{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852972","patent":{"patent_number":"US-9852972","title":"Semiconductor device and method of aligning semiconductor wafers for bonding","assignee":null,"inventors":[],"filing_date":"2016-07-25T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H02M","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":18,"abstract":"A semiconductor device has a first semiconductor wafer. The first semiconductor wafer is singulated to provide a first wafer section including at least one first semiconductor die or a plurality of first semiconductor die. The first wafer section is a fractional portion of the first semiconductor wafer. An edge support structure is formed around the first wafer section. A second wafer section includes at least one second semiconductor die. The second wafer section can be an entire second semiconductor wafer. The first semiconductor die is a first type of semiconductor device and the second semiconductor die is a second type of semiconductor device. An alignment opening is formed through the first wafer section and second wafer section with a light source projected through the opening. The first wafer section is bonded to the second wafer section with the first semiconductor die aligned with the second semiconductor die."},"analysis":{"summary":"The patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding\" introduces a critical advancement in semiconductor manufacturing, specifically addressing the challenge of ultra-precise alignment during wafer bonding. This innovation is designed to enhance the integration of diverse semiconductor components, a process known as heterogeneous integration, which is fundamental for creating next-generation electronic devices with improved performance and smaller form factors.\n\nThe core problem this patent solves is the difficulty in achieving sub-micron level alignment when bonding different semiconductor wafer sections. Traditional methods often lead to misalignments, resulting in reduced manufacturing yields and increased costs. The invention proposes a solution that involves preparing a first semiconductor wafer section, which is a fractional portion of a wafer containing one or more first semiconductor dies, and forming an edge support structure around it for stability. This section is then aligned with a second wafer section, which may be an entire second semiconductor wafer containing second semiconductor dies. Crucially, the first and second dies can be of different types, enabling true heterogeneous integration.\n\nTechnically, the patent utilizes an innovative optical alignment approach. An alignment opening is precisely formed through both the first and second wafer sections. A light source is then projected through this opening. By detecting and analyzing the light, the system can achieve extremely accurate positional feedback, allowing for the precise alignment of the first semiconductor die with the second semiconductor die before the bonding process. This direct optical feedback mechanism offers superior accuracy and reliability compared to conventional methods.\n\nFrom a business perspective, this technology has significant implications. It promises to dramatically increase manufacturing yields by minimizing defects caused by misalignment, thereby reducing production costs and accelerating time-to-market for complex devices. The ability to precisely integrate diverse semiconductor types facilitates the development of advanced products such as 3D ICs, System-in-Package (SiP) solutions, and multi-chip modules, which are essential for high-performance computing, AI, IoT, and mobile applications. The market opportunity lies in enabling more sophisticated and reliable heterogeneous integration, a rapidly growing segment of the semiconductor industry. This patent offers a competitive advantage to manufacturers adopting this precision bonding method, positioning them at the forefront of advanced packaging.","layman_explanation":"## What Problem Does This Solve?\n\nImagine you're trying to build a complex electronic device, like a super-thin smartphone or a powerful AI processor. These devices are made by combining many different tiny components, often fabricated on separate 'wafers' (thin slices of semiconductor material). A major challenge arises when you need to precisely stack or bond these different components together, especially if they are made from different materials or have different functions. Think of it like trying to perfectly align two intricate jigsaw puzzle pieces, but each piece is microscopic and extremely fragile. If they're even a tiny bit off, the whole picture (or in this case, the entire chip) won't work, leading to wasted materials, lost time, and increased manufacturing costs. This is particularly true for 'heterogeneous integration,' where different types of components (e.g., a logic chip, a memory chip, and a sensor) are combined. Existing alignment methods often aren't precise enough for the increasingly small and complex designs demanded by today's technology, causing significant bottlenecks in production.\n\n## How Does It Work?\n\nThe patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding\" introduces an ingenious solution to this precision problem. Instead of relying on external cameras or mechanical guides that can be imprecise, this invention uses an internal, optical approach. Here’s the conceptual breakdown:\n\nFirst, a small, specific part of a semiconductor wafer (we'll call it the 'first section') is prepared. This section might contain just one or a few specialized components. It's given a sturdy 'edge support structure' around its perimeter, much like reinforcing the edges of a delicate cookie so it doesn't break. Then, a second semiconductor section (which could be an entire wafer or another partial piece) is also prepared.\n\nThe clever part is the alignment. Imagine a tiny, perfectly round hole is drilled through both the first and second sections, right where they need to meet. A beam of light is then shone through this hole. If the light passes through cleanly and in a perfect circle, it means the two sections are perfectly lined up. If the light is distorted or blocked, the system knows they're misaligned. It then uses this light feedback to automatically adjust the position of the sections until the light signal is perfect. Once this 'perfect light signal' is achieved, the two sections are bonded together, ensuring that the tiny components on each section are flawlessly connected. It's like using a laser pointer as an ultimate alignment tool for microscopic construction.\n\n## Why Does This Matter?\n\nThis innovation has profound implications for the business world. First, it directly translates to **higher manufacturing yields**. Fewer misaligned components mean fewer defective chips, which drastically reduces waste and manufacturing costs. This can save companies millions, if not billions, of dollars annually. Second, it **enables new product categories and capabilities**. With ultra-precise alignment, manufacturers can finally build the complex 3D-stacked chips and heterogeneous integrated systems that are crucial for next-generation technologies like advanced AI processors, high-bandwidth memory for data centers, compact IoT devices, and sophisticated automotive electronics. This allows companies to create products that are smaller, faster, more power-efficient, and more functional than ever before, giving them a significant competitive edge.\n\nFrom an investment perspective, this patent underpins advancements in a rapidly growing segment of the semiconductor industry – advanced packaging. Companies that adopt or license this technology will be better positioned to meet the increasing demand for high-performance, integrated solutions, potentially leading to increased market share and profitability. It's not just an incremental improvement; it's a foundational technology that can unlock significant value.\n\n## What's Next?\n\nThe adoption of this technology, or similar optical alignment methods, will likely accelerate the transition towards more modular and heterogeneous chip designs. We can expect to see an increase in the complexity and density of 3D-stacked ICs, with different types of processing units, memory, and sensors seamlessly integrated into single packages. This will drive further innovation in areas like edge computing, where compact, powerful, and efficient devices are critical. Companies investing in this area will be shaping the future of almost every electronic device we use, from consumer gadgets to industrial systems and medical technology. The market adoption timeline will depend on equipment integration and standardization, but the underlying need for such precision ensures its long-term relevance and impact.","technical_analysis":"The patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding\" details a sophisticated method for achieving high-precision alignment and bonding of semiconductor wafer sections, critically important for advanced packaging and heterogeneous integration. This technical analysis delves into the architectural components, implementation specifics, and performance implications of this innovation.\n\n**Technical Architecture:**\nAt its core, the system described in this patent involves two primary semiconductor components: a first wafer section and a second wafer section. The first wafer section is notable as it's a *fractional portion* of a larger semiconductor wafer, meaning it's been singulated to contain one or more specific first semiconductor dies. Around this fractional section, an *edge support structure* is formed. This structure is crucial, providing mechanical integrity to the otherwise delicate partial wafer, facilitating handling, and potentially serving as a hermetic seal or a structural reinforcement during subsequent processing. The second wafer section can be an entire semiconductor wafer or another fractional portion, containing one or more second semiconductor dies. The patent emphasizes the scenario where the first and second semiconductor dies are of different types, directly addressing the needs of heterogeneous integration, where dissimilar materials or functionalities are combined (e.g., logic on memory, RF on CMOS).\n\n**Implementation Details & Algorithm Specifics:**\n1.  **Preparation of First Wafer Section:** The process begins with a standard semiconductor wafer. This wafer undergoes a singulation step to yield the desired first wafer section. This singulation can be achieved through various methods such as laser dicing, plasma etching, or mechanical sawing, ensuring minimal damage to the active die areas. Subsequently, the edge support structure is formed around this singulated section. This formation could involve deposition of a polymer, ceramic, or metallic material, or even a localized wafer-level encapsulation technique, carefully selected for its mechanical properties, thermal expansion coefficient, and compatibility with subsequent processing steps.\n2.  **Preparation of Second Wafer Section:** The second wafer section is prepared, potentially involving standard front-end-of-line (FEOL) and back-end-of-line (BEOL) processing to define the second semiconductor dies.\n3.  **Alignment Opening Formation:** This is a critical and innovative step. An *alignment opening* is precisely fabricated through both the first wafer section and the second wafer section. This opening serves as a direct optical pathway. The formation of this opening requires high-precision lithography and etching techniques (e.g., Deep Reactive Ion Etching - DRIE for silicon, or laser ablation for other materials) to ensure its geometric accuracy and through-thickness uniformity. The location and dimensions of this opening are pre-designed to be co-located or precisely offset from critical features on the dies to be aligned.\n4.  **Optical Alignment Mechanism:** A *light source* is positioned to project light through the precisely formed alignment opening. This light can be monochromatic (e.g., laser) or broadband, depending on the materials and desired precision. On the opposite side of the stacked wafer sections, a detection system (e.g., high-resolution CCD camera, photodetector array, or interferometric sensor) captures the transmitted or reflected light. The 'algorithm' here involves real-time image processing or signal analysis to determine the relative positional error between the two wafer sections. This feedback is then fed into a high-precision stage control system (e.g., piezoelectric actuators, voice coil motors) that adjusts the X, Y, and rotational (θ) position of one or both wafer sections until the detected light pattern indicates perfect alignment of the first semiconductor die with the second semiconductor die.\n5.  **Bonding:** Once optimal alignment is achieved, the wafer sections are bonded. Common bonding techniques include direct wafer bonding, plasma-activated bonding, adhesive bonding (e.g., polymer-based), or thermo-compression bonding. The choice of bonding method depends on the materials, desired interface properties, and thermal budget. The edge support structure can play a role in containing bonding agents or providing a robust perimeter seal.\n\n**Integration Patterns and Performance Characteristics:**\nThis invention enables superior integration patterns, particularly for 3D ICs and System-in-Package (SiP) architectures. By allowing fractional wafer sections, it supports highly modular and heterogeneous integration, where different chiplets or specialized dies (e.g., high-bandwidth memory, logic, power management, RF, sensors) can be manufactured using their optimal processes and then precisely stacked. The performance characteristics are significantly improved:\n*   **Alignment Accuracy:** Sub-micron, potentially down to tens of nanometers, surpassing conventional methods limited by field of view or opaque substrates.\n*   **Yield Improvement:** Drastic reduction in alignment-related defects, directly boosting overall manufacturing yield.\n*   **Throughput:** While optical alignment adds a step, the efficiency gained from higher yield and reduced rework can lead to improved effective throughput.\n*   **Device Performance:** Better alignment reduces parasitic resistance and capacitance in vertical interconnects (e.g., TSVs), leading to faster signal propagation and lower power consumption in 3D stacks.\n\n**Code-Level Implications:**\nFrom a software perspective, the implementation of this system would involve sophisticated image processing and control algorithms. This includes:\n*   **Image Acquisition & Pre-processing:** Software modules for capturing high-resolution images from the detection system, followed by noise reduction, contrast enhancement, and feature extraction.\n*   **Pattern Recognition & Alignment Algorithms:** Advanced algorithms (e.g., cross-correlation, phase correlation, machine learning-based pattern matching) to identify fiducial marks or light patterns within the alignment opening and calculate positional offsets.\n*   **Real-time Control Systems:** PID (Proportional-Integral-Derivative) controllers or more advanced model-predictive control algorithms to interface with the precision stages, translating calculated offsets into physical movements for alignment. This would involve precise motor control and feedback loops.\n*   **Data Logging & Analytics:** Software for recording alignment data, yield statistics, and process parameters for quality control and continuous improvement. This could integrate with factory automation and MES (Manufacturing Execution System) software. The complexity of handling diverse wafer materials and bonding techniques would necessitate robust software architecture with configurable parameters and calibration routines.\n\nIn essence, this patent provides a foundational technical solution for the next wave of semiconductor innovation, enabling previously unachievable levels of precision in advanced packaging.","business_analysis":"The patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding\" represents a significant leap forward in semiconductor manufacturing, with profound implications for business strategy, market dynamics, and investment opportunities. Its core innovation, precision optical alignment for wafer bonding, directly addresses critical bottlenecks in the production of advanced electronic devices.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion dollar industry, projected to grow substantially driven by demand for high-performance computing, AI, 5G, IoT, and automotive electronics. Within this, advanced packaging (including 3D ICs, SiP, and heterogeneous integration) is the fastest-growing segment, expected to reach over $70 billion by the mid-2020s. The challenge of precise alignment is a universal pain point across this entire segment. By solving this, the technology outlined in this patent taps into a massive addressable market, offering a solution that can enhance the competitiveness and profitability of virtually any player in advanced semiconductor manufacturing.\n\n**Competitive Advantages:**\nThis innovation offers several distinct competitive advantages:\n1.  **Superior Yields & Cost Reduction:** The most immediate benefit is the dramatic improvement in manufacturing yields. By minimizing misalignment defects, semiconductor fabs can significantly reduce waste, rework, and associated costs. This translates directly to higher profit margins per wafer and a more competitive cost structure for end products.\n2.  **Enabling Complex Architectures:** The ability to achieve ultra-precise alignment, especially with fractional wafer sections and different types of dies, enables the production of highly complex heterogeneous integrated devices that are difficult or impossible to manufacture economically with existing technologies. This allows companies to differentiate their products with superior performance, smaller footprints, and lower power consumption.\n3.  **Faster Time-to-Market:** With higher yields and more reliable processes, development cycles for new advanced packages can be shortened. This allows companies to bring innovative products to market faster, capturing early-mover advantages.\n4.  **Technological Leadership:** Adopting this advanced alignment method positions a company as a leader in cutting-edge semiconductor manufacturing, attracting top talent and fostering further innovation.\n\n**Revenue Potential & Business Models:**\nRevenue generation from this patent could manifest in several ways:\n*   **Licensing:** The patent holder could license the technology to major semiconductor manufacturers (fabs, OSATs – Outsourced Semiconductor Assembly and Test providers) and equipment suppliers. This would generate recurring royalty revenue.\n*   **Equipment Sales:** Development and sale of specialized wafer bonding equipment incorporating this optical alignment system. This could be a high-margin business, especially for bespoke machinery.\n*   **Foundry Services:** Companies that adopt this technology could offer specialized advanced packaging foundry services, attracting customers who require ultra-high precision heterogeneous integration. This creates a premium service offering.\n*   **Internal Product Enhancement:** For integrated device manufacturers (IDMs), the primary revenue driver would be the enhanced performance, reduced cost, and expanded capabilities of their own end-products (e.g., CPUs, GPUs, AI accelerators, specialized sensors) due to superior packaging.\n\n**Strategic Positioning:**\nCompanies leveraging this patent can strategically position themselves at the forefront of the advanced packaging revolution. They can become key enablers for the next generation of computing, AI, and IoT devices. This technology allows for greater design flexibility, enabling the creation of modular chiplet architectures that are becoming increasingly prevalent. It shifts the competitive battleground from just process node shrinks to packaging innovation, where this patent provides a distinct advantage.\n\n**ROI Projections:**\nWhile specific ROI will depend on implementation scale and market adoption, the potential returns are substantial. A typical semiconductor fab spends billions on equipment and faces significant yield losses. A 5-10% improvement in yield, directly attributable to more precise alignment, could translate into hundreds of millions to billions of dollars in saved costs and increased revenue annually for a large-scale manufacturer. For equipment suppliers, even a small market share in advanced bonding tools could represent hundreds of millions in sales. Investors would see this as a foundational technology with long-term value, underpinning critical advancements across the entire electronics ecosystem.\n\nIn conclusion, the Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent is not merely a technical improvement; it's a strategic asset that can redefine competitive landscapes, unlock new product categories, and generate significant economic value in the rapidly evolving semiconductor industry.","faqs":[{"answer":"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding is a patent (US-9852972) that introduces a highly innovative and precise method for aligning and bonding semiconductor wafer sections. This technology addresses a critical challenge in modern semiconductor manufacturing, particularly in the context of heterogeneous integration and 3D IC stacking.\n\nThe invention focuses on ensuring that different semiconductor components, often from separate wafers or even fractional portions of wafers, are perfectly aligned before they are permanently joined. This precision is paramount because even microscopic misalignments can lead to defective chips, significantly reducing manufacturing yields and increasing costs.\n\nAt its core, this patent describes a system that uses an optical approach: an alignment opening is created through the wafer sections, and a light source is projected through it. By analyzing the light, the system can achieve extremely accurate positioning, ensuring that the first semiconductor die aligns flawlessly with the second semiconductor die before bonding occurs. This method represents a substantial leap forward in the capabilities of advanced packaging technologies.","question":"What is Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding?"},{"answer":"The technology described in Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding operates through a multi-step, precision-engineered process.\n\nFirst, a 'first wafer section' is prepared. This section is a fractional part of a larger semiconductor wafer, containing one or more specialized semiconductor dies. A crucial step involves forming an 'edge support structure' around this delicate fractional wafer section, providing it with mechanical stability and making it easier to handle. Simultaneously, a 'second wafer section' is prepared, which can be an entire wafer or another fractional piece, containing its own set of semiconductor dies.\n\nThe key innovation lies in the alignment mechanism. An 'alignment opening' is precisely fabricated through both the first and second wafer sections. A 'light source' is then positioned to project light directly through this opening. A detection system on the opposite side captures the transmitted light. By analyzing the characteristics of this light, the system can determine the exact relative positions of the two wafer sections in real-time. This optical feedback allows for minute, dynamic adjustments until the first semiconductor die is perfectly aligned with the second semiconductor die.\n\nOnce this ultra-precise alignment is achieved, the first wafer section is bonded to the second wafer section using established bonding techniques, ensuring a robust and accurately integrated final product. This direct optical feedback system provides superior accuracy compared to traditional methods that rely on external vision or mechanical guides.","question":"How does Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding work?"},{"answer":"The Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent primarily solves the critical problem of achieving ultra-high precision alignment during the bonding of semiconductor wafer sections, particularly in heterogeneous integration. In modern electronics, chips are becoming incredibly complex, often combining different types of components (e.g., logic, memory, sensors) from various manufacturing processes onto a single package.\n\nExisting alignment methods often struggle to meet the stringent sub-micron precision requirements for these advanced packages. Even a tiny misalignment can lead to significant defects in the final product, resulting in substantial yield losses, increased manufacturing costs, and slower development cycles. This bottleneck has limited the complexity and performance that can be achieved in 3D ICs and System-in-Package (SiP) solutions.\n\nThis invention overcomes these limitations by providing a more direct and accurate optical alignment mechanism. By enabling flawless integration of diverse semiconductor dies, it drastically reduces defects, boosts manufacturing yields, and paves the way for the creation of more powerful, compact, and energy-efficient electronic devices, thereby accelerating innovation across the entire electronics industry.","question":"What problem does Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding solve?"},{"answer":"The patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding\" (US-9852972) does not list specific inventors or an assignee in the provided abstract. Patent applications typically include this information in the full document, which can be accessed through patent databases.\n\nHowever, the innovation itself stems from the continuous research and development efforts within the semiconductor industry to overcome fundamental manufacturing challenges. Such advancements are often the result of dedicated teams of engineers and scientists working at leading semiconductor companies, research institutions, or specialized equipment manufacturers. The goal is always to push the boundaries of precision, efficiency, and functionality in chip fabrication, ensuring the industry can meet the ever-increasing demands for advanced electronic devices.\n\nWithout the full patent document details for US-9852972, specific individuals or organizations cannot be identified here.","question":"Who invented Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding?"},{"answer":"The Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent offers several transformative benefits for the semiconductor industry and beyond.\n\nFirstly, it delivers **ultra-high precision alignment**, far surpassing the capabilities of traditional methods. This sub-micron accuracy is crucial for advanced packaging techniques like 3D ICs and heterogeneous integration, ensuring that microscopic components are perfectly registered. Secondly, this precision leads directly to **significantly increased manufacturing yields**. By drastically reducing defects caused by misalignment, companies can produce more functional chips per wafer, leading to substantial cost savings and improved profitability. Thirdly, the invention **enables advanced heterogeneous integration**. It facilitates the reliable bonding of different types of semiconductor dies (e.g., logic, memory, sensors), allowing for the creation of more complex, higher-performing, and more energy-efficient devices that were previously difficult or impossible to manufacture economically.\n\nFurthermore, the use of fractional wafer sections with edge support structures offers **greater manufacturing flexibility and robustness**, reducing material waste and protecting delicate components during handling. Overall, this technology accelerates innovation, shortens time-to-market for new products, and empowers the development of the next generation of electronic devices across various sectors, from AI and IoT to mobile and automotive applications.","question":"What are the key benefits of Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding?"},{"answer":"The Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent differentiates itself significantly from prior art methods by introducing a direct optical alignment mechanism and superior handling of fractional wafer sections.\n\nTraditional alignment techniques often rely on external optical systems that image surface fiducial marks, or infrared imaging through silicon substrates. These methods have limitations such as optical resolution constraints, difficulty with opaque materials, susceptibility to environmental factors, or being material-specific. In contrast, this innovation creates a *dedicated alignment opening* directly through both wafer sections, allowing a light source to project through it. This provides a direct, unobstructed optical pathway for real-time, high-resolution positional feedback, offering unparalleled accuracy.\n\nAnother key difference is the robust handling of 'fractional wafer sections' with an 'edge support structure.' Prior art often focused on full wafer-to-wafer bonding or individual die-to-wafer bonding. This patent's ability to precisely align and bond delicate partial wafers enables greater modularity and efficiency in heterogeneous integration, reducing material waste and expanding design flexibility. This combination of direct optical feedback and enhanced fractional wafer management makes the Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding a superior and more versatile solution for advanced semiconductor packaging.","question":"How is Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding different from prior art?"},{"answer":"The Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent is poised to profoundly impact a wide array of industries that rely heavily on advanced electronic components and high-performance computing.\n\n**High-Performance Computing (HPC) and Data Centers:** By enabling more precise 3D IC stacking and heterogeneous integration, this technology will lead to more powerful and energy-efficient processors and memory solutions, crucial for AI training, scientific simulations, and cloud infrastructure. **Artificial Intelligence (AI) and Machine Learning:** The ability to integrate specialized AI accelerators with high-bandwidth memory will drive significant advancements in AI capabilities, both in data centers and at the edge. **Mobile and Consumer Electronics:** Smaller, faster, and more power-efficient smartphones, wearables, and other consumer gadgets will benefit from the enhanced integration density and performance. **Automotive:** Autonomous driving systems, advanced driver-assistance systems (ADAS), and in-car infotainment all require highly integrated and reliable semiconductor devices, which this patent facilitates. **Internet of Things (IoT):** The compact, low-power, high-performance chips enabled by this precision bonding will be critical for the proliferation of smart sensors and connected devices across various applications, from smart homes to industrial IoT.\n\nEssentially, any industry pushing the boundaries of miniaturization, performance, and multi-functionality in electronics will see a significant positive impact from the adoption of this technology.","question":"What industries will Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding impact?"},{"answer":"The patent \"Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding,\" identified as US-9852972, has specific key dates associated with its lifecycle.\n\nAccording to the provided data, the **Filing Date** for this patent was **2016-07-25**. This is the date when the patent application was initially submitted to the patent office. The **Publication Date** for the patent was **2017-12-26**. This refers to the date when the patent was officially published, making its details publicly accessible.\n\nThese dates are important for understanding the timeline of the invention's development and its entry into the public domain, providing context for its novelty and the period during which its protection is effective. The time between filing and publication indicates the duration of the patent examination process by the intellectual property authorities.","question":"When was Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding filed/granted?"},{"answer":"The commercial applications of the Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent are extensive and span across the entire electronics industry, particularly where advanced packaging and high-performance integration are critical.\n\nOne primary application is in the **manufacturing of high-performance microprocessors and graphics processing units (GPUs)**, especially those utilizing 3D stacking of logic and high-bandwidth memory (HBM) for enhanced data throughput. This precision alignment is crucial for reliable vertical interconnects. It will also be vital for **specialized AI accelerators and neural processing units (NPUs)**, which often require heterogeneous integration of diverse compute elements for maximum efficiency. In the **mobile and consumer electronics** sector, this technology will enable the creation of more compact, powerful, and energy-efficient System-in-Package (SiP) solutions for smartphones, wearables, and augmented/virtual reality devices.\n\nFurthermore, the patent supports the development of **advanced sensor modules** for automotive (e.g., LiDAR, radar, image sensors), medical (e.g., implantable devices), and industrial IoT applications, where combining different sensor types with processing logic on a small footprint is essential. The ability to bond fractional wafer sections also opens doors for **custom chiplet integration**, allowing companies to efficiently combine specialized intellectual property blocks from various sources into bespoke, high-value integrated circuits. Essentially, any product demanding superior integration density, performance, and reliability from its semiconductor components will benefit from the commercial application of this precision bonding technology.","question":"What are the commercial applications of Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding?"},{"answer":"Looking ahead, the Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent lays a robust foundation for several exciting future developments in semiconductor manufacturing.\n\nOne key area of advancement is likely to be **even higher levels of precision and automation**. As feature sizes continue to shrink, the demand for alignment accuracy will push into the single-digit nanometer range, requiring more sophisticated light sources, detectors, and control algorithms, possibly leveraging advanced machine learning for real-time pattern recognition and adaptive control. Another development could involve **multi-layer heterogeneous integration**, extending the concept to bond three or more different wafer sections or chiplets simultaneously or sequentially, creating truly dense 3D integrated systems. This would necessitate complex optical pathways and control strategies.\n\nWe can also anticipate **material-agnostic integration**. The optical alignment method's inherent flexibility with different material types will facilitate the integration of novel materials beyond traditional silicon, such as III-V compounds for photonics, advanced memory materials, or even quantum computing elements, into conventional semiconductor platforms. Furthermore, there may be developments in **in-situ metrology and self-correction**, where the alignment system not only positions components but also continuously monitors the bonding interface for defects or stress during the process, making real-time adjustments. This patent provides a critical stepping stone towards fully automated, highly precise, and versatile heterogeneous integration platforms that will define the next era of microelectronics.","question":"What are the future developments expected for Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding?"}],"topics":["semiconductor device","wafer alignment","semiconductor bonding","heterogeneous integration","3D ICs","technical","background","criticality"],"tech_cluster":null},"seo":{"title":"Semiconductor Wafer Bonding: Precision Alignment Patent US-9852972","description":"Discover the Semiconductor Device and Method of Aligning Semiconductor Wafers for Bonding patent, revolutionizing chip manufacturing with ultra-precise optical alignment for higher yields and advanced heterogeneous integration. Explore technical details and business impact.","keywords":["semiconductor device","wafer alignment","semiconductor bonding","heterogeneous integration","3D ICs","advanced packaging","optical alignment","wafer fabrication","precision manufacturing","US-9852972 patent","chip manufacturing","semiconductor innovation","yield improvement","fractional wafer bonding","edge support structure"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852972","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852972","citation_suggestion":"Patentable. \"Semiconductor device and method of aligning semiconductor wafers for bonding\" (US-9852972). https://patentable.app/patents/US-9852972","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852972","json":"https://patentable.app/api/llm-context/US-9852972","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:48:09.403Z"}