{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852976","patent":{"patent_number":"US-9852976","title":"Semiconductor package and fabricating method thereof","assignee":null,"inventors":[],"filing_date":"2017-01-06T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure."},"analysis":{"summary":"The patent titled \"Semiconductor Package and Fabricating Method Thereof\" (US-9852976) introduces a groundbreaking approach to designing and manufacturing semiconductor devices, specifically focusing on advanced packaging solutions. The core innovation lies in its ability to create exceptionally thin, fine-pitch redistribution structures within semiconductor packages. These structures are critical for increasing the density of interconnections—the tiny pathways that carry electrical signals within a microchip—without expanding the overall physical size of the package.\n\nThe primary problem this invention solves is the limitation of conventional semiconductor packaging methods in accommodating the ever-growing demand for miniaturization and enhanced performance. As chips become more complex and require more input/output (I/O) connections, traditional redistribution layers become too thick or imprecise, hindering further device shrinkage and often leading to signal integrity issues. This patent provides a robust solution to overcome these physical and manufacturing constraints.\n\nTechnically, the approach detailed in this patent involves novel designs for semiconductor package structures that integrate these thin, high-density redistribution layers. The fabricating method described ensures precise control over the deposition and patterning of conductive traces and dielectric layers, allowing for ultra-fine line widths and spaces. This meticulous control results in superior electrical performance, reduced parasitic effects, and improved mechanical reliability, even in incredibly compact forms.\n\nThe business value and applications are profound. This technology enables the production of thinner, lighter, and more powerful electronic devices across various sectors, including mobile computing, wearable technology, artificial intelligence accelerators, and high-performance computing. It offers a significant competitive advantage to manufacturers by facilitating higher integration density, potentially reducing manufacturing costs through improved yields, and accelerating the development of next-generation products.\n\nThe market opportunity for this innovation is substantial, as it addresses a fundamental need in an industry constantly pushing the boundaries of miniaturization and performance. By providing a reliable method for advanced packaging, this patent positions itself as an enabler for future technological advancements, ensuring that electronic devices can continue to evolve in form factor and capability.","layman_explanation":"### What Problem Does This Solve?\n\nImagine you're trying to build a super-fast, super-small computer, like the brain of a new smartphone or a tiny sensor for a smart home. Inside this computer's 'brain' (which is called a microchip or semiconductor device), there are millions of tiny electrical roads, or wires, that carry information. As we want these devices to get smaller and more powerful, we need to pack even more of these roads into a tiny space, making them incredibly thin and close together – what engineers call 'fine-pitch'.\n\nThe big problem is that with older ways of building these chips, making these roads so thin and close together becomes incredibly difficult. It's like trying to draw a million perfect, hair-thin lines without any of them touching or breaking. This leads to bigger, thicker chips than we want, or chips that don't work reliably, costing manufacturers a lot of money and slowing down innovation. Existing solutions often hit physical limits, making it hard to create devices that are both high-performing and sleek.\n\n### How Does It Work?\n\nThe patent \"Semiconductor Package and Fabricating Method Thereof\" offers a brilliant new recipe for building these tiny chips. Instead of just trying to make existing roads thinner, this innovation redesigns the entire 'package' or casing that holds the chip, and the way those internal roads are constructed. Think of it like this:\n\nInstead of a single, slightly thick layer of roads, this new approach uses multiple, super-thin layers, stacked perfectly on top of each other. Each layer has incredibly precise, hair-thin conductive paths (the 'fine-pitch redistribution structures'). The method describes how to deposit special materials and carve out these tiny roads with extreme accuracy, layer by layer, almost like 3D printing, but on a microscopic scale. This meticulous process ensures that even though the roads are incredibly close, they don't interfere with each other, and the entire stack remains very thin.\n\nIt's like having a multi-story highway system inside your chip. Each story is ultra-flat and perfectly engineered, allowing for a massive amount of traffic (electrical signals) to flow efficiently without congestion, all within a compact skyscraper. This conceptual shift allows for greater connectivity and functionality to be integrated into a much smaller volume than previously possible, without sacrificing performance.\n\n### Why Does This Matter?\n\nThis technology matters because it directly enables the next generation of electronic devices that consumers and businesses demand. For consumers, it means: thinner, lighter smartphones and laptops; more comfortable and feature-rich wearables; and faster, more responsive smart home devices. For businesses, it translates into:\n\n*   **Competitive Advantage:** Companies leveraging this patent can create products that are superior in size, performance, and power efficiency, outperforming competitors.\n*   **New Product Categories:** The ability to miniaturize components opens doors for entirely new types of devices and applications, particularly in areas like advanced medical implants, sophisticated IoT sensors, and truly autonomous drones.\n*   **Market Leadership:** Being able to produce such advanced components reliably and potentially more cost-effectively positions manufacturers as leaders in the high-growth segments of the semiconductor market.\n*   **Enhanced ROI:** Improved manufacturing yields and the ability to command premium prices for advanced components contribute to better profit margins and a stronger return on investment for R&D.\n\n### What's Next?\n\nThe \"Semiconductor Package and Fabricating Method Thereof\" is a foundational technology. Looking ahead, we can expect to see its principles integrated into a wide array of high-performance and ultra-compact devices. It will be crucial for the advancement of Artificial Intelligence (AI) hardware, enabling more powerful AI processing in smaller form factors. It will also drive innovation in the Internet of Things (IoT), allowing for tiny, energy-efficient sensors and communication modules. As industries continue to demand more integrated and miniaturized electronics, the adoption of this approach will become increasingly widespread, shaping product roadmaps for the next decade and beyond. This patent isn't just an incremental step; it's a strategic leap forward.","technical_analysis":"The patent \"Semiconductor Package and Fabricating Method Thereof\" (US-9852976) details a sophisticated solution for advanced semiconductor packaging, specifically addressing the critical need for thin, fine-pitch redistribution structures. This technical analysis delves into the architectural and methodological innovations presented by this patent.\n\n**Technical Architecture of the Semiconductor Package**\nAt its core, this patent describes a semiconductor package structure designed to integrate a semiconductor die with high-density, fine-pitch redistribution layers (RDLs). The architecture typically comprises:\n\n1.  **Semiconductor Die:** The central component, usually a silicon chip, with an array of I/O pads.\n2.  **Encapsulant/Molding Compound:** A protective layer surrounding the die, often a polymer, providing mechanical support and environmental protection.\n3.  **Redistribution Layers (RDLs):** These are the key innovation. The patent describes multiple conductive layers (e.g., copper, aluminum) separated by dielectric layers (e.g., polyimide, BCB). These RDLs fan out the fine-pitch I/O pads of the die to a larger pitch, enabling connection to the package substrate or external connections. The critical aspect here is the 'thin fine-pitch' nature, implying line widths and spaces often in the single-digit micrometer range.\n4.  **Vias:** Vertical interconnects (e.g., copper-filled) passing through the dielectric layers to connect different RDLs or the RDLs to the die pads and external bumps/balls.\n5.  **Underfill Material:** A resin applied between the die and the substrate (if applicable) to enhance mechanical coupling and reliability.\n\nThe structural innovation allows for a high density of interconnections within a minimal vertical stack height, directly contributing to overall package thinness and improved electrical performance by reducing parasitic effects associated with longer or less precise routing.\n\n**Implementation Details and Fabrication Method**\nThe fabricating method thereof is crucial to achieving the described architecture. It outlines a series of precise processing steps, often performed at the wafer level (Wafer-Level Packaging – WLP) or fan-out wafer-level packaging (FOWLP) to maximize efficiency and precision:\n\n1.  **Wafer Preparation:** This involves cleaning and potentially applying a passivation layer to the semiconductor wafer (which may contain multiple dies).\n2.  **Dielectric Layer Deposition:** A thin layer of dielectric material (e.g., photosensitive polyimide, PBO, or epoxy) is uniformly deposited over the die(s) and any underlying structures. This layer provides electrical insulation and mechanical support.\n3.  **Via Formation:** Through photolithography and etching, openings (vias) are created in the dielectric layer to expose the underlying contact pads of the die or lower RDLs. The precision of this step is paramount for fine-pitch capabilities.\n4.  **Conductive Layer Seed Deposition:** A thin seed layer (e.g., Ti/Cu) is deposited, typically by sputtering, to facilitate subsequent electroplating.\n5.  **Patterning of Conductive Traces (RDLs):** A photoresist layer is applied and patterned to define the fine-pitch conductive lines and pads. This involves advanced lithography techniques, potentially employing stepper or scanner systems capable of sub-10 µm resolution.\n6.  **Electroplating:** Copper or other conductive metal is electroplated onto the exposed seed layer within the photoresist pattern, forming the RDL traces and filling the vias.\n7.  **Photoresist Stripping & Seed Layer Etching:** The photoresist is removed, and the exposed seed layer is selectively etched away, leaving only the electroplated conductive traces.\n8.  **Repeat:** Steps 2-7 are repeated for each subsequent RDL layer, building up the multi-layer redistribution structure. Planarization techniques (e.g., chemical mechanical planarization - CMP) may be incorporated between layers to maintain a flat surface for subsequent processing.\n9.  **Final Passivation/Solder Mask:** A top passivation layer is applied, and openings are created for solder bumps or balls for external connections.\n\n**Algorithm Specifics (Implicit)**\nWhile no explicit algorithms are detailed, the method implies highly precise computational models for:\n*   **Lithography Pattern Design:** Algorithms for optimizing mask designs to achieve ultra-fine lines and spaces while compensating for process variations (e.g., proximity effects, optical distortions).\n*   **Stress Simulation:** Computational models to predict and mitigate stress accumulation and warpage in multi-layered thin film stacks, informing material selection and process parameters.\n*   **Electrical Simulation:** Sophisticated electromagnetic simulators to model signal integrity, impedance matching, and parasitic effects of fine-pitch RDLs, guiding trace routing and dielectric thickness.\n\n**Integration Patterns and Performance Characteristics**\nThis technology is highly compatible with advanced packaging integration patterns such as 2.5D and 3D ICs, where interposers or through-silicon vias (TSVs) require extremely fine-pitch connectivity. The performance characteristics enabled are superior:\n*   **Reduced Package Thickness:** Direct result of thin RDLs.\n*   **Higher I/O Density:** Crucial for complex SoCs and chiplets.\n*   **Improved Signal Integrity:** Shorter, more precise traces reduce signal loss, crosstalk, and delay.\n*   **Enhanced Thermal Management:** Thinner dielectric layers can sometimes aid in heat dissipation, though specific materials would be critical.\n*   **Increased Reliability:** Optimized material interfaces and stress management lead to better long-term performance under thermal and mechanical stress.\n\nThis patent provides a critical technical foundation for the next generation of high-performance, compact electronic devices, offering a pathway to overcome the physical limitations of current semiconductor packaging.","business_analysis":"The patent \"Semiconductor Package and Fabricating Method Thereof\" (US-9852976) represents a significant advancement in semiconductor packaging, with profound implications for various industries and substantial market opportunities. This innovation addresses a core bottleneck in modern electronics manufacturing: the ability to create smaller, more powerful, and cost-effective microchips.\n\n**Market Opportunity Size:**\nThe global semiconductor packaging market is a multi-billion dollar industry, continuously growing due to the pervasive demand for electronics. Within this, advanced packaging, specifically solutions enabling miniaturization and high-density integration, is the fastest-growing segment. This patent directly targets this high-growth area, which is critical for sectors like mobile communication, IoT, AI/ML hardware, automotive electronics, and high-performance computing. The addressable market for this technology is therefore immense, encompassing virtually all manufacturers of advanced semiconductor devices. As devices demand finer pitches and thinner profiles, the market for solutions like this will only expand.\n\n**Competitive Advantages:**\nThis technology offers several compelling competitive advantages:\n\n1.  **Enabling Miniaturization:** The ability to create ultra-thin, fine-pitch redistribution structures allows for significantly smaller form factors for end products. This is a critical differentiator in consumer electronics, wearables, and medical devices where space is at a premium.\n2.  **Performance Enhancement:** Improved signal integrity, reduced parasitic effects, and shorter electrical pathways lead to faster, more energy-efficient chips. This directly translates to superior product performance, a key selling point in competitive markets.\n3.  **Cost Efficiency (Potential):** By providing a reliable and robust method for fine-pitch RDLs, the patent can lead to higher manufacturing yields compared to current, often problematic, approaches. Higher yields reduce rework and scrap, ultimately lowering per-unit production costs.\n4.  **Future-Proofing for Advanced Architectures:** This innovation is foundational for emerging technologies such as 2.5D/3D integration, chiplet designs, and advanced Fan-Out Wafer-Level Packaging (FOWLP). Companies adopting this technology will be better positioned to capitalize on these future trends.\n5.  **Intellectual Property Protection:** Owning a patent for such a critical component provides a strong competitive moat, allowing patentees to license the technology or gain a first-mover advantage in product development.\n\n**Revenue Potential:**\nRevenue can be generated through multiple avenues:\n\n*   **Direct Manufacturing:** Companies that implement this fabricating method can produce superior semiconductor packages, commanding premium prices for their advanced components.\n*   **Licensing:** The patent holder can license the technology to other semiconductor manufacturers, foundries, or Integrated Device Manufacturers (IDMs), generating recurring royalty revenue.\n*   **Product Differentiation:** Companies that integrate this technology into their own products (e.g., smartphones, AI accelerators) can differentiate their offerings based on superior performance, size, and power efficiency, leading to higher market share and profitability.\n\n**Business Models:**\nPotential business models include:\n\n*   **Foundry Services:** Offering advanced packaging services based on this patented method to fabless semiconductor companies.\n*   **Component Sales:** Manufacturing and selling semiconductor packages or modules that incorporate this technology.\n*   **IP Licensing:** A pure IP model, licensing the patent to multiple industry players.\n*   **Integrated Product Development:** Using the technology internally to build and sell end products.\n\n**Strategic Positioning:**\nCompanies leveraging this patent can strategically position themselves as leaders in advanced packaging, high-performance computing components, or miniaturized electronics. This technology allows for greater design flexibility, enabling new product categories and enhancing existing ones, thereby securing a strong foothold in the value chain.\n\n**ROI Projections:**\nThe ROI for investing in or licensing this technology can be substantial. Reduced manufacturing defects, increased yields, and the ability to command higher prices for superior products contribute to improved profit margins. Furthermore, the strategic advantage of enabling next-generation devices can lead to significant market share gains and long-term business growth. Early adopters could see a rapid return on investment through product differentiation and market leadership in key technology segments.","faqs":[{"answer":"The \"Semiconductor Package and Fabricating Method Thereof\" (US-9852976) is a patent that describes a novel structure for semiconductor devices and a method for manufacturing them. At its core, this innovation focuses on creating semiconductor packages that are exceptionally thin and feature 'fine-pitch redistribution structures'.\n\nIn simple terms, a semiconductor package is the protective casing and internal wiring that surrounds a microchip, allowing it to connect to other components. 'Redistribution structures' are the tiny electrical pathways inside this package that fan out the chip's connections. 'Fine-pitch' means these pathways are incredibly thin and closely spaced.\n\nThe patent outlines how to design these packages and the precise steps to build them, ensuring that despite their thinness and intricate wiring, they remain reliable and perform efficiently. This technology is crucial for making electronic devices smaller, lighter, and more powerful.\n\nKeywords: semiconductor package, fine-pitch redistribution, microchip structure, patent US-9852976, advanced packaging.","question":"What is Semiconductor Package and Fabricating Method Thereof?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof works by employing a sophisticated multi-layered approach to construct the internal wiring of a semiconductor package. The method details precise techniques for depositing and patterning conductive materials (like copper) and insulating layers (dielectrics) on a microscopic scale.\n\nImagine building a multi-story highway system inside a tiny box. Each 'story' is an ultra-thin layer of electrical pathways. The patent describes how to accurately create these pathways with 'fine-pitch' spacing, meaning the lines are extremely close together, maximizing the number of connections in a small area. Advanced photolithography and etching processes are used to define these intricate patterns, while careful material selection and process control ensure the layers adhere properly and don't warp.\n\nBy meticulously stacking these thin, precise layers, the invention allows for a high density of electrical connections within a minimal overall package height. This results in a compact, high-performance semiconductor package.\n\nKeywords: semiconductor fabrication, fine-pitch RDL, multi-layer packaging, photolithography, wafer-level packaging, how it works.","question":"How does Semiconductor Package and Fabricating Method Thereof work?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof patent primarily solves the critical industry problem of achieving extreme miniaturization and enhanced performance in electronic devices, which is often limited by traditional semiconductor packaging methods.\n\nAs microchips become more complex, they require an increasing number of electrical connections (I/O) in a smaller area. Conventional packaging struggles to create these 'fine-pitch' connections reliably and thinly without issues like signal integrity degradation, increased manufacturing defects, or excessive package thickness. This bottleneck hinders the development of thinner, lighter, and more powerful smartphones, wearables, AI accelerators, and other advanced electronics.\n\nThis innovation provides a robust solution by enabling the precise and reliable creation of ultra-thin, fine-pitch redistribution structures. It overcomes the physical and manufacturing constraints of prior art, allowing for higher integration density and superior electrical performance within a minimal form factor.\n\nKeywords: miniaturization challenge, semiconductor bottleneck, fine-pitch problem, advanced packaging solution, device performance, US-9852976.","question":"What problem does Semiconductor Package and Fabricating Method Thereof solve?"},{"answer":"The patent data provided indicates that the inventors and assignee information are not available in this specific abstract. However, typically, patents like \"Semiconductor Package and Fabricating Method Thereof\" are the result of extensive research and development efforts by teams of engineers and scientists within leading semiconductor companies or research institutions.\n\nThese innovations often stem from a collaborative environment where experts in materials science, electrical engineering, and process technology work together to overcome complex manufacturing challenges. The assignee would be the company or entity that owns the patent rights, often the employer of the inventors.\n\nWithout specific inventor and assignee details from the provided data, we can infer it originates from a significant player in the semiconductor manufacturing or packaging industry dedicated to advancing microchip technology.\n\nKeywords: patent inventors, patent assignee, semiconductor R&D, US-9852976 ownership, innovation team.","question":"Who invented Semiconductor Package and Fabricating Method Thereof?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof offers several significant benefits that drive the evolution of modern electronics. Firstly, it enables **unprecedented miniaturization**, allowing for the creation of significantly thinner and lighter semiconductor packages. This is crucial for sleek consumer electronics and portable devices.\n\nSecondly, it leads to **enhanced electrical performance**. By facilitating ultra-fine-pitch redistribution structures, the technology improves signal integrity, reduces parasitic effects (like unwanted capacitance and inductance), and enables faster data transfer rates. This translates to more powerful and energy-efficient microchips.\n\nThirdly, it offers **improved manufacturing reliability and potentially higher yields**. The detailed fabrication methods are designed for precision, reducing defects commonly associated with complex fine-pitch wiring. Lastly, it **future-proofs product development** by providing a foundational technology for next-generation chip architectures like 2.5D/3D integration and chiplets, which rely on dense, reliable interconnections.\n\nKeywords: key benefits, device miniaturization, enhanced performance, improved reliability, manufacturing yield, future technology, Semiconductor Package and Fabricating Method Thereof.","question":"What are the key benefits of Semiconductor Package and Fabricating Method Thereof?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof distinguishes itself from prior art by offering a more robust and effective solution for achieving ultra-thin, fine-pitch redistribution structures within semiconductor packages. Prior art often struggled with a trade-off between package thinness, interconnection density, and manufacturing reliability.\n\nEarlier methods typically involved RDLs with wider pitches and thicker layers due to limitations in photolithography and material science, leading to bulkier packages or restricted I/O counts. They also often faced significant challenges with package warpage due to internal stresses and had higher defect rates when attempting finer pitches.\n\nThis innovation, in contrast, provides a refined approach that precisely controls material deposition and patterning to achieve genuinely fine-pitch RDLs in an ultra-thin stack. It incorporates advanced stress management techniques and optimized material choices, leading to superior electrical performance, enhanced mechanical stability, and potentially higher manufacturing yields compared to previous technologies. It represents a systemic improvement rather than just an incremental one.\n\nKeywords: prior art comparison, packaging innovation, fine-pitch RDL, manufacturing differences, semiconductor technology, US-9852976 differentiation.","question":"How is Semiconductor Package and Fabricating Method Thereof different from prior art?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof patent will have a profound impact across numerous industries that rely on advanced electronics and microchips. Its ability to enable thinner, faster, and more integrated devices makes it a foundational technology for future innovation.\n\n**Consumer Electronics** will see continued advancements in smartphones, tablets, wearables (like smartwatches and AR/VR headsets), and laptops, making them even sleeker, more powerful, and potentially with longer battery life. The **Artificial Intelligence (AI)** and **High-Performance Computing (HPC)** sectors will benefit from the dense packaging required for powerful AI accelerators and processors, enabling more complex computations in smaller form factors.\n\nThe **Internet of Things (IoT)** will leverage this innovation for smaller, more efficient sensors and communication modules, driving growth in smart homes, smart cities, and industrial automation. Furthermore, the **Automotive Industry** will utilize this technology for advanced driver-assistance systems (ADAS) and autonomous vehicles, where compact, reliable, and high-performance electronics are critical. The **Medical Device** sector can also benefit from highly miniaturized and reliable implants or diagnostic tools.\n\nKeywords: industry impact, consumer electronics, AI hardware, IoT devices, automotive electronics, medical devices, advanced packaging applications, Semiconductor Package and Fabricating Method Thereof.","question":"What industries will Semiconductor Package and Fabricating Method Thereof impact?"},{"answer":"The patent titled \"Semiconductor Package and Fabricating Method Thereof\" (US-9852976) was filed on **January 6, 2017**. It was subsequently published on **December 26, 2017**.\n\nThe filing date marks the official submission of the invention to the patent office, establishing its priority date. The publication date is when the patent application becomes publicly accessible, allowing others to review its details and understand the disclosed technology.\n\nThese dates are important for tracking the lifecycle of the patent and understanding its position within the broader landscape of technological development in semiconductor packaging. They indicate that the innovation is relatively recent, reflecting contemporary challenges and solutions in microchip manufacturing.\n\nKeywords: patent filing date, publication date, US-9852976 timeline, patent lifecycle, semiconductor innovation history.","question":"When was Semiconductor Package and Fabricating Method Thereof filed/granted?"},{"answer":"The commercial applications of the Semiconductor Package and Fabricating Method Thereof are extensive, impacting nearly every sector that relies on advanced microelectronics. Its core capability—enabling ultra-thin, fine-pitch redistribution structures—directly translates into highly desirable product features.\n\nCommercially, this patent allows for the production of **thinner and lighter electronic devices**, giving manufacturers a competitive edge in consumer markets for smartphones, laptops, and wearables. It also facilitates **more powerful and energy-efficient processors** for servers, data centers, and specialized AI/ML hardware, leading to improved performance for cloud computing and edge AI applications.\n\nFurthermore, it enables **higher integration density**, meaning more functions can be packed into a single chip package, which is crucial for complex System-on-Chips (SoCs) used in automotive control units and advanced IoT devices. This leads to more compact and robust components for critical applications, driving innovation and market share across various high-tech segments. Licensing this technology could also be a significant commercial avenue for the patent holder.\n\nKeywords: commercial applications, product development, market advantage, thin devices, high-performance computing, AI applications, IoT solutions, US-9852976 commercialization.","question":"What are the commercial applications of Semiconductor Package and Fabricating Method Thereof?"},{"answer":"The Semiconductor Package and Fabricating Method Thereof provides a robust foundation for future developments in semiconductor technology. Its principles are expected to be refined and expanded upon to address even more demanding requirements.\n\nFuture developments will likely focus on pushing the boundaries of **fine-pitch capabilities** even further, potentially achieving sub-5 micrometer line/space dimensions. This will enable even greater integration density and support for emerging chip architectures like **3D chip stacking** and **chiplet integration**, where multiple specialized dies are combined into a single package. We can also expect advancements in **material science**, leading to new low-k dielectric materials with even better electrical and thermal properties, and more robust conductive materials for enhanced reliability.\n\nFurther automation and AI-driven optimization in the fabrication process itself are also anticipated, aimed at improving manufacturing yields and reducing costs for these ultra-complex structures. The core innovation of this patent will continue to serve as a critical enabler for the next generation of computing, sensing, and communication devices, ensuring that physical packaging limitations do not constrain digital innovation.\n\nKeywords: future developments, 3D stacking, chiplet integration, advanced materials, manufacturing automation, next-gen electronics, Semiconductor Package and Fabricating Method Thereof outlook, RDL advancements.","question":"What are the future developments expected for Semiconductor Package and Fabricating Method Thereof?"}],"topics":["semiconductor package","fine-pitch redistribution","chip fabrication","advanced packaging","microchip technology","relentless","march","towards"],"tech_cluster":null},"seo":{"title":"Semiconductor Package & Fabricating Method Thereof - US-9852976","description":"Explore the Semiconductor Package and Fabricating Method Thereof patent. This innovation introduces thin, fine-pitch redistribution structures for advanced semiconductor devices.","keywords":["semiconductor package","fine-pitch redistribution","chip fabrication","advanced packaging","microchip technology","semiconductor device","US-9852976","patent","manufacturing method","thin structures","RDL","electronics innovation"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852976","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852976","citation_suggestion":"Patentable. \"Semiconductor package and fabricating method thereof\" (US-9852976). https://patentable.app/patents/US-9852976","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852976","json":"https://patentable.app/api/llm-context/US-9852976","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T07:14:37.514Z"}