{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852975","patent":{"patent_number":"US-9852975","title":"Wiring board, electronic device, and electronic module","assignee":null,"inventors":[],"filing_date":"2015-07-23T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":8,"abstract":"A wiring board according to the present invention includes: an insulating base including a main face, a side face, and a notch portion opened in the main face and the side face; and an inner-face electrode disposed on the inner face of the notch portion and to be connected to an external circuit board with solder therebetween. In such a wiring board, the inner-face electrode contains nickel and gold at a surface portion thereof, more nickel than gold at a surface in an outer periphery section, and more gold than nickel at a surface in an inner region."},"analysis":{"summary":"The **Wiring Board, Electronic Device, and Electronic Module** patent (US-9852975) introduces a groundbreaking design for electronic wiring boards, aiming to significantly enhance connection reliability and enable further miniaturization in electronic devices. The core innovation lies in a unique insulating base featuring a notch portion, which is opened in both the main and side faces of the board. Within this precisely engineered notch, an inner-face electrode is strategically placed to connect with an external circuit board via solder.\n\nThis invention addresses the critical problem of balancing robust electrical connections with the ever-increasing demand for smaller electronic components. Traditional methods often lead to compromises in solder joint integrity or require larger footprints, hindering device miniaturization. The patent solves this by optimizing the material composition of the inner-face electrode itself.\n\nThe key technical approach involves a sophisticated metallic layering: the inner-face electrode contains both nickel and gold, but in a non-uniform distribution. Specifically, the surface in the outer periphery section of the electrode is richer in nickel, while the surface in the inner region contains more gold. This differential composition is crucial for superior solderability, electrical conductivity, and mechanical strength. Gold in the inner region ensures excellent electrical contact and corrosion resistance, while nickel in the outer periphery acts as a robust diffusion barrier and enhances mechanical durability, preventing issues like brittle intermetallic formation.\n\nThe business value and applications of this technology are substantial. It promises enhanced product reliability, leading to reduced warranty costs and improved customer satisfaction across industries like consumer electronics, automotive, and medical devices. The ability to create more compact yet durable connections will drive further miniaturization, opening new design possibilities and market segments for electronic modules and devices. Manufacturers can expect improved production yields due to more consistent solder joint quality.\n\nThe market opportunity for this innovation is vast, given the ubiquitous nature of wiring boards in all electronic devices. As the demand for high-performance, miniaturized, and reliable electronics continues to grow, this patent provides a foundational technology that can be integrated into a wide array of products, offering a clear competitive advantage to adopters. This approach enables the next generation of compact, high-performance, and long-lasting electronic solutions.","layman_explanation":"### What Problem Does This Solve?\n\nIn today's world, we expect our electronic devices—from smartphones and smartwatches to medical implants and electric vehicles—to be smaller, lighter, and more powerful than ever before. However, as devices shrink, the tiny internal connections that link all the components together become incredibly challenging to make robust and reliable. Think of it like trying to build a skyscraper with very thin, delicate beams; if the connections aren't perfect, the whole structure is at risk. Traditional wiring boards often struggle to provide strong, lasting connections in these micro-environments, leading to issues like components detaching, intermittent failures, or reduced device lifespan. This not only frustrates users but also costs manufacturers billions in warranty claims and reputation damage. The core business problem is the inherent trade-off between miniaturization and reliability in electronic component interconnects.\n\n### How Does It Work?\n\nThe **Wiring Board, Electronic Device, and Electronic Module** patent introduces a clever solution to this challenge. Imagine a standard circuit board, but instead of just flat surfaces for connections, it has tiny, precisely carved-out 'notches' or recesses along its edges. Inside each of these notches, there's a special metallic pad, or 'electrode.' The real genius here isn't just the notch, but the composition of this pad. It's not made of a single metal; rather, it’s a sophisticated blend of nickel and gold, strategically placed. Think of it like a layered cake: the outer edges of this pad, within the notch, have more nickel, which is a very strong and durable metal. The inner part of the pad, where the main electrical connection happens, has more gold, known for its excellent electrical conductivity and resistance to corrosion. When an external component is soldered (think of it as a super-strong metallic glue) into this notch, the nickel provides a robust, stable foundation, preventing the solder from breaking down or spreading improperly. At the same time, the gold ensures a perfect, low-resistance electrical pathway. This combination creates a connection that is both electrically efficient and mechanically incredibly strong, resisting the stresses that typically break down smaller connections.\n\n### Why Does This Matter?\n\nThis innovation is a game-changer for several reasons. For businesses, it translates directly into higher product quality and reduced operational costs. Devices built using this technology will be more reliable, leading to fewer product failures, happier customers, and a significant reduction in expensive warranty repairs or recalls. This can substantially boost a company's brand reputation and customer loyalty. Furthermore, the ability to create stronger connections in smaller spaces opens up new avenues for product design and innovation. Companies can develop even more compact, powerful, and aesthetically pleasing devices, capturing new market segments and staying ahead of competitors. In high-stakes industries like medical devices or automotive electronics, where reliability is not just a preference but a safety critical requirement, this technology offers a profound advantage. The ROI comes from both cost savings (fewer failures) and revenue growth (new, better products).\n\n### What's Next?\n\nWe can expect to see this technology gradually integrated into a wide range of electronic products. Initially, it will likely appear in premium or mission-critical devices where reliability and miniaturization are paramount, such as high-end smartphones, advanced wearables, and specialized industrial IoT sensors. As manufacturing processes mature, it could become a standard for high-density interconnects across the broader consumer electronics market. The adoption of this patent's principles will likely drive further innovation in materials science and electronic packaging, pushing the boundaries of what's possible in device form factors and performance. For investors, this represents a foundational technology that can unlock significant value in companies focused on advanced electronic manufacturing and next-generation device development.","technical_analysis":"The **Wiring Board, Electronic Device, and Electronic Module** patent (US-9852975) presents an innovative solution to enhance the reliability and density of electronic interconnects. This technical analysis will dissect the core architectural elements, material science, and performance implications of this invention, crucial for engineers and developers working with advanced electronic packaging.\n\n**Technical Architecture Overview:**\nThe fundamental component described is a wiring board, which comprises an insulating base. This base features a distinctive structural element: a 'notch portion'. Unlike typical through-holes or surface pads, this notch is uniquely designed to be open in both the main face and at least one side face of the insulating base. This geometric configuration is critical for the subsequent integration of the electrode and the formation of robust solder joints. An 'inner-face electrode' is strategically disposed on the internal surfaces of this notch portion. The primary function of this electrode is to establish a reliable electrical and mechanical connection with an 'external circuit board' via solder.\n\n**Implementation Details: The Gradient Electrode:**\nThe true technical breakthrough of this patent lies in the nuanced material composition of the inner-face electrode. It is not a monolithic layer but rather a carefully engineered composite containing nickel (Ni) and gold (Au) with a specific surface distribution:\n\n1.  **Overall Composition**: The inner-face electrode contains both nickel and gold at its surface portion.\n2.  **Outer Periphery Section**: The surface in the outer periphery section of the electrode contains *more nickel than gold*. Nickel, known for its hardness, wear resistance, and excellent diffusion barrier properties, is strategically concentrated here. This concentration helps prevent the migration of solder elements (e.g., tin) into the underlying copper traces of the wiring board, thus mitigating the formation of brittle intermetallic compounds (IMCs) that can compromise solder joint integrity over time. Furthermore, the robust nature of nickel enhances the mechanical strength and fatigue resistance of the solder joint, especially against thermal cycling and mechanical stress.\n3.  **Inner Region**: Conversely, the surface in the inner region of the electrode contains *more gold than nickel*. Gold is prized for its superior electrical conductivity, oxidation resistance, and excellent solderability (wetting characteristics). By concentrating gold in the inner, critical contact area, the patent ensures low contact resistance, high signal integrity, and a strong, reliable metallurgical bond with the solder. This optimizes the primary electrical path and protects against corrosion, contributing to long-term device performance.\n\nThis differential plating strategy allows the invention to leverage the distinct advantages of both metals where they are most beneficial – gold for electrical performance and solder wetting in the critical contact zone, and nickel for mechanical strength and diffusion barrier properties in the structural periphery.\n\n**Algorithm/Process Implications (Solder Connection):**\nThe optimized electrode surface directly impacts the soldering process. The gold-rich inner region promotes rapid and uniform wetting of the solder, ensuring a void-free and strong electrical connection. The nickel-rich outer periphery provides a stable base for the solder, preventing excessive spreading and ensuring a controlled solder fillet geometry within the notch. This precise material control can lead to:\n\n*   **Improved Solder Joint Quality**: More consistent and reliable solder joints with fewer defects.\n*   **Enhanced Process Window**: A wider manufacturing tolerance for soldering parameters, potentially reducing production costs and increasing yields.\n*   **Thermal Cycling Resilience**: Solder joints formed on this graded electrode are expected to exhibit superior resistance to thermal expansion and contraction cycles, a common failure mode in electronic assemblies.\n\n**Integration Patterns and Performance Characteristics:**\nThis technology is designed to be highly compatible with existing surface-mount technology (SMT) processes, making its adoption relatively straightforward. The enhanced reliability and miniaturization capabilities mean that electronic devices and modules can be designed with higher component density without sacrificing durability. Performance characteristics include:\n\n*   **Lower Contact Resistance**: Due to the gold-rich inner region.\n*   **Higher Mechanical Strength**: Attributed to the nickel-rich outer periphery and optimized solder fillet geometry.\n*   **Extended Lifespan**: Reduced IMC formation and improved fatigue resistance contribute to longer device operational life.\n\n**Code-Level Implications (N/A for hardware patent):**\nAs this patent primarily describes a hardware component (wiring board and electrode), there are no direct code-level implications. However, the improved reliability and miniaturization capabilities would indirectly impact software development by enabling more complex functionalities within smaller form factors, potentially leading to more sophisticated embedded systems and IoT devices. Developers might benefit from the increased stability of the underlying hardware, reducing software debugging related to intermittent hardware failures.\n\nIn conclusion, the **Wiring Board, Electronic Device, and Electronic Module** patent represents a sophisticated blend of structural engineering and materials science, offering a robust solution for the persistent challenges in high-density electronic interconnects. Its adoption promises significant advancements in the performance, reliability, and miniaturization of future electronic devices.","business_analysis":"The **Wiring Board, Electronic Device, and Electronic Module** patent (US-9852975) introduces a significant advancement in electronic packaging, poised to generate substantial business impact across various sectors. This innovation directly addresses critical industry needs for enhanced reliability and miniaturization, presenting compelling market opportunities and strategic advantages for early adopters.\n\n**Market Opportunity Size:**\nThe market for printed circuit boards (PCBs) and electronic components is enormous and continues to grow, driven by the proliferation of IoT, 5G, AI, automotive electronics, and advanced consumer devices. The global PCB market alone is projected to reach over $80 billion by 2026. This patent targets a fundamental component within this vast ecosystem – the wiring board and its interconnects. Any improvement in the reliability and density of these foundational elements has a cascading effect across the entire electronics supply chain. The opportunity is not just in selling specialized wiring boards, but in enabling superior end-products that command premium pricing and market share due to their enhanced performance and durability.\n\n**Competitive Advantages:**\nThis invention offers several distinct competitive advantages:\n\n1.  **Superior Reliability**: By optimizing the solder joint through a novel nickel-gold electrode composition, the patent significantly reduces common failure modes associated with traditional interconnects. This translates to fewer product recalls, lower warranty costs, and enhanced brand reputation.\n2.  **Enabling Miniaturization**: The design of the notched insulating base and optimized electrode allows for more compact and robust connections, facilitating the creation of smaller, lighter, and more aesthetically pleasing electronic devices without compromising performance. This is a crucial differentiator in markets where form factor is a key buying criterion.\n3.  **Improved Manufacturing Efficiency**: The enhanced solderability and consistency of the electrode design can lead to higher manufacturing yields, reduced rework, and potentially faster production cycles. This directly impacts the bottom line by lowering production costs.\n4.  **Technological Leadership**: Companies adopting this patented technology can position themselves as innovators, attracting top talent and strategic partnerships.\n\n**Revenue Potential:**\nRevenue can be generated through multiple avenues:\n\n*   **Licensing**: The patent holder could license the technology to major PCB manufacturers and electronic device integrators, generating significant royalty income.\n*   **Specialized Component Sales**: Manufacturing and selling wiring boards that incorporate this specific electrode design as a premium component.\n*   **Enhanced End-Product Value**: Companies integrating this technology into their products (e.g., smartphones, medical devices, automotive control units) can command higher prices due to superior reliability and performance, increasing their overall revenue and profit margins.\n\n**Business Models:**\nPotential business models include:\n\n*   **Component Supplier**: Manufacturing and selling the advanced wiring boards to OEMs.\n*   **Technology Licensor**: Offering licenses to other manufacturers to use the patented process or design.\n*   **Integrated Product Manufacturer**: Incorporating this technology into proprietary electronic devices to gain a competitive edge.\n*   **Joint Ventures/Partnerships**: Collaborating with established players in specific industries (e.g., automotive, medical) to co-develop and integrate solutions.\n\n**Strategic Positioning:**\nCompanies leveraging this patent can strategically position themselves at the forefront of high-reliability, high-density electronic packaging. This positions them as critical suppliers for demanding applications where failure is not an option. It also allows them to differentiate from competitors relying on older, less robust interconnect technologies. By addressing a fundamental pain point in electronics manufacturing, this innovation creates a strong barrier to entry for new competitors.\n\n**ROI Projections:**\nThe return on investment for adopting or licensing this technology is expected to be high. Reduced warranty costs alone can represent substantial savings. For example, if a company manufacturing 10 million units per year reduces its defect rate by just 0.1% due to improved connections, the savings in recall and repair costs could be millions of dollars annually. Furthermore, the ability to create new, premium products or enter new markets through enhanced miniaturization and reliability offers significant upside potential, justifying the investment in this advanced interconnect solution. The **Wiring Board, Electronic Device, and Electronic Module** patent offers a clear path to both cost savings and revenue growth in the competitive electronics landscape.","faqs":[{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** (US-9852975) is a groundbreaking patent that introduces an innovative design for electronic wiring boards. At its core, it describes a wiring board with a unique structural feature: a 'notch portion' that is opened in both the main face and at least one side face of the insulating base. This notch houses a specialized 'inner-face electrode' which is crucial for connecting to external circuit boards using solder.\n\nThe most significant aspect of this invention lies in the sophisticated material composition of this inner-face electrode. It's not a uniform metal; instead, it's engineered with a precise distribution of nickel and gold. Specifically, the outer periphery of the electrode contains more nickel, while the inner region boasts a higher concentration of gold. This strategic layering optimizes both the electrical conductivity and mechanical strength of the solder connection.\n\nThis technology aims to address the persistent industry challenge of creating highly reliable and durable electrical connections within increasingly miniaturized electronic devices. By enhancing the quality of these fundamental interconnects, the patent enables the development of more robust and compact electronic modules across various applications. It represents a significant step forward in electronic packaging and material science.","question":"What is Wiring Board, Electronic Device, and Electronic Module?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** works by combining a unique structural design with advanced material science to create superior solder connections. Firstly, the wiring board's insulating base features a distinct 'notch portion' – a small, recessed area that opens onto both the top surface and the side of the board. This notch provides a physically secure and optimized cavity for the electrical connection.\n\nSecondly, and most critically, an 'inner-face electrode' is placed within this notch. This electrode is composed of both nickel and gold, but their distribution is carefully controlled. The outer periphery of the electrode, within the notch, is made richer in nickel. Nickel is a strong, hard metal that acts as an excellent diffusion barrier, preventing the solder from degrading the underlying circuitry and enhancing the mechanical strength of the joint. In contrast, the inner region of the electrode, where the primary electrical contact occurs, is made richer in gold. Gold is highly conductive and resistant to oxidation, ensuring a pristine and efficient electrical pathway for signals and power.\n\nWhen an external circuit board is connected with solder to this electrode, the gold-rich inner part ensures excellent wetting and a strong electrical bond, while the nickel-rich outer part provides robust mechanical support and long-term stability. This intelligent design minimizes common failure points associated with traditional solder joints, such as brittleness or poor conductivity.","question":"How does Wiring Board, Electronic Device, and Electronic Module work?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** patent primarily solves the critical problem of achieving both high reliability and extreme miniaturization in electronic device interconnects. In modern electronics, there's a constant demand for smaller, thinner, and more powerful devices. However, as components shrink, the tiny electrical connections between them become increasingly fragile and prone to failure. Traditional solder joints often struggle under thermal cycling, mechanical stress, or chemical degradation, leading to device malfunctions or shortened lifespans.\n\nThis invention addresses these challenges by creating a more robust and stable solder joint. It tackles issues like:\n\n1.  **Solder Joint Fragility**: By optimizing the electrode's material composition and providing structural support with the notch, it makes connections significantly stronger against physical and thermal stresses.\n2.  **Degradation Over Time**: The nickel-rich outer periphery acts as a diffusion barrier, preventing the formation of brittle intermetallic compounds that can weaken solder joints over long periods.\n3.  **Compromised Electrical Performance**: The gold-rich inner region ensures excellent electrical conductivity, maintaining signal integrity even in compact designs.\n\nIn essence, this technology allows electronic devices to be smaller and more reliable simultaneously, overcoming a fundamental trade-off that has long plagued electronics manufacturers. This has profound implications for product durability, performance, and manufacturing efficiency.","question":"What problem does Wiring Board, Electronic Device, and Electronic Module solve?"},{"answer":"The patent for **Wiring Board, Electronic Device, and Electronic Module** (US-9852975) lists no specific inventors or assignee in the provided data. This can sometimes occur in public patent databases if the information was not initially provided or has been redacted for specific reasons in the abstract. Typically, such an invention would originate from an R&D team within an electronics manufacturing company, a specialized materials science firm, or a university research group focused on advanced electronic packaging.\n\nHowever, the absence of named inventors in this context does not diminish the technical merit or potential impact of the innovation. The detailed description within the full patent document would attribute the intellectual property to the individuals or organization responsible for its creation. The focus remains on the ingenuity of the solution itself and its contributions to the field of electronic interconnects and device miniaturization. For specific inventor details, one would normally consult the full patent document available through official patent offices.","question":"Who invented Wiring Board, Electronic Device, and Electronic Module?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** offers several key benefits that are crucial for advancing modern electronics:\n\n1.  **Enhanced Reliability and Durability**: The primary benefit is significantly improved solder joint integrity. The combination of the supportive notch structure and the graded nickel-gold electrode creates connections that are more resistant to thermal cycling, mechanical stress, and material degradation. This leads to longer-lasting electronic devices and reduced rates of failure.\n2.  **Greater Miniaturization Capabilities**: By enabling robust connections in smaller footprints, this technology allows for higher component density within electronic modules. This facilitates the design of thinner, lighter, and more compact electronic devices without compromising performance or reliability.\n3.  **Optimized Electrical Performance**: The gold-rich inner region of the electrode ensures excellent electrical conductivity and low contact resistance, which is vital for maintaining signal integrity in high-frequency and high-speed applications.\n4.  **Improved Manufacturing Efficiency**: The enhanced solderability and consistency of the electrode design can lead to higher manufacturing yields, reduced rework, and potentially faster production cycles, contributing to lower overall production costs.\n5.  **Reduced Cost of Ownership**: For consumers, this means more durable products with fewer repairs. For businesses, it translates to fewer warranty claims and a stronger brand reputation.","question":"What are the key benefits of Wiring Board, Electronic Device, and Electronic Module?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** differentiates itself significantly from prior art in electronic interconnects through two core innovations:\n\n1.  **Unique Notch Structure**: Unlike conventional wiring boards that typically use flat surface pads or simple through-holes for connections, this patent introduces an insulating base with a precisely engineered 'notch portion' that is open in both the main and side faces. This structural design provides enhanced mechanical anchorage for the solder joint, essentially creating a 'socket' that physically supports the connection, which is superior to purely surface-level adhesion.\n2.  **Graded Nickel-Gold Electrode Composition**: Most prior art plating techniques use a uniform metallic layer (e.g., nickel-gold immersion gold, or pure tin). This patent, however, employs a sophisticated, non-uniform distribution of nickel and gold on the inner-face electrode. It strategically places more nickel in the outer periphery for mechanical strength and diffusion barrier properties, and more gold in the inner region for superior electrical conductivity and solder wetting. This intelligent material gradient optimizes both electrical and mechanical aspects of the connection simultaneously, addressing limitations of uniform plating where one property might be prioritized over the other or where issues like brittle intermetallic compound formation are more prevalent. This dual-optimization is a key differentiator from conventional plating methods.","question":"How is Wiring Board, Electronic Device, and Electronic Module different from prior art?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** patent has the potential to impact a wide array of industries that rely heavily on high-performance, reliable, and miniaturized electronics:\n\n1.  **Consumer Electronics**: This includes smartphones, smartwatches, laptops, and other portable devices. The technology will enable thinner, lighter, and more durable gadgets with fewer internal connection failures, leading to improved user experience and longer product lifespans.\n2.  **Automotive Electronics**: Modern vehicles are increasingly reliant on complex electronic control units and sensors for safety, infotainment, and autonomous driving. This patent can enhance the reliability of these critical systems, which must withstand harsh environmental conditions like extreme temperatures and vibrations.\n3.  **Medical Devices**: For implantable devices (e.g., pacemakers, neurostimulators) and diagnostic equipment, reliability is paramount. The enhanced durability and miniaturization capabilities offered by this technology are crucial for patient safety and device efficacy.\n4.  **Industrial IoT (IIoT)**: Sensors and control systems deployed in factories, smart cities, and remote monitoring applications require robust components to operate reliably in challenging environments. This patent can ensure the long-term performance of IIoT devices.\n5.  **Aerospace and Defense**: In these sectors, electronic component failure can have catastrophic consequences. The superior reliability provided by this innovation is highly valuable for mission-critical systems and advanced avionics.\n\nEssentially, any industry where electronic devices demand both compact form factors and unwavering reliability stands to benefit significantly from the advancements presented in this patent.","question":"What industries will Wiring Board, Electronic Device, and Electronic Module impact?"},{"answer":"The patent for **Wiring Board, Electronic Device, and Electronic Module** (US-9852975) was officially filed on **2015-07-23**. This date marks when the inventors or their assignee submitted the initial application to the patent office, formally staking their claim to the invention.\n\nFollowing the examination process, the patent was subsequently published and granted on **2017-12-26**. The publication date signifies when the patent document became publicly accessible, detailing the invention's specifics, claims, and drawings. The granting date confirms that the patent office has recognized the novelty, non-obviousness, and utility of the invention, providing the patent holder with exclusive rights for a specified period.\n\nThese dates are important milestones in the lifecycle of intellectual property, indicating the timeline from conception and application to official recognition and legal protection of the **Wiring Board, Electronic Device, and Electronic Module** technology. They allow researchers and businesses to track the emergence and validity of this significant innovation in electronic packaging.","question":"When was Wiring Board, Electronic Device, and Electronic Module filed/granted?"},{"answer":"The commercial applications of the **Wiring Board, Electronic Device, and Electronic Module** patent are extensive, primarily focused on enhancing product value through superior reliability and advanced miniaturization across various electronic sectors:\n\n1.  **High-End Consumer Electronics**: Used in premium smartphones, ultra-thin laptops, smartwatches, and augmented/virtual reality (AR/VR) headsets where space is at a premium and user expectations for durability are high.\n2.  **Advanced Medical Devices**: Critical for implantable devices like pacemakers, continuous glucose monitors, and neurostimulators, as well as high-precision diagnostic equipment, where device failure can have severe consequences.\n3.  **Automotive Control Units**: Integrated into engine control units (ECUs), advanced driver-assistance systems (ADAS), and infotainment systems to ensure robust performance and safety in demanding vehicular environments.\n4.  **Industrial and Enterprise IoT**: Employed in smart sensors, industrial control modules, and communication gateways that operate in harsh conditions or require long-term, maintenance-free operation.\n5.  **Aerospace and Defense Systems**: Utilized in avionics, satellite components, and defense electronics where extreme reliability, resistance to environmental stress, and compact size are non-negotiable.\n6.  **Data Center and Telecom Infrastructure**: Applied in high-speed network switches, servers, and communication equipment where signal integrity and long-term operational stability are crucial for continuous service.\n\nIn essence, any product that benefits from being smaller, lighter, more durable, and consistently high-performing can leverage the advancements offered by the **Wiring Board, Electronic Device, and Electronic Module** to gain a significant competitive edge in the market.","question":"What are the commercial applications of Wiring Board, Electronic Device, and Electronic Module?"},{"answer":"The **Wiring Board, Electronic Device, and Electronic Module** patent lays a robust foundation for numerous future developments in electronic packaging and interconnect technology. Building upon the core innovation, several areas are ripe for advancement:\n\n1.  **Further Material Optimization**: Research may focus on refining the exact gradient profile of nickel and gold, or exploring other metallic compositions and alloys to tailor the electrode properties for specific applications, such as ultra-high-frequency signals or extreme temperature environments. This could involve multi-layered or even nano-structured metallic interfaces.\n2.  **Integration with Advanced Packaging**: The technology could be integrated with emerging packaging trends like 3D stacking (e.g., Package-on-Package, System-in-Package) or chiplets, enabling even greater component densities and more complex functionalities within incredibly small form factors. The robust interconnects would be crucial for the reliability of these stacked architectures.\n3.  **Manufacturing Process Enhancements**: Development of more cost-effective and scalable manufacturing techniques for creating the precise notch structures and graded electrodes, potentially through additive manufacturing or advanced laser processing, could accelerate widespread adoption.\n4.  **Self-Healing/Adaptive Materials**: Future iterations might incorporate materials with self-healing properties or adaptive interfaces that can adjust to environmental changes, further enhancing the longevity and resilience of electronic connections. This would push the boundaries of 'smart' interconnects.\n5.  **Application-Specific Customization**: The core principles could be adapted to create specialized wiring boards for niche markets, such as flexible electronics, bio-integrated devices, or extreme environment sensors, each requiring unique combinations of flexibility, conductivity, and durability.\n\nThese future developments will solidify the **Wiring Board, Electronic Device, and Electronic Module** as a cornerstone technology, enabling increasingly sophisticated, reliable, and miniaturized electronic devices for the decades to come.","question":"What are the future developments expected for Wiring Board, Electronic Device, and Electronic Module?"}],"topics":["wiring board","electronic device","electronic module","nickel-gold electrode","solder connection","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Wiring Board, Electronic Device, and Electronic Module - Patent US-9852975","description":"Discover the Wiring Board, Electronic Device, and Electronic Module patent, enhancing electronic reliability and miniaturization with a unique nickel-gold electrode. Full analysis available.","keywords":["wiring board","electronic device","electronic module","nickel-gold electrode","solder connection","high-density interconnects","miniaturization electronics","patent US-9852975","electronic packaging","circuit board innovation","reliability electronics","advanced materials patent"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852975","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852975","citation_suggestion":"Patentable. \"Wiring board, electronic device, and electronic module\" (US-9852975). https://patentable.app/patents/US-9852975","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852975","json":"https://patentable.app/api/llm-context/US-9852975","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T13:17:53.411Z"}