{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852969","patent":{"patent_number":"US-9852969","title":"Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects","assignee":null,"inventors":[],"filing_date":"2016-06-23T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":16,"abstract":"An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die."},"analysis":{"summary":"The patent \"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects\" introduces a revolutionary apparatus for high-density semiconductor packaging that combines multiple interconnection technologies. This core innovation enables the creation of highly compact and efficient multi-die stacks by synergistically integrating wire bond arrays and bump interconnects.\n\nThe primary problem this invention addresses is the escalating challenge of integrating multiple semiconductor dies into increasingly smaller footprints while maintaining or enhancing electrical performance and thermal management. Traditional packaging methods often rely solely on either wire bonding or flip-chip (bump) technology, each presenting limitations regarding density, signal integrity, power delivery, or manufacturing flexibility in complex 3D configurations.\n\nThe key technical approach involves a sophisticated layered structure. A substrate forms the base, from which a first bond via array (comprising wires of a specific length) and an array of bump interconnects extend. A semiconductor die is then directly interconnected to this substrate using the bump interconnects. Crucially, a second bond via array, featuring wires of a *different* length, extends from the opposing surface of this die. This hybrid, variable-length interconnection scheme allows for optimized signal paths, superior power distribution, and enhanced thermal dissipation within the die stack.\n\nFrom a business perspective, this technology offers significant value by enabling the development of next-generation electronic devices that are smaller, faster, and more energy-efficient. It provides a competitive advantage for semiconductor manufacturers and consumer electronics companies seeking to push the boundaries of miniaturization and performance. The ability to integrate more functionality into a compact package improves product capabilities and opens new market segments.\n\nThe market opportunity for this innovation is substantial, spanning high-growth sectors such as mobile computing, artificial intelligence hardware, Internet of Things (IoT) devices, and high-performance computing. As demand for advanced packaging solutions continues to grow, this patent offers a robust and flexible framework for designing and manufacturing complex multi-chip modules with enhanced reliability and performance characteristics.","layman_explanation":"### What Problem Does This Solve?\n\nIn today's fast-paced world, we constantly demand more from our electronic devices. We want smartphones that are thinner yet more powerful, smartwatches with more features, and AI systems that process information at lightning speed. To achieve this, engineers need to pack more computing power into smaller and smaller spaces. The traditional way of doing this involves stacking multiple computer chips (called 'dies') on top of each other. However, simply stacking them isn't enough; they need to communicate effectively, efficiently manage heat, and remain reliable. Existing methods often force a trade-off: either you get good density but limited performance, or great performance at the expense of size or complexity. This fundamental challenge—integrating more functionality into compact, high-performance packages without compromise—is the core problem this patent aims to solve.\n\n### How Does It Work?\n\nImagine building a multi-story building where each floor is a sophisticated computer chip. This patent, \"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects,\" introduces a clever way to connect these floors. Instead of using just one type of staircase or elevator, it uses a hybrid approach.\n\nIt starts with a foundational layer, like the ground floor, called a 'substrate'. On this substrate, there are two types of connectors:\n1.  **Tiny wires (bond via arrays)**: Think of these as flexible, delicate bridges for signals.\n2.  **Small bumps (bump interconnects)**: These are like direct, rigid pillars, providing a very short and fast connection.\n\nA key computer chip (die) is then placed directly onto these small bumps, connecting it to the substrate. This bump connection is excellent for very fast signals and efficiently moving heat away from the chip. But the innovation doesn't stop there. From the *top* of this first chip, another set of tiny wires extends upwards, connecting to the next layer (or to external components). Crucially, these new wires are designed to be a *different length* than the first set of wires on the substrate. This variation in wire length, combined with the direct bump connections, allows engineers to optimize every single pathway. It’s like having express lanes, scenic routes, and dedicated power lines, all intelligently designed for maximum efficiency and minimal interference.\n\n### Why Does This Matter?\n\nThis innovative approach has significant implications for both technology and business. For consumers, it means devices that are not only smaller and sleeker but also perform better and last longer. Imagine your next smartphone being even more powerful without getting thicker, or an AI processor that can handle complex tasks faster with less energy consumption. This technology enables that.\n\nFor businesses and investors, this translates into substantial market opportunities. Companies that adopt this patent can gain a significant competitive edge by offering products with superior performance, higher integration density, and improved reliability. It's particularly impactful in high-growth sectors like mobile computing, artificial intelligence, Internet of Things (IoT), and high-performance computing, where miniaturization and speed are paramount. The ability to integrate more complex systems into a smaller footprint can lead to lower manufacturing costs in the long run and unlock new product categories, driving revenue growth and market leadership.\n\n### What's Next?\n\nThis patent sets a new standard for advanced semiconductor packaging. Its principles will likely be foundational for future generations of integrated circuits, enabling even more sophisticated 3D stacking and heterogeneous integration (combining different types of chips). Expect to see this technology pave the way for more compact AI accelerators, enhanced memory-on-logic solutions, and ultra-miniature devices that were previously impossible. For investors, understanding this innovation is key to identifying the next wave of disruptive technologies in the microelectronics space.","technical_analysis":"The patent \"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects\" (US-9852969) describes a highly innovative apparatus designed to address critical challenges in high-density semiconductor packaging. This technical analysis delves into the architectural specifics, implementation details, and the performance implications of this advanced die stacking methodology.\n\n**Technical Architecture:**\nAt its core, this invention defines a die stack apparatus built around a foundational substrate. The distinguishing feature is the hybrid and multi-level interconnection scheme. Specifically:\n1.  **Substrate**: This forms the base layer, providing mechanical support and electrical pathways.\n2.  **First Bond Via Array**: Comprised of multiple wire bond wires, each of a 'first length', extending from a first surface of the substrate. These wires serve as electrical conduits for various signals or power lines.\n3.  **Array of Bump Interconnects**: Disposed on the *same* first surface of the substrate, adjacent to the first bond via array. These are typically solder bumps or copper pillars, forming direct, low-profile connections.\n4.  **Die**: A semiconductor die is interconnected to the substrate specifically via the array of bump interconnects. This typically implies a flip-chip assembly, offering advantages in density, electrical performance (shorter paths), and thermal dissipation compared to perimeter wire bonding.\n5.  **Second Bond Via Array**: Comprised of multiple wire bond wires, each of a 'second length', extending from a second surface of the die (the surface opposite the bump interconnects). Crucially, this 'second length' is *different* from the 'first length'.\n\n**Implementation Details and Algorithm Specifics:**\nWhile the patent abstract doesn't detail algorithms, the implementation hinges on precise manufacturing techniques:\n*   **Wire Bonding**: Advanced wire bonding machines are required to precisely form the first and second bond via arrays. The ability to control and vary wire lengths (L1 and L2) is critical. This might involve different bonding parameters, loop shapes, or attachment points to achieve the desired lengths and profiles. The 'different length' aspect allows for optimization of signal timing, impedance matching, and reduction of crosstalk, depending on the specific signal characteristics (e.g., high-speed data vs. power delivery).\n*   **Bump Interconnects (Flip-Chip)**: The formation and reflow of bump interconnects require high precision to ensure robust electrical and mechanical connections between the die and the substrate. This process is crucial for establishing low-inductance power delivery networks and high-bandwidth data paths.\n*   **Material Selection**: The choice of wire material (e.g., gold, copper, aluminum) and bump material (e.g., lead-free solder, copper pillars) is critical for electrical conductivity, thermal performance, and mechanical reliability.\n*   **Die Stacking Sequence**: The process involves preparing the substrate, forming the first wire bond array and bump array, then accurately placing and connecting the die via flip-chip, followed by forming the second wire bond array from the die's upper surface. This sequential assembly requires careful planning to prevent damage to previously formed structures.\n\n**Integration Patterns and Performance Characteristics:**\nThis technology enables highly optimized integration patterns:\n*   **Hybrid Signal Routing**: High-speed, latency-sensitive signals can utilize the shorter, lower-inductance bump interconnects. Less critical signals or those requiring flexible routing can leverage the wire bonds. The variable wire lengths (L1 vs. L2) allow for fine-tuning of signal path impedance and propagation delay across different levels of the stack.\n*   **Enhanced Power Delivery Network (PDN)**: Bump interconnects provide a robust PDN for the primary die, while the wire bonds can supply power to additional components or provide auxiliary power rails. The ability to vary wire lengths can help in managing IR drop and current distribution.\n*   **Improved Thermal Management**: Flip-chip connection via bump interconnects offers a direct thermal path from the active die to the substrate, significantly improving heat dissipation compared to traditional wire-bonded-only packages. This is crucial for high-power devices.\n*   **Increased Density and Miniaturization**: By combining multiple interconnection types, the invention allows for a greater number of I/O connections in a smaller footprint, leading to higher integration density and overall package miniaturization.\n\n**Code-Level Implications (Abstraction):**\nWhile this is a hardware patent, its implications for software and system-level design are profound. Developers working on systems utilizing such advanced packaging can expect:\n*   **Higher Bandwidth and Lower Latency**: Enabling faster data transfer between stacked dies, directly impacting computational performance for multi-core processors, memory-on-logic, and AI accelerators.\n*   **More Efficient Power Delivery**: Potentially leading to lower power consumption for a given workload, crucial for mobile and edge computing devices.\n*   **Complex Heterogeneous Integration**: The flexibility of this packaging allows for integrating diverse IP blocks (e.g., CPU, GPU, NPU, memory, sensors) in close proximity, which can be abstracted as a single, highly optimized system-on-package (SoP) or system-in-package (SiP) from a software perspective. This simplifies software development by providing a unified, high-performance hardware platform.\n\nIn conclusion, this patent represents a significant advancement in semiconductor packaging. Its hybrid interconnection scheme, particularly the intelligent use of variable-length wire bond arrays alongside bump interconnects, offers a powerful toolkit for engineers to design high-performance, compact, and thermally efficient multi-die systems, pushing the boundaries of what's possible in microelectronics.","business_analysis":"The patent \"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects\" (US-9852969) introduces a sophisticated solution to semiconductor packaging, carrying substantial implications for various business sectors. This analysis explores the market opportunity, competitive advantages, revenue potential, business models, strategic positioning, and ROI projections for this groundbreaking technology.\n\n**Market Opportunity Size:**\nThe market for advanced semiconductor packaging is experiencing robust growth, driven by the insatiable demand for smaller, faster, and more powerful electronic devices across all industries. This includes high-performance computing (HPC), artificial intelligence (AI) hardware, 5G infrastructure, automotive electronics, Internet of Things (IoT) devices, and consumer electronics (smartphones, wearables). The global advanced packaging market size was valued at over $30 billion in 2022 and is projected to grow at a CAGR exceeding 8-10% in the coming years. This patent directly addresses the need for higher integration density, improved electrical performance, and better thermal management, positioning it squarely within this rapidly expanding market.\n\n**Competitive Advantages:**\nThis technology offers several distinct competitive advantages:\n1.  **Superior Performance-to-Footprint Ratio**: By combining the strengths of both wire bonds and bump interconnects, and critically, utilizing variable-length wire bonds, the invention enables exceptionally dense die stacks with optimized signal integrity and power delivery. This translates to higher processing speeds and lower latency within a significantly smaller physical package.\n2.  **Enhanced Design Flexibility**: The hybrid approach allows designers greater freedom to optimize interconnections for specific requirements—using bump interconnects for critical high-speed paths and wire bonds for more flexible routing or power distribution. This adaptability is crucial for heterogeneous integration, allowing diverse functional dies to be combined efficiently.\n3.  **Improved Thermal Management**: The strategic use of bump interconnects for primary die attachment provides a direct and efficient thermal path to the substrate, a key advantage over purely wire-bonded solutions in high-power applications.\n4.  **Potential for Cost Optimization**: While involving advanced processes, the ability to achieve high performance and density without resorting to more exotic (and often more expensive) 3D integration techniques like Through-Silicon Vias (TSVs) for all connections could offer a more favorable cost-performance trade-off in high-volume manufacturing.\n\n**Revenue Potential:**\nCompanies that license or implement this technology can unlock significant revenue streams through:\n*   **Premium Product Development**: Creating high-end processors, memory modules, and System-on-Packages (SoPs) that offer superior performance and miniaturization, commanding higher prices.\n*   **Market Share Expansion**: Gaining a competitive edge in critical markets like AI accelerators, mobile application processors, and high-density memory, where packaging is a key differentiator.\n*   **Enabling New Product Categories**: The ability to integrate more functionality into smaller form factors can enable entirely new classes of devices, such as ultra-compact edge AI devices or advanced medical implants, opening up new revenue avenues.\n\n**Business Models:**\nPotential business models include:\n*   **Licensing**: Semiconductor foundries, OSATs (Outsourced Semiconductor Assembly and Test companies), and integrated device manufacturers (IDMs) could license the patent for use in their advanced packaging lines.\n*   **Product Differentiation**: Companies incorporating this technology into their proprietary chip designs can brand their products as superior in performance, density, and power efficiency.\n*   **Specialized Manufacturing Services**: OSATs could offer specialized advanced packaging services based on this patent, catering to clients requiring cutting-edge integration solutions.\n\n**Strategic Positioning:**\nCompanies leveraging this patent can strategically position themselves as leaders in advanced packaging and high-performance computing. It allows them to differentiate their offerings in a crowded market, attract top-tier talent in microelectronics engineering, and secure long-term contracts with major technology innovators.\n\n**ROI Projections:**\nWhile specific ROI depends on implementation scale and market adoption, the investment in this technology is expected to yield substantial returns through:\n*   **Increased Product Performance**: Directly translates to higher market demand and better pricing power.\n*   **Reduced Form Factor**: Lowers material costs for end products and expands market reach to size-constrained applications.\n*   **Enhanced Reliability**: Reduces warranty claims and improves brand reputation.\n*   **Accelerated Time-to-Market**: By providing a robust and flexible packaging solution, it can streamline the development cycle for complex multi-chip modules.\n\nIn essence, the Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent offers a compelling strategic asset for businesses operating in the fiercely competitive semiconductor industry. It provides a pathway to unlock next-generation performance and miniaturization, crucial for sustained innovation and market leadership.","faqs":[{"answer":"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects is a groundbreaking patent (US-9852969) in the field of semiconductor packaging. It describes an advanced apparatus for creating highly integrated die stacks, which are essentially multiple computer chips stacked and connected together in a compact form.\n\nThis invention introduces a novel hybrid interconnection strategy. Instead of relying solely on one type of connection, it intelligently combines both traditional wire bond arrays and modern bump interconnects within the same die stack. This allows for a more versatile and optimized way to link different layers of chips.\n\nThe core innovation lies in its multi-tiered structure: a substrate features both wire bonds and bump interconnects, a die is connected via the bumps, and then another set of wire bonds, crucially with a *different length*, extends from the die itself. This sophisticated design aims to overcome the limitations of conventional packaging methods by providing superior electrical performance, thermal management, and integration density.\n\nEssentially, this patent provides a blueprint for building smaller, faster, and more reliable electronic components by rethinking how the tiny 'brains' of our devices are physically connected.","question":"What is Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent works by integrating a unique combination of connection technologies in a layered structure.\n\nFirst, a base layer, known as a 'substrate,' is established. On its upper surface, two types of connection elements are present: a 'first bond via array' consisting of numerous wire bond wires, each manufactured to a specific 'first length,' and an 'array of bump interconnects.' These bump interconnects are typically tiny solder or copper pillars designed for direct, high-density contact.\n\nNext, a semiconductor 'die' (a computer chip) is precisely positioned and interconnected to this substrate primarily through the array of bump interconnects. This method, often called flip-chip bonding, provides very short electrical paths and excellent thermal dissipation directly from the chip's active surface.\n\nFinally, and distinctively, a 'second bond via array' is formed. These are additional wire bond wires that extend from the *opposite* surface of the die. A critical aspect of this invention is that these second wires are designed to have a 'second length' that is intentionally *different* from the 'first length' of the wires on the substrate. This differential length allows engineers to fine-tune signal timing, manage impedance, and optimize power delivery paths across the entire stacked system, leading to superior overall performance and efficiency compared to uniform connection schemes.","question":"How does Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects work?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent (US-9852969) addresses several critical challenges in modern semiconductor manufacturing and packaging.\n\nFirstly, it tackles the growing demand for **miniaturization without compromising performance**. As devices shrink, packing more computing power into smaller spaces becomes incredibly difficult. Traditional packaging methods often face trade-offs: wire bonds offer flexibility but can lead to longer signal paths and lower density, while bump interconnects provide high density and performance but can be less versatile for complex multi-die stacking.\n\nSecondly, the invention resolves issues related to **signal integrity and power delivery**. In dense chip stacks, signals can degrade, and power can be delivered inefficiently, leading to slower performance and increased power consumption. Conventional methods struggle to optimize all these factors simultaneously across multiple layers.\n\nLastly, it improves **thermal management**. High-performance chips generate significant heat. Efficiently dissipating this heat from stacked dies is crucial for reliability and sustained performance. This patent offers a hybrid solution that leverages the thermal advantages of bump interconnects while maintaining the routing flexibility of wire bonds, allowing for more efficient heat removal and overall robust operation. Keywords: miniaturization, performance compromise, signal integrity, power delivery, thermal management, semiconductor challenges.","question":"What problem does Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects solve?"},{"answer":"The patent document (US-9852969) for Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects does not explicitly list the inventors or assignee in the provided data. This information is typically found in the full patent document available from patent offices.\n\nHowever, patents like this are usually the result of extensive research and development efforts by teams of engineers and scientists within major semiconductor companies or specialized packaging firms. These organizations invest heavily in advancing microelectronics technology to meet the ever-increasing demands for smaller, faster, and more powerful electronic devices.\n\nThe detailed technical nature of the invention, involving precise control over wire bonding and bump interconnect processes, suggests a background in advanced materials science, electrical engineering, and manufacturing process optimization. Such innovations are crucial for maintaining leadership in the highly competitive semiconductor industry. Keywords: inventors, assignee, patent origin, semiconductor R&D, microelectronics experts.","question":"Who invented Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent offers several key benefits that are critical for the advancement of modern electronics.\n\nFirstly, it enables **significantly higher integration density**. By combining the high I/O density of bump interconnects with the routing flexibility of wire bonds, more functional chips can be stacked and interconnected within a smaller physical footprint. This leads to more compact and powerful devices across various applications.\n\nSecondly, it provides **superior electrical performance**. The hybrid approach, particularly the ability to use different lengths for wire bonds, allows for optimized signal paths, reduced parasitic inductance and capacitance, and improved signal integrity. This translates to faster data transfer, lower latency, and enhanced overall system speed and efficiency.\n\nThirdly, the invention contributes to **better thermal management**. The use of bump interconnects for primary die attachment offers a direct and efficient thermal path from the active chip to the substrate, helping to dissipate heat more effectively. This prevents overheating, improves long-term reliability, and allows chips to operate at higher performance levels without throttling. Keywords: integration density, electrical performance, thermal management, signal integrity, reliability, compact electronics, advanced packaging benefits.","question":"What are the key benefits of Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent significantly differentiates itself from prior art by its ingenious hybrid interconnection strategy and the specific optimization of wire bond lengths.\n\nPrior art typically relied on either **wire bonding** (where fine wires connect the chip's perimeter to the package) or **flip-chip/bump interconnects** (where direct solder bumps connect the chip's entire surface to the package). While both have advantages, they also have limitations when it comes to achieving maximum density, performance, and flexibility in complex multi-die stacks. Often, prior solutions would use one method exclusively or combine them in a less integrated, sequential manner without specific optimization.\n\nThis invention's key distinction lies in its **co-located hybrid approach** on the same substrate surface—featuring both a first wire bond array and a bump interconnect array—coupled with the critical innovation of **variable wire lengths**. The patent specifies that a second wire bond array extending from the die has wires of a *different* length than the first array from the substrate. This allows for precise tuning of electrical characteristics, signal paths, and power delivery that was not explicitly taught or enabled by prior art, offering a far more sophisticated and optimized solution for high-performance, high-density semiconductor packaging. Keywords: prior art comparison, hybrid interconnects, variable wire lengths, wire bonding, bump interconnects, semiconductor innovation, packaging differentiation.","question":"How is Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects different from prior art?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent has the potential to profoundly impact a wide range of industries that rely on advanced microelectronics.\n\n**Consumer Electronics**: This is a primary beneficiary. The technology enables thinner, lighter, and more powerful devices like smartphones, tablets, smartwatches, and virtual/augmented reality headsets by allowing more functionality to be packed into smaller form factors with enhanced performance and battery life.\n\n**High-Performance Computing (HPC) and Artificial Intelligence (AI)**: Industries requiring massive computational power, such as data centers, AI accelerators, and supercomputers, will benefit from the improved signal integrity, lower latency, and higher integration density. This enables faster processing of complex algorithms and more efficient memory solutions.\n\n**Automotive Electronics**: With the rise of autonomous vehicles and advanced driver-assistance systems (ADAS), there's a critical need for robust, high-performance, and compact computing units. This invention can lead to more reliable and powerful chips for in-car systems.\n\n**Internet of Things (IoT) and Edge Computing**: The ability to integrate more features into smaller, energy-efficient packages is ideal for IoT devices, smart sensors, and edge computing nodes, allowing for more intelligent processing closer to the data source. Keywords: consumer electronics, AI hardware, high-performance computing, automotive electronics, IoT, edge computing, industry impact, microelectronics applications.","question":"What industries will Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects impact?"},{"answer":"The patent application for Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects (US-9852969) was filed on **June 23, 2016**. This date marks when the inventors submitted their detailed description and claims to the patent office, initiating the examination process.\n\nThe patent was subsequently published, and the patent itself was granted, on **December 26, 2017**. The publication date typically signifies when the patent office makes the full details of the invention publicly available, even if it hasn't been formally granted yet. The granted date is when the patent rights are officially conferred upon the applicant, providing them with exclusive rights to the invention for a specified period.\n\nThese dates are crucial for understanding the patent's timeline within the technology landscape and its effective period of protection. For a comprehensive legal and technical review, these dates help establish prior art and determine the patent's current status. Keywords: filing date, publication date, patent granted, US-9852969 timeline, patent lifecycle, intellectual property.","question":"When was Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects filed/granted?"},{"answer":"The commercial applications of the Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent are extensive, covering virtually any sector requiring advanced, compact, and high-performance electronic components.\n\n**Mobile and Portable Devices**: This includes smartphones, tablets, smartwatches, and other wearables. The technology enables greater functionality and battery life in smaller form factors, driving innovation in consumer electronics.\n\n**Artificial Intelligence (AI) and Machine Learning (ML) Hardware**: Critical for AI accelerators in data centers, edge AI devices, and neuromorphic computing. The improved density and signal integrity are vital for processing complex AI algorithms efficiently.\n\n**High-Performance Computing (HPC)**: Used in servers, supercomputers, and specialized computing systems for scientific research, financial modeling, and complex simulations. The patent's benefits in latency and bandwidth are highly valued here.\n\n**Internet of Things (IoT) and Embedded Systems**: Facilitates the development of more sophisticated and compact sensors, smart home devices, industrial automation, and connected vehicles, where space and power efficiency are paramount. This innovation allows for more intelligent processing at the 'edge' of networks.\n\n**Networking and Telecommunications**: Essential for 5G/6G base stations, routers, and switches, where high-speed data processing and compact design are crucial for infrastructure development. Keywords: commercial applications, mobile technology, AI hardware, HPC, IoT devices, embedded systems, telecommunications, semiconductor market.","question":"What are the commercial applications of Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects?"},{"answer":"The Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects patent lays a robust foundation for numerous future developments in semiconductor packaging and integration.\n\nOne significant area of development will be **further optimization of variable wire lengths and materials**. Engineers will likely explore dynamic tuning of wire characteristics to adapt to specific thermal or electrical loads, potentially incorporating novel materials for even better conductivity, lower resistance, or enhanced mechanical properties. This could lead to highly adaptive and resilient chip stacks.\n\nAnother key area is **integration with other advanced 3D technologies**, such as Through-Silicon Vias (TSVs). Combining the hybrid interconnects with TSVs could create even denser and more complex 3D architectures, enabling truly monolithic 3D ICs where entire systems are vertically integrated, pushing the boundaries of miniaturization and performance beyond current capabilities.\n\nFurthermore, expect advancements in **manufacturing processes and automation**. As the technology matures, automated precision bonding techniques will become more sophisticated, potentially reducing manufacturing costs and increasing yield for these complex hybrid stacks. This could make advanced packaging more accessible for a wider range of applications and companies. The long-term vision includes highly modular and scalable chiplet-based designs, where diverse chiplets are seamlessly integrated using these hybrid interconnects, driving the next wave of computing innovation. Keywords: future developments, 3D ICs, TSVs, variable wire lengths, advanced manufacturing, chiplets, semiconductor roadmap, packaging innovation.","question":"What are the future developments expected for Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects?"}],"topics":["die stacks","wire bond arrays","bump interconnects","hybrid packaging","semiconductor packaging","technical","background","moore"],"tech_cluster":null},"seo":{"title":"Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects - US-9852969","description":"Explore US-9852969: Die Stacks with One or More Bond Via Arrays of Wire Bond Wires and with One or More Arrays of Bump Interconnects. Discover this hybrid chip stacking innovation for higher density & performance.","keywords":["die stacks","wire bond arrays","bump interconnects","hybrid packaging","semiconductor packaging","3D integration","microelectronics","chip stacking","US-9852969 patent","advanced packaging","high-density electronics","variable wire length","signal integrity","thermal management"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852969","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852969","citation_suggestion":"Patentable. \"Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects\" (US-9852969). https://patentable.app/patents/US-9852969","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852969","json":"https://patentable.app/api/llm-context/US-9852969","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T09:14:55.308Z"}