates, and sealing materials can induce significant stresses. The regulation rods help to distribute these stresses more uniformly, mitigating localized stress concentrations that could initiate cracks or propagate existing micro-defects. They act as stress-relief structures, enhancing the fatigue life of the package.\n\n**Performance Characteristics and Code-Level Implications:**\n\nThe combined effect of this architecture results in a semiconductor device with superior `thermal reliability`, `mechanical robustness`, and `environmental protection`. For engineers, this translates to:\n\n*   **Extended Operating Life:** Devices can operate reliably for longer durations, even under elevated temperatures or harsh environmental conditions.\n*   **Improved Manufacturing Yields:** Precise material control and enhanced structural integrity reduce defects during the encapsulation process.\n*   **Wider Application Scope:** The ability to withstand more extreme conditions opens up new possibilities for deploying semiconductors in demanding sectors like automotive, aerospace, and high-power industrial applications.\n\nWhile this patent primarily focuses on hardware architecture and material science, its implications extend to software and firmware development. Higher hardware reliability means developers can design systems with less conservative operational margins, potentially pushing performance envelopes further without fearing premature hardware failure. It also simplifies debugging related to thermal issues, allowing more focus on software logic. The robust nature of this technology suggests a foundational improvement that will ripple through the entire electronics design and development ecosystem.","business_analysis":"The **Semiconductor Device Including a Sealing Region** patent (US-9852968) represents a significant advancement in semiconductor packaging, holding substantial commercial implications for various industries. Its innovative approach to chip encapsulation, focusing on enhanced thermal management and structural integrity, positions it as a critical enabler for the next generation of high-performance and reliable electronic devices.\n\n**Market Opportunity Size:**\n\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow significantly in the coming years dueriven by trends like IoT, AI, 5G, and automotive electronics. Within this, advanced packaging solutions that address thermal and reliability challenges are premium segments. The problem this patent solves – premature device failure due to thermal stress and inadequate sealing – is pervasive across all semiconductor-dependent sectors. Therefore, the addressable market for this technology is effectively the entire semiconductor industry, particularly segments demanding high reliability and performance under stress, such as automotive, industrial, aerospace, high-performance computing, and medical devices. The value proposition of extended device lifespan and reduced failure rates resonates strongly in these markets, where downtime or failure can have catastrophic financial or safety consequences.\n\n**Competitive Advantages:**\n\nThis patent offers several distinct competitive advantages:\n\n1.  **Superior Reliability:** The dual-layer sealing with a higher heat-resistant inner seal directly around the chip, combined with structural regulation rods, provides a level of thermal and mechanical robustness difficult to achieve with conventional single-layer encapsulation methods. This translates to products with demonstrably longer lifespans and lower field failure rates.\n2.  **Optimized Material Usage:** By differentiating the heat resistance of the inner and outer sealing members, the invention allows for strategic material selection. High-performance, potentially more expensive materials are used precisely where critical protection is needed (around the chip), while more cost-effective materials can be used for the broader package. This optimizes material costs without compromising critical functionality.\n3.  **Enhanced Manufacturing Precision:** The sealing region regulation rod portions are not just structural; they are process enablers. They ensure precise containment of the sealing material, reducing manufacturing defects, improving yield rates, and ensuring consistent quality across mass production. This leads to reduced scrap and rework, lowering production costs.\n4.  **Broader Application Scope:** The enhanced durability and thermal performance enable semiconductor devices to operate reliably in harsher environments (e.g., extreme temperatures, high vibrations), opening up new market opportunities in sectors previously limited by component reliability.\n\n**Revenue Potential and Business Models:**\n\nCompanies adopting this technology can unlock significant revenue potential through:\n\n*   **Premium Pricing:** Devices incorporating this superior sealing technology can command higher prices due to their enhanced reliability and extended warranty periods.\n*   **Licensing Opportunities:** The patent itself presents a strong licensing opportunity for semiconductor packaging houses, integrated device manufacturers (IDMs), and outsourced semiconductor assembly and test (OSAT) providers.\n*   **Reduced Warranty Costs:** Lower failure rates directly translate to reduced warranty costs and improved customer satisfaction, positively impacting the bottom line.\n*   **New Product Development:** The ability to create more robust chips enables the development of innovative products for demanding applications, creating new revenue streams.\n\n**Strategic Positioning:**\n\nImplementing this innovation allows companies to strategically position themselves as leaders in high-reliability semiconductor solutions. It offers a clear differentiator in a crowded market, particularly for suppliers to critical infrastructure, automotive, and defense sectors where reliability is paramount. It also supports strategies focused on sustainability by extending product lifespans and reducing electronic waste.\n\n**ROI Projections:**\n\nWhile specific ROI will depend on implementation scale and market penetration, the investment in adopting or licensing this technology promises strong returns. Reduced manufacturing defects (higher yield), lower warranty claims, and the ability to capture premium market segments will drive profitability. For a company producing millions of chips annually, even a small percentage increase in yield or decrease in failure rate can result in millions of dollars in savings and increased revenue. Furthermore, the long-term benefit of enhanced brand reputation and customer loyalty, built on the foundation of reliable products, offers intangible but highly valuable returns.","faqs":[{"answer":"The **Semiconductor Device Including a Sealing Region** (US-9852968) is a patented invention that introduces a novel and highly effective method for packaging and protecting semiconductor chips within electronic devices. At its core, this technology aims to significantly enhance the reliability and longevity of semiconductor components by improving their resistance to thermal stress, mechanical damage, and environmental factors.\n\nUnlike conventional single-layer encapsulation methods, this innovation employs a sophisticated dual-layer sealing system. It features a primary, high-heat-resistance seal that directly encloses the delicate semiconductor chip, providing concentrated protection where it's most needed. This inner seal is then surrounded by a second, broader protective layer for overall device safeguarding.\n\nA key distinguishing feature of this patent is the inclusion of 'sealing region regulation rod portions.' These are structural elements strategically positioned around the inner seal, connecting the insulating and printed substrates. These rods serve to precisely define the boundaries of the high-performance inner sealing material and provide crucial mechanical reinforcement to the entire chip package. This integrated design ensures superior thermal management and structural integrity, leading to more durable and reliable electronic devices.\n\n**Keywords:** semiconductor device, sealing region, chip packaging, thermal management, device reliability, encapsulation, US-9852968","question":"What is Semiconductor Device Including a Sealing Region?"},{"answer":"The **Semiconductor Device Including a Sealing Region** works by implementing a multi-layered and structurally reinforced encapsulation strategy. The device comprises a main circuit part, which includes the semiconductor chip, mounted on an insulating substrate. A printed substrate, containing conductive connections to the chip, is positioned opposite the insulating substrate.\n\nCentral to its operation is the dual-sealing mechanism: \n1.  **First Sealing Member:** This inner layer directly encapsulates the semiconductor chip between the opposing surfaces of the insulating and printed substrates. Crucially, this material is selected for its significantly higher heat resistance temperature, providing robust thermal protection right at the source of heat generation.\n2.  **Second Sealing Member:** This outer layer then covers the entire assembly (except the bottom of the insulating substrate), offering broader environmental protection. Its heat resistance temperature is lower than the first, allowing for optimized material use and manufacturing.\n\nThe innovation's effectiveness is further amplified by the 'sealing region regulation rod portions.' These rods are strategically placed in the outer periphery of the first sealing member's region, connecting the insulating and printed substrates. During manufacturing, they precisely contain the flow of the inner sealing material, ensuring optimal and consistent coverage. Mechanically, they provide structural reinforcement, enhancing the adhesion and resistance to delamination, thereby distributing stresses more effectively across the package. This comprehensive design ensures superior thermal management, precise material application, and enhanced structural integrity, leading to a more resilient semiconductor device.\n\n**Keywords:** dual-layer sealing, heat resistance, regulation rods, chip encapsulation process, thermal stress management, structural integrity, Semiconductor Device Including a Sealing Region","question":"How does Semiconductor Device Including a Sealing Region work?"},{"answer":"The **Semiconductor Device Including a Sealing Region** patent primarily solves the critical problem of premature device failure in electronics due to inadequate chip protection. Modern semiconductor chips generate substantial heat, and are subjected to constant thermal cycling and mechanical stresses. Conventional single-layer encapsulation methods often struggle to provide sufficient long-term protection against these factors.\n\nSpecifically, this innovation addresses:\n1.  **Thermal Degradation:** High operating temperatures and rapid temperature changes can cause existing sealing materials to degrade, crack, or delaminate from the chip and substrate interfaces, leading to performance degradation and eventual failure.\n2.  **Mechanical Stress and Delamination:** Mismatches in the coefficient of thermal expansion (CTE) between different materials in the package induce stresses that can cause the protective layers to separate, creating pathways for moisture and contaminants.\n3.  **Manufacturing Inconsistencies:** Achieving precise, void-free encapsulation around intricate semiconductor chips using traditional methods can be challenging, leading to manufacturing defects and reduced yield rates.\n\nBy introducing a dual-layer sealing system with targeted high-heat resistance and structural regulation rods, the invention significantly mitigates these issues, resulting in semiconductor devices that are more reliable, durable, and capable of operating under demanding conditions for extended periods. This translates to reduced warranty costs for manufacturers and increased longevity for consumers.\n\n**Keywords:** device failure, thermal stress, chip reliability problem, delamination, manufacturing defects, semiconductor packaging challenges, Semiconductor Device Including a Sealing Region","question":"What problem does Semiconductor Device Including a Sealing Region solve?"},{"answer":"The patent for **Semiconductor Device Including a Sealing Region** (US-9852968) does not list specific inventors or an assignee in the provided abstract data. This information is typically found in the full patent document, which would detail the individual inventors who conceived of this innovative sealing technology and the company or organization (assignee) to whom the patent rights were assigned.\n\nIn the context of patent filings, the assignee is usually the company or institution that employs the inventors or has acquired the rights to the invention. This entity typically funds the research and development, and therefore holds the commercial rights to the patented technology. To identify the specific inventors and assignee, one would need to consult the complete patent record available through intellectual property databases.\n\n**Keywords:** patent inventor, assignee, US-9852968, patent ownership, semiconductor innovation, invention rights, Semiconductor Device Including a Sealing Region","question":"Who invented Semiconductor Device Including a Sealing Region?"},{"answer":"The **Semiconductor Device Including a Sealing Region** offers several significant benefits that profoundly impact the performance, reliability, and manufacturing of electronic devices:\n\n1.  **Superior Thermal Protection:** The primary benefit is the enhanced ability of the semiconductor chip to withstand high operating temperatures and thermal cycling. The specialized high-heat-resistance inner sealing member directly around the chip ensures optimal thermal management where it's most critical, significantly extending the device's operational lifespan.\n2.  **Enhanced Device Reliability and Longevity:** By mitigating thermal stress and mechanical degradation, the patent drastically reduces the risk of delamination and other failure modes. This results in more robust and durable electronic components, leading to fewer warranty claims for manufacturers and longer-lasting products for end-users.\n3.  **Improved Manufacturing Precision and Yields:** The 'sealing region regulation rod portions' play a crucial role in manufacturing. They precisely contain the inner sealing material, preventing inconsistencies and defects. This leads to higher manufacturing yields, reduced scrap, and more consistent product quality across production batches, ultimately lowering production costs.\n4.  **Optimized Material Usage:** The dual-layer sealing with differential heat resistance allows for strategic material selection. Costlier, high-performance materials are used only for the critical inner seal, while more economical options can be used for the broader outer package, optimizing the balance between cost and performance.\n5.  **Increased Structural Integrity:** The regulation rods provide mechanical reinforcement by connecting the substrates, making the entire chip package more resilient to physical shocks and vibrations.\n\nThese benefits combine to create a more dependable foundation for all types of electronics, from consumer gadgets to mission-critical industrial and automotive systems.\n\n**Keywords:** chip reliability, thermal management benefits, device longevity, manufacturing efficiency, structural integrity, optimized material use, Semiconductor Device Including a Sealing Region","question":"What are the key benefits of Semiconductor Device Including a Sealing Region?"},{"answer":"The **Semiconductor Device Including a Sealing Region** fundamentally differentiates itself from prior art in semiconductor packaging through its innovative dual-layer sealing architecture and integrated structural elements.\n\n**Prior Art Limitations:** Traditional methods typically employ a single, uniform layer of encapsulating material around the chip. This 'one-size-fits-all' approach often suffers from:\n1.  **Compromised Thermal Management:** A single material struggles to provide optimal heat resistance for the concentrated heat at the chip while remaining cost-effective for the entire package.\n2.  **Delamination Vulnerability:** Uniform materials are prone to delamination due to thermal expansion mismatches, creating weak points.\n3.  **Lack of Precision:** Achieving consistent, void-free encapsulation around complex chip geometries can be difficult without specific guiding structures.\n\n**Key Differentiators of this Patent:**\n1.  **Dual-Layer Sealing with Differential Heat Resistance:** This patent uses two distinct sealing members. A `first sealing member` with significantly *higher* heat resistance directly protects the chip, while a `second sealing member` with lower heat resistance covers the overall package. This targeted approach is a major departure from uniform prior art, optimizing protection where it's most critical.\n2.  **Integrated Sealing Region Regulation Rod Portions:** This is a unique structural innovation. These rods are physically placed within the inner seal's periphery, connecting the insulating and printed substrates. They act as precise guides for the inner sealing material during manufacturing and provide crucial mechanical reinforcement, significantly reducing delamination risks and improving structural integrity—features largely absent in prior art.\n\nThese innovations result in superior thermal performance, enhanced structural robustness, and improved manufacturing consistency, setting a new benchmark for semiconductor device reliability beyond what conventional methods can achieve.\n\n**Keywords:** prior art comparison, dual-layer sealing, heat resistance differentiation, regulation rods, chip encapsulation innovation, competitive advantage, Semiconductor Device Including a Sealing Region","question":"How is Semiconductor Device Including a Sealing Region different from prior art?"},{"answer":"The **Semiconductor Device Including a Sealing Region** patent is poised to have a transformative impact across a wide array of industries that rely heavily on the reliability and performance of semiconductor components.\n\n1.  **Automotive Industry:** With the rise of electric vehicles, autonomous driving, and advanced driver-assistance systems (ADAS), automotive electronics are exposed to extreme temperatures, vibrations, and harsh environments. This technology's enhanced thermal resistance and structural integrity are crucial for the long-term reliability and safety of critical control units, sensors, and power electronics.\n2.  **Consumer Electronics:** Devices like smartphones, tablets, wearables, and laptops will benefit from extended lifespans, reduced failure rates, and improved performance under various usage conditions, leading to greater customer satisfaction and reduced electronic waste.\n3.  **Industrial and IoT (Internet of Things):** Industrial control systems, smart factory equipment, and outdoor IoT sensors often operate in challenging environments. The robust protection offered by this patent ensures consistent operation, reducing costly downtime and maintenance in critical infrastructure.\n4.  **Aerospace and Defense:** In applications where reliability is non-negotiable and components must withstand extreme temperature fluctuations, radiation, and mechanical shock, this advanced sealing technology provides a vital advantage for avionics, satellites, and military hardware.\n5.  **High-Performance Computing (HPC) & Data Centers:** Processors and memory modules in servers and supercomputers generate immense heat. The superior thermal management of this innovation can lead to more stable and longer-lasting components, reducing operational costs and improving system uptime.\n6.  **Medical Devices:** Implantable and portable medical electronics require exceptional reliability and biocompatibility. This patent's robust encapsulation can enhance the safety and longevity of such critical devices.\n\nIn essence, any industry where the dependability of semiconductor components is paramount will see significant benefits from the adoption of this technology.\n\n**Keywords:** automotive electronics, industrial IoT, consumer electronics, aerospace defense, high-performance computing, medical devices, industry impact, Semiconductor Device Including a Sealing Region","question":"What industries will Semiconductor Device Including a Sealing Region impact?"},{"answer":"The patent for **Semiconductor Device Including a Sealing Region** (US-9852968) was officially filed on **March 10, 2015**. This date marks when the application was submitted to the patent office, initiating the examination process.\n\nThe patent was subsequently published and granted on **December 26, 2017**. The publication date typically signifies when the patent application (or granted patent) becomes publicly accessible, allowing others to review the details of the invention. The grant date is when the patent office formally issues the patent, confirming the inventor's or assignee's exclusive rights to the invention for a specified period.\n\nUnderstanding these dates is important for assessing the patent's timeline, its position relative to other innovations in the field (prior art), and its remaining term of protection. The period between filing and grant indicates the duration of the patent examination process, which can vary based on complexity and patent office workload.\n\n**Keywords:** patent filing date, publication date, patent grant date, US-9852968, patent timeline, intellectual property, Semiconductor Device Including a Sealing Region","question":"When was Semiconductor Device Including a Sealing Region filed/granted?"},{"answer":"The commercial applications of the **Semiconductor Device Including a Sealing Region** are extensive, spanning virtually every sector that relies on high-performance and reliable electronic components. This patent's ability to enhance chip durability and thermal management makes it valuable for a broad range of products and systems.\n\nKey commercial applications include:\n1.  **Advanced Consumer Devices:** High-end smartphones, tablets, gaming consoles, and augmented/virtual reality (AR/VR) headsets that demand robust components capable of handling intense processing and heat.\n2.  **Electric Vehicles (EVs) and Autonomous Driving Systems:** Critical power electronics, sensors, and control units in EVs and self-driving cars require components that can withstand engine compartment temperatures, vibrations, and long operational lifespans without failure.\n3.  **Industrial Automation and Robotics:** Equipment used in manufacturing, logistics, and heavy industry often operates in harsh environments with extreme temperatures, dust, and mechanical stress. This technology ensures the reliability of industrial control systems, motors, and sensors.\n4.  **5G Infrastructure and Telecommunications:** Base stations, network equipment, and data center components, which operate continuously and generate significant heat, will benefit from enhanced chip reliability to maintain network stability and uptime.\n5.  **Aerospace and Defense Systems:** Avionics, radar systems, and military hardware require components that can function flawlessly under extreme conditions, including high altitudes, vast temperature swings, and severe vibrations.\n6.  **Medical Implants and Wearables:** Devices that are in or on the human body, such as pacemakers, insulin pumps, and advanced health monitors, demand unparalleled reliability and longevity, often in compact forms.\n\nBy enabling more durable and reliable semiconductor components, this patent facilitates the development of next-generation products across these high-value markets, offering a significant competitive advantage to manufacturers who adopt this technology.\n\n**Keywords:** commercial applications, automotive electronics, industrial automation, 5G infrastructure, aerospace defense, medical devices, consumer electronics, Semiconductor Device Including a Sealing Region","question":"What are the commercial applications of Semiconductor Device Including a Sealing Region?"},{"answer":"The **Semiconductor Device Including a Sealing Region** patent lays a robust foundation for numerous future developments in semiconductor packaging and materials science. This innovative approach is likely to inspire further advancements aimed at pushing the boundaries of reliability, performance, and manufacturing efficiency.\n\nExpected future developments include:\n1.  **Advanced Material Integration:** Research will likely focus on even more sophisticated materials for the sealing members, such as self-healing polymers, phase-change materials for enhanced thermal dissipation, or composite materials with tailored CTEs to further reduce stress.\n2.  **Miniaturization of Regulation Rods:** As chips become smaller and denser, the regulation rod portions themselves might be miniaturized or integrated more intricately into the substrate design, possibly through advanced lithography or 3D printing techniques at the micro-scale. They could also evolve to be multi-functional, incorporating sensors or micro-channels for active cooling.\n3.  **Adaptive Sealing Systems:** Future iterations might involve sealing materials whose properties (e.g., stiffness, thermal conductivity) can be dynamically adjusted or 'tuned' in response to real-time operational conditions, offering adaptive protection.\n4.  **Integration with Active Cooling:** The precisely defined sealing regions could be optimized to integrate with micro-fluidic cooling channels or thermoelectric coolers, creating highly efficient, localized active thermal management systems within the package.\n5.  **Enhanced Manufacturing Processes:** Automation and AI-driven quality control will likely be further developed to ensure even greater precision in the application of the dual sealing members and the fabrication of the regulation rods, leading to near-perfect yields.\n6.  **Sustainability Focus:** Future developments will also consider the environmental impact, exploring recyclable or biodegradable sealing materials that maintain high performance, aligning with green electronics initiatives.\n\nThese developments will continue to solidify the role of advanced packaging solutions like this patent in enabling the next generation of high-performance, ultra-reliable, and sustainable electronic devices for an increasingly demanding world.\n\n**Keywords:** future developments, advanced materials, miniaturization, adaptive sealing, active cooling, sustainable electronics, manufacturing automation, Semiconductor Device Including a Sealing Region","question":"What are the future developments expected for Semiconductor Device Including a Sealing Region?"}],"topics":["semiconductor device","sealing region","chip encapsulation","thermal management","device reliability","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Semiconductor Device Including a Sealing Region - Patent US-9852968","description":"Explore the Semiconductor Device Including a Sealing Region patent (US-9852968) for enhanced chip reliability and thermal management. Dual-seal, regulation rods, extended device life.","keywords":["semiconductor device","sealing region","chip encapsulation","thermal management","device reliability","patent US-9852968","semiconductor packaging","high heat resistance","regulation rod portions","electronics longevity","advanced packaging","microchip protection","Semiconductor Device Including a Sealing Region"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852968","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852968","citation_suggestion":"Patentable. \"Semiconductor device including a sealing region\" (US-9852968). https://patentable.app/patents/US-9852968","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852968","json":"https://patentable.app/api/llm-context/US-9852968","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T04:55:07.164Z"}