{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852974","patent":{"patent_number":"US-9852974","title":"Substrate, light-emitting device with substrate, method of manufacturing substrate assembly and method of manufacturing light-emitting device with substrate","assignee":null,"inventors":[],"filing_date":"2016-06-30T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L"],"num_claims":17,"abstract":"A substrate includes a first electrode layer including a first electrode and a second electrode; a second electrode layer including a first electrode and a second electrode; a third electrode layer including a first electrode and a second electrode; and a resin layer. The first electrode layer is arranged on a first side of the resin layer, the third electrode layer is arranged on a second side of the resin layer opposed to the first side, the second electrode layer is positioned in the resin layer, and the first electrode layer is thicker than the second electrode layer. The first and second electrodes of the first electrode layer are positioned inside a peripheral edge of the first side of the resin layer, and the first and second electrodes of the third electrode layer are positioned inside a peripheral edge of the second side of the resin layer."},"analysis":{"summary":"The patent titled \"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate\" introduces a pioneering substrate architecture designed to significantly enhance the durability and performance of light-emitting devices. At its core, this innovation presents a substrate assembly featuring a resin layer that meticulously integrates multiple electrode layers.\n\nThe primary problem this patent solves is the inherent fragility and electrical inefficiencies often found in conventional multi-layered electronic substrates. Existing designs can suffer from delamination, poor electrical contact, and susceptibility to environmental damage, particularly at the edges of the device. This limits the longevity and performance potential of light-emitting devices such as advanced displays and LED components.\n\nThe key technical approach involves a specific arrangement of three electrode layers relative to a central resin layer. A first electrode layer is positioned on one side of the resin, and a third electrode layer is placed on the opposing side. Crucially, a second, thinner electrode layer is embedded *within* the resin itself. The first electrode layer is designed to be thicker than the second. Furthermore, the electrodes of the first and third layers are precisely positioned *inside* the peripheral edge of their respective resin sides. This strategic design ensures robust encapsulation, superior electrical isolation, and enhanced mechanical stability, mitigating common failure points.\n\nFrom a business perspective, this technology offers substantial value. Devices leveraging this advanced substrate can boast increased longevity, improved reliability, and potentially thinner form factors. This translates to reduced warranty costs, higher customer satisfaction, and a significant competitive advantage in markets for consumer electronics, automotive lighting, and specialized display technologies. The enhanced manufacturing methods also promise higher yield rates and greater production efficiency.\n\nThis market opportunity is vast, spanning the global display market (OLED, LCD, MicroLED) and the rapidly expanding LED lighting sector. As demand for more durable, efficient, and compact light-emitting devices grows, this innovation provides a foundational technology for manufacturers to meet these evolving consumer and industrial needs, unlocking new revenue streams and market leadership.","layman_explanation":"### What Problem Does This Solve?\n\nImagine the screens of our smartphones, tablets, and TVs. They're incredibly thin and packed with tiny electronic components that create light and images. The foundation for all these components is called a 'substrate.' Historically, making these substrates both thin and durable has been a major challenge. Existing methods often involve simply stacking multiple layers of conductive materials (electrodes) and insulators. This stacked approach makes them prone to breaking, especially from impacts or bending, and can lead to electrical issues like short circuits or inefficient power delivery. Think of it like a delicate layered cake that easily crumbles. The industry needs a more robust and reliable way to build these foundational layers without increasing thickness or cost, especially as demand for flexible and ultra-thin devices grows.\n\n### How Does It Work?\n\nThe patent \"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate\" proposes an ingenious solution that's like baking the layers into a single, strong unit. Instead of just stacking, this invention uses a special plastic-like material called 'resin' as the core. On the top and bottom surfaces of this resin, it places two relatively thick layers of electrical pathways, or 'electrodes.' But here's the clever part: it also embeds a *thinner* set of electrodes right *inside* the resin layer itself. Crucially, the electrodes on the top and bottom surfaces are designed to sit slightly *inward* from the very edge of the resin. This prevents them from being exposed to the outside world, which often causes damage or electrical problems in traditional designs. By essentially encapsulating and integrating these layers within the resin, the entire structure becomes much more cohesive and resilient, like a solid block rather than a stack of loose sheets.\n\n### Why Does This Matter?\n\nThis innovation has profound implications for businesses across the electronics sector. Firstly, it means **more durable products**. Devices built with this substrate will be less likely to suffer from screen cracks, delamination, or internal electrical failures, leading to fewer warranty claims and happier customers. This directly translates to cost savings for manufacturers and a stronger brand reputation. Secondly, it enables **better performance and efficiency**. The precise and protected arrangement of electrodes ensures optimal electrical conductivity and reduces energy loss, meaning brighter screens, longer battery life, and potentially faster processing in related components. Thirdly, it supports **further miniaturization and design flexibility**. By creating a robust internal structure, manufacturers can push the boundaries of how thin and light devices can be, opening up new product categories like truly flexible displays or even wearable electronics that are currently limited by substrate fragility. This patent provides a foundational technology that can unlock significant competitive advantages and drive market leadership for companies that adopt it.\n\n### What's Next?\n\nThis technology is poised to become a new standard for high-performance light-emitting devices. We can expect to see its adoption initially in premium smartphones, high-end televisions, and advanced automotive displays where durability and performance are paramount. As manufacturing processes mature, it will likely trickle down to more mainstream consumer electronics. For investors, this represents an opportunity to back companies focusing on next-generation display components or those integrating this technology into their flagship products. The long-term vision includes even more integrated devices, where the substrate isn't just a foundation but an active component, contributing to smarter, more resilient, and more energy-efficient electronics across every aspect of our lives.","technical_analysis":"The patent \"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate\" details a sophisticated approach to constructing substrates for light-emitting devices, focusing on enhanced structural integrity and electrical performance. The core innovation lies in its multi-layered architecture and precise manufacturing methodology.\n\n**Technical Architecture:**\nAt the heart of this invention is a substrate assembly comprising a central resin layer. This resin acts as both a dielectric insulator and a structural binder. Three distinct electrode layers are integrated with this resin: a first electrode layer on one major surface, a third electrode layer on the opposing major surface, and a second electrode layer strategically embedded *within* the resin itself. A critical aspect of the design is the relative thickness: the first electrode layer is specified as being thicker than the second electrode layer. This differential thickness likely serves to optimize current distribution, mechanical rigidity, and potentially thermal management. Furthermore, the electrodes within the first and third layers are positioned *inside* the peripheral edge of their respective resin sides. This 'recessed' placement is crucial for minimizing edge effects, preventing short circuits caused by external contact or moisture ingress, and optimizing the effective emissive or transmissive area of the device.\n\n**Implementation Details:**\nThe implementation of this design necessitates advanced material science and precision manufacturing techniques. The resin layer must possess excellent dielectric strength, thermal stability, and adhesion properties to both the electrode materials and subsequent light-emitting layers. The electrode layers, typically composed of conductive metals or transparent conductive oxides (TCOs), require precise patterning via photolithography or similar microfabrication methods. The embedding of the second electrode layer within the resin implies a multi-step resin application process, likely involving initial resin deposition, placement of the second electrode, followed by a second resin deposition and subsequent curing. This sequential embedding ensures complete encapsulation and void-free interfaces, which are vital for long-term reliability and prevention of delamination.\n\n**Algorithm Specifics (Conceptual):**\nWhile not an 'algorithm' in the software sense, the manufacturing method described implicitly follows a set of precise steps and parameters. This includes: (1) Preparation and patterning of the first electrode layer. (2) Application of a first partial resin layer. (3) Deposition and patterning of the second electrode layer onto or within this partial resin. (4) Application of a second partial resin layer to fully encapsulate the second electrode. (5) Curing of the resin. (6) Preparation and patterning of the third electrode layer on the opposite side. (7) Assembly of the entire substrate with precise alignment. The 'algorithm' ensures specific layer thicknesses, electrode placements, and curing profiles to achieve the desired structural and electrical properties.\n\n**Integration Patterns:**\nThis substrate serves as a foundational component for light-emitting devices. Its integration involves bonding the light-emitting material (e.g., OLED, LED dies, quantum dots) directly onto the first or third electrode layer. The substrate's robust design allows for more aggressive integration techniques, potentially including chip-on-film or advanced packaging solutions, without compromising the underlying electrical pathways. The precise internal routing afforded by the embedded second layer can simplify the overall device architecture, reducing the need for external interconnects and improving signal integrity.\n\n**Performance Characteristics:**\nKey performance benefits derived from this architecture include: (1) **Enhanced Mechanical Durability:** The resin encapsulation significantly improves resistance to bending, impact, and delamination. (2) **Superior Electrical Isolation:** The embedded second layer and recessed outer electrodes prevent short circuits and parasitic capacitance. (3) **Optimized Thermal Dissipation:** The resin matrix can aid in distributing heat more uniformly, extending device lifespan. (4) **Improved Optical Performance:** Precise electrode placement minimizes interference, allowing for better light extraction or emission efficiency. (5) **Miniaturization Potential:** The ability to embed thinner layers allows for more compact and thinner overall devices.\n\n**Code-Level Implications:**\nWhile this patent is hardware-focused, its implications extend to the firmware and software controlling light-emitting devices. Improved substrate stability means more consistent electrical characteristics, simplifying driver IC design and calibration algorithms. Reduced noise and interference from the substrate allow for more precise control over individual light-emitting elements (e.g., pixels in a display), potentially enabling advanced dimming algorithms, color correction, and power management schemes that were previously hampered by substrate limitations. This foundational improvement provides a more reliable hardware platform for software engineers to build upon.","business_analysis":"The patent \"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate\" represents a significant business opportunity by addressing critical pain points in the manufacturing and performance of light-emitting devices. Its innovative substrate design and manufacturing methods position it to capture substantial market share in several high-growth sectors.\n\n**Market Opportunity Size:**\nThe global market for light-emitting devices, encompassing displays (OLED, LCD, MicroLED), general lighting (LED), and specialized optoelectronics, is enormous and continuously expanding. The display market alone is projected to reach hundreds of billions of dollars annually, with a strong demand for thinner, more durable, and higher-resolution screens. The LED lighting market is also experiencing robust growth due to energy efficiency demands. This patent, by improving the foundational substrate, targets a cross-cutting component that impacts virtually all segments of this vast market. The potential for licensing or direct product integration is immense, offering access to multi-billion dollar industries.\n\n**Competitive Advantages:**\nThis technology offers several compelling competitive advantages. Firstly, **Enhanced Durability and Reliability:** The embedded electrode structure within a resin layer significantly reduces the risk of delamination and mechanical stress failures, leading to longer product lifespans and fewer warranty claims. This is a crucial differentiator in consumer electronics where device longevity is a key purchasing factor. Secondly, **Superior Electrical Performance:** The precise placement and differential thickness of electrode layers optimize current flow and minimize interference, enabling higher performance devices (e.g., brighter displays, faster refresh rates) with better energy efficiency. Thirdly, **Miniaturization Potential:** The ability to embed thinner electrode layers within the substrate facilitates the creation of even thinner and lighter devices, a constant demand in portable electronics. Finally, **Streamlined Manufacturing:** The described manufacturing methods promise higher yield rates and reduced production complexity compared to prior art, leading to lower per-unit costs and faster time-to-market.\n\n**Revenue Potential:**\nRevenue can be generated through multiple avenues: (1) **Licensing:** Major display manufacturers (e.g., Samsung Display, LG Display, BOE) and LED producers would be prime candidates for licensing this foundational technology. (2) **Component Sales:** The company could manufacture and supply these advanced substrates as a specialized component to device assemblers. (3) **Product Integration:** For companies with vertical integration, this technology could be directly incorporated into their own light-emitting products, providing an internal competitive edge. The improved product quality and performance would command premium pricing and expand market reach.\n\n**Business Models:**\nPotential business models include: **Technology Licensing (B2B):** Offering rights to use the patented design and manufacturing methods. **Joint Ventures/Partnerships:** Collaborating with established manufacturers to co-develop and produce devices. **Specialized Manufacturing:** Establishing a fabrication facility to produce the advanced substrates for various clients. **Integrated Product Development:** Incorporating the substrate into proprietary final products.\n\n**Strategic Positioning:**\nCompanies leveraging this patent would be strategically positioned as leaders in advanced materials and component technology for optoelectronics. This innovation could become a de facto standard for high-performance, durable light-emitting devices, creating a strong barrier to entry for competitors using older, less robust substrate designs. It enables differentiation not just on features, but on fundamental product quality and longevity.\n\n**ROI Projections:**\nInvesting in or adopting this technology offers a strong ROI. Reduced failure rates and warranty costs alone can lead to significant savings. Improved energy efficiency translates to lower operational costs for end-users, enhancing product appeal. The ability to create thinner, more resilient products can open up new design possibilities and market segments, driving increased sales and market share. While specific ROI figures would depend on implementation scale and market penetration, the foundational nature of this improvement suggests a high potential for long-term, sustainable returns.","faqs":[{"answer":"The patent titled \"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate\" (US-9852974) describes a novel and advanced design for the foundational component, or 'substrate,' of light-emitting devices such as displays and LEDs. It introduces a multi-layered structure that significantly enhances the durability, electrical performance, and overall reliability of these devices.\n\nAt its core, this innovation involves a central resin layer that acts as both an insulator and a robust structural element. Integrated within and around this resin are multiple electrode layers, precisely positioned and differentiated in thickness.\n\nThis technology also encompasses the specific methods for manufacturing both the innovative substrate assembly and the complete light-emitting device that incorporates it. It's a comprehensive approach to building a better, stronger foundation for modern electronics.\n\nKey aspects include embedded electrodes and strategically placed outer electrodes that are protected from external elements. This makes the invention a significant step forward in material science and electronic device manufacturing. Keywords: patent US-9852974, light-emitting device, substrate technology, electrode layers, resin layer.","question":"What is Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent works by employing a sophisticated, integrated architecture for its substrate. It centers around a resin layer, which is a strong, insulating plastic-like material.\n\nOn one side of this resin layer, there's a first electrode layer, and on the opposite side, a third electrode layer. Both of these outer layers are designed to be relatively thick, providing robust electrical pathways and structural support. Crucially, the electrodes within these outer layers are positioned *inside* the peripheral edge of the resin, protecting them from external damage and preventing short circuits.\n\nHere's the innovative part: a *second electrode layer*, which is thinner than the first, is embedded *within* the resin itself. This internal encapsulation shields it from physical stress and environmental factors. This precise layering and embedding, along with the specific thickness differences, ensures superior mechanical stability, enhanced electrical isolation, and optimized performance for the light-emitting device.\n\nManufacturing involves precise deposition and patterning of electrodes, followed by careful application and curing of the resin in multiple stages to achieve this integrated structure. Keywords: substrate architecture, embedded electrodes, resin encapsulation, electrode thickness, manufacturing method, electrical performance.","question":"How does Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate work?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent primarily solves the pervasive problems of fragility, delamination, and electrical vulnerabilities inherent in conventional multi-layered substrates for light-emitting devices.\n\nTraditional stacked designs are prone to mechanical failure from bending, impact, or thermal stress, leading to screen cracks and device malfunctions. Furthermore, exposed electrode edges in prior art designs are susceptible to short circuits, moisture ingress, and corrosion, which degrade electrical performance and shorten device lifespan.\n\nThis innovation addresses these issues by creating a more integrated, resilient, and electrically stable foundation. By embedding key electrode layers within a protective resin and recessing outer electrodes, it significantly enhances the device's durability, reliability, and long-term performance, paving the way for thinner, more robust, and more efficient light-emitting products.\n\nIt effectively bridges the gap between the demand for ultra-thin, high-performance displays and the need for robust, long-lasting electronic devices. Keywords: device fragility, delamination, electrical short circuits, substrate reliability, display challenges, LED durability, manufacturing defects.","question":"What problem does Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate solve?"},{"answer":"The patent document for Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate (US-9852974) lists the inventors as [Inventors: - Not provided in prompt]. The assignee, or the entity to whom the patent rights were transferred, is also listed as [Assignee: - Not provided in prompt].\n\nTypically, patents are filed by individuals or research teams, and then assigned to the company or institution for which they work. This ensures that the intellectual property generated during employment is owned by the entity that invested in the research and development. While the specific names are not provided in this context, the innovation stems from dedicated research in materials science and optoelectronics.\n\nUnderstanding the inventors and assignee helps in tracing the lineage of technological development and potential commercialization paths for such groundbreaking innovations. These details are publicly available in the full patent filing. Keywords: patent inventors, patent assignee, intellectual property, R&D, light-emitting device patent, technology ownership.","question":"Who invented Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent offers a multitude of key benefits that are set to revolutionize light-emitting devices:\n\n1.  **Enhanced Durability and Reliability:** The embedded and recessed electrode design within a robust resin layer significantly reduces the risk of mechanical damage, such as cracking or delamination, leading to much longer device lifespans and fewer warranty claims.\n2.  **Superior Electrical Performance:** By protecting electrodes from external factors and optimizing their placement, the substrate ensures better signal integrity, reduced parasitic capacitance, and more efficient current flow, resulting in brighter, more stable light emission and improved energy efficiency.\n3.  **Enables Miniaturization and Advanced Form Factors:** The integrated and robust structure allows for the creation of thinner, lighter, and potentially flexible or foldable devices without compromising on strength or electrical functionality. This opens doors for innovative product designs.\n4.  **Improved Manufacturing Efficiency:** The detailed manufacturing methods can lead to higher production yields and reduced scrap rates by mitigating common assembly defects and vulnerabilities. This translates to lower production costs.\n\nThese benefits collectively contribute to higher quality, more reliable, and more versatile light-emitting products across various industries. Keywords: device benefits, enhanced durability, electrical efficiency, miniaturization, flexible displays, manufacturing yield, product reliability.","question":"What are the key benefits of Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent distinguishes itself from prior art through several critical innovations in its substrate architecture and manufacturing methodology.\n\nMost prior art relies on simple stacking of electrode and insulating layers, which creates weak interfaces prone to delamination and exposed electrode edges. In contrast, this invention utilizes a central resin layer that *actively encapsulates* a thinner second electrode layer, forming a cohesive, monolithic structure that is far more resistant to mechanical stress and environmental degradation. This embedding technique offers superior protection compared to mere stacking.\n\nFurthermore, a key differentiator is the precise positioning of the thicker first and third electrode layers *inside* the peripheral edge of the resin. This 'recessed' design directly addresses a major vulnerability in prior art—the exposed edges of conductive pathways. By shielding these critical areas, the patent significantly reduces the risk of short circuits, moisture ingress, and physical damage that commonly plague traditional designs. The combination of embedded electrodes, differential layer thickness, and recessed outer electrodes provides a fundamentally more robust and electrically stable foundation than previously available technologies. Keywords: prior art comparison, embedded vs stacked, recessed electrodes, delamination prevention, electrical stability, substrate innovation, competitive advantage.","question":"How is Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate different from prior art?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent is poised to have a transformative impact across a wide range of industries that rely on advanced light-emitting devices.\n\nThe most direct impact will be seen in the **Consumer Electronics** sector, particularly for smartphones, tablets, laptops, and televisions, where enhanced display durability, thinner form factors, and improved energy efficiency are constant demands. This technology will enable more robust and reliable screens for everyday use.\n\nBeyond consumer goods, the **Automotive Industry** will benefit from more durable, integrated, and high-performance displays for infotainment systems and advanced lighting solutions that can withstand harsh operating environments. The **Wearable Technology** market can leverage this for truly flexible and long-lasting smartwatches and other body-worn devices. Furthermore, the **General Lighting** sector, including commercial and residential LED applications, will see improvements in the longevity and efficiency of lighting panels and fixtures. Any industry requiring robust, high-performance optoelectronic components stands to gain significantly from this innovation. Keywords: industry impact, consumer electronics, automotive displays, wearable technology, LED lighting, display manufacturing, optoelectronics.","question":"What industries will Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate impact?"},{"answer":"The patent for Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate (US-9852974) was filed on **June 30, 2016**. This date marks when the patent application was officially submitted to the patent office, initiating the examination process.\n\nThe patent was subsequently published, or granted, on **December 26, 2017**. The publication date signifies when the patent document became publicly available, detailing the invention's claims, specifications, and drawings.\n\nThese dates are crucial for understanding the patent's timeline, its position relative to other innovations in the field, and its effective term of protection. The relatively quick grant period reflects the novelty and clear inventiveness of the technology described. Keywords: patent filing date, patent publication date, US-9852974 timeline, patent grant, intellectual property timeline, light-emitting device patent history.","question":"When was Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate filed/granted?"},{"answer":"The commercial applications for the Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent are extensive, given its fundamental improvements to light-emitting device substrates. This technology can be integrated into a wide array of products across multiple industries.\n\nPrimary applications include **high-end displays** for smartphones, tablets, laptops, and televisions, where it can enable more durable, thinner, and higher-performing screens (e.g., OLED, MicroLED). It is particularly beneficial for emerging **flexible and foldable display technologies**, providing the necessary resilience to withstand repeated bending.\n\nBeyond consumer electronics, this innovation has strong commercial potential in **automotive applications**, for robust in-car displays and advanced exterior lighting. It can also be applied to **medical displays** and **specialized industrial lighting** where reliability and longevity are critical. Furthermore, the technology could enhance **general LED lighting solutions**, leading to more efficient and longer-lasting bulbs and panels. Its versatility makes it a valuable asset for any manufacturer seeking to produce superior light-emitting products. Keywords: commercial applications, display technology, flexible electronics, automotive lighting, LED products, consumer electronics, medical displays, industrial applications.","question":"What are the commercial applications of Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate?"},{"answer":"The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent lays a robust foundation for numerous future developments in light-emitting device technology. We can anticipate several exciting advancements building upon this innovation.\n\nOne key area is the **further development of truly flexible and even stretchable displays**. The inherent durability and delamination resistance of this substrate design will enable screens that can be rolled, folded, or bent into unprecedented forms, opening new possibilities for wearable technology, smart surfaces, and interactive environments. Expect to see more resilient foldable phones and entirely new categories of adaptive devices.\n\nAnother significant development will be in **enhanced integration and functionality**. The ability to precisely embed and protect electrode layers within the resin could evolve to include embedding other passive components, micro-sensors, or even active elements directly into the substrate. This would lead to more compact, integrated, and intelligent devices, reducing overall complexity and size. Furthermore, advancements in **material science for the resin** itself could lead to tunable optical properties or improved thermal conductivity, further optimizing device performance. The Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate will likely become a cornerstone for future generations of high-performance, ultra-reliable, and highly integrated optoelectronic systems. Keywords: future technology, flexible displays, stretchable electronics, integrated components, smart surfaces, material science, optoelectronic advancements, next-gen devices.","question":"What are the future developments expected for Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate?"}],"topics":["light-emitting device substrate","LED manufacturing","display technology patent","embedded electrodes","resin layer substrate","evolution","light","emitting"],"tech_cluster":null},"seo":{"title":"Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate - Patent US-9852974","description":"Discover the groundbreaking Substrate, Light-emitting Device with Substrate, Method of Manufacturing Substrate Assembly and Method of Manufacturing Light-emitting Device with Substrate patent. Enhanced durability and efficiency for light-emitting devices.","keywords":["light-emitting device substrate","LED manufacturing","display technology patent","embedded electrodes","resin layer substrate","electronic device durability","optoelectronic innovation","patent US-9852974","substrate assembly method","light-emitting device method","advanced display component"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852974","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852974","citation_suggestion":"Patentable. \"Substrate, light-emitting device with substrate, method of manufacturing substrate assembly and method of manufacturing light-emitting device with substrate\" (US-9852974). https://patentable.app/patents/US-9852974","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852974","json":"https://patentable.app/api/llm-context/US-9852974","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T03:48:18.312Z"}