{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852979","patent":{"patent_number":"US-9852979","title":"Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips","assignee":null,"inventors":[],"filing_date":"2016-10-31T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":13,"abstract":"An electronic system comprising an electronic body (301) with terminal pads (310) and at least one capacitor embedded in the electronic body. The capacitor including an insulating and adhesive first polymeric film (302) covering the body surface except the terminal pads; a sheet (320) of high-density capacitive elements, the first capacitor terminal being a metal foil (321) attached to film (302), the second terminal a conductive polymeric compound (324), and the insulator a dielectric skin (323). Sheet (320) has sets of via holes: the first set holes reaching metal foil 321), the second set holes reaching the terminals (310), and the third set holes reaching the conductive polymeric compound (324). An insulating second polymeric film (303) lining the sidewalls of the holes and planarizing the sheet surface; and metal (432) filling the via holes between the polymeric sidewalls and forming conductive traces and attachment pads on the system surface."},"analysis":{"summary":"The patent, titled \"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips,\" introduces a sophisticated method for embedding high-density capacitors directly within an electronic body, such as a semiconductor package. This core innovation addresses the critical need for miniaturization and enhanced performance in modern electronic devices by overcoming the limitations of traditional discrete or less efficient embedded capacitor solutions.\n\nThe primary problem this invention solves is the trade-off between device size, electrical performance, and manufacturing complexity when integrating essential power delivery and signal integrity components. Conventional methods often lead to larger form factors, increased parasitic inductance and resistance due to longer interconnects, and challenges in achieving high capacitance density within compact spaces.\n\nThe key technical approach involves a multi-layered structure. It starts with an electronic body coated by an insulating first polymeric film. A high-density capacitive sheet, comprising a metal foil and a conductive polymeric compound separated by a dielectric skin, is then integrated. Crucially, the system features precisely formed via holes—'through-polymer vias'—that connect the capacitor terminals and the electronic body's pads. These vias are lined with a second insulating polymeric film for isolation and planarization, then filled with metal to create robust, low-impedance conductive traces and attachment pads.\n\nThe business value and applications of this technology are substantial. It enables the design of significantly smaller, lighter, and more powerful electronic devices across various sectors, including consumer electronics (smartphones, wearables), IoT, automotive, and high-performance computing. By improving power delivery network efficiency and reducing electromagnetic interference, it enhances device reliability and speed. Manufacturers can achieve higher integration densities and potentially streamline assembly processes, leading to cost efficiencies and competitive advantages.\n\nThis technology opens a significant market opportunity in advanced semiconductor packaging, particularly for solutions requiring high volumetric efficiency and superior electrical performance. It positions companies utilizing this approach to lead in the development of next-generation compact and high-functioning electronic systems, driving innovation in an increasingly miniaturized world.","layman_explanation":"### What Problem Does This Solve?\nImagine trying to build a super-fast, super-small racing car, but you have to bolt huge, clunky batteries and wires all over the outside. It would slow the car down and make it impractical. This is a lot like the challenge facing electronics manufacturers today. Modern devices like smartphones, smartwatches, and IoT sensors need to be incredibly compact and powerful, but the essential components that manage power—like capacitors—often take up too much space or introduce electrical 'noise' that degrades performance. Existing solutions either make devices too big or are too expensive and unreliable to manufacture at scale. The industry needs a way to integrate these power-managing components seamlessly and efficiently without compromising size or speed.\n\n### How Does It Work?\nThe patent, titled \"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips,\" offers an ingenious solution by effectively 'hiding' the power-managing components inside the device's main electronic brain. Think of it like this: instead of external batteries and wires, we're building tiny, high-performance power cells *into* the very layers of the chip package itself. It starts with a base electronic component. On top of this, a thin, insulating, and sticky plastic film is applied. Then, a super-thin 'power sandwich' is created – one layer of metal foil, a super-thin insulating layer (the 'dielectric skin'), and another layer of a special conductive plastic. This sandwich *is* the capacitor. The real cleverness comes with the 'through-polymer vias' – these are microscopic, precisely drilled tunnels that go through the plastic films and the power sandwich. These tunnels are then lined with another insulating plastic and filled with metal, creating miniature, robust wires that connect the capacitor directly to the electronic component's connections. This entire process ensures that the power cells are incredibly close to where they're needed, minimizing electrical travel time and maximizing efficiency.\n\n### Why Does This Matter?\nThis innovation is a game-changer for several reasons. Firstly, it allows for unprecedented miniaturization. Devices can become significantly smaller and lighter because the bulky external components are gone. This opens up new possibilities for wearables, medical implants, and advanced IoT devices. Secondly, by embedding capacitors so closely to the active electronics, it drastically improves performance. The 'wires' are much shorter, reducing electrical resistance and interference (known as 'parasitic effects'), which means power is delivered more cleanly and efficiently. This translates to faster processing, better signal quality, and longer battery life. For businesses, this means products that are not only more appealing to consumers due to their compact size but also more reliable and powerful. Companies that adopt this technology can gain a significant competitive edge, drive down manufacturing costs through streamlined integration, and unlock entirely new product categories.\n\n### What's Next?\nThe \"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips\" technology is poised to become a foundational element in advanced semiconductor packaging. We can expect to see its adoption in high-growth areas like autonomous vehicles, 5G infrastructure, and AI hardware, where performance and compact size are non-negotiable. As manufacturing processes become more refined, the cost-effectiveness will improve, making this advanced integration accessible to a broader range of electronic products. This patent isn't just an incremental improvement; it's a strategic enabler for the next generation of smart, connected, and powerful devices, offering substantial ROI for early investors and innovators.","technical_analysis":"The patent, \"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips,\" details a highly innovative approach to integrating high-density capacitors directly within an electronic body, fundamentally impacting semiconductor packaging and interconnect technology. This technical breakdown focuses on the architecture, implementation specifics, and performance implications of this invention.\n\n**Technical Architecture:**\nThe system's architecture is centered around an electronic body (301) which serves as the base, featuring pre-defined terminal pads (310). The innovation introduces an embedded capacitor structure built directly onto this body. The capacitor's construction begins with an insulating and adhesive first polymeric film (302) applied to the electronic body's surface, strategically exposing only the terminal pads. This film acts as a foundational dielectric and bonding layer.\n\nUpon this first film, a high-density capacitive element sheet (320) is integrated. This sheet is composed of three primary layers: a metal foil (321) functioning as the first capacitor terminal, a dielectric skin (323) serving as the capacitor's insulator, and a conductive polymeric compound (324) acting as the second capacitor terminal. The selection of these materials is critical; the polymeric films provide flexibility and conformability, while the metal foil ensures low sheet resistance and the dielectric skin dictates capacitance density and breakdown voltage.\n\n**Implementation Details & Via Structure:**\nThe defining feature of this technology lies in its 'through-polymer vias.' The capacitive sheet (320) is precisely patterned with three distinct sets of via holes:\n1.  **First set:** These vias extend down to connect with the metal foil (321), forming one electrode connection for the capacitor.\n2.  **Second set:** These vias are deeper, reaching and connecting to the terminal pads (310) of the electronic body, providing the main interface to the external system or other package layers.\n3.  **Third set:** These vias connect to the conductive polymeric compound (324), establishing the connection to the other electrode of the capacitor.\n\nThe formation of these vias typically involves advanced laser drilling or photolithographic patterning techniques to ensure high precision and aspect ratios.\n\nFollowing via formation, a crucial step involves applying a second insulating polymeric film (303). This film serves a dual purpose: it meticulously lines the sidewalls of all the via holes, providing electrical isolation between the subsequently filled metal and the surrounding capacitive layers or the electronic body. Simultaneously, this film planarizes the surface of the capacitive sheet, creating a smooth topography essential for reliable metallization and subsequent assembly processes. This planarization mitigates the risk of open circuits or shorts due to uneven surfaces.\n\nFinally, the via holes, now insulated by the second polymeric film, are filled with metal (432). This metal fill typically consists of copper, deposited using techniques like electroplating or electroless plating. This metallization forms robust conductive traces that pass through the embedded capacitor structure, ultimately creating attachment pads on the system surface. These metal-filled vias act as high-performance vertical interconnects, minimizing signal path lengths and parasitic effects.\n\n**Performance Characteristics & Code-Level Implications:**\nThe integration of capacitors directly within the package via this method offers significant performance advantages:\n*   **Reduced Parasitics:** The ultra-short electrical paths achieved by embedding capacitors close to active components drastically reduce parasitic inductance and resistance. This is crucial for high-frequency operation and efficient power delivery networks (PDNs), minimizing voltage ripple and ground bounce.\n*   **High Volumetric Efficiency:** The thin-film polymeric construction allows for very high capacitance density within a minimal volume, enabling significant miniaturization of electronic modules.\n*   **Improved Signal Integrity:** Shorter interconnects lead to better signal integrity, especially in high-speed digital and RF circuits, by reducing signal degradation and crosstalk.\n*   **Enhanced Thermal Management:** Polymeric materials can offer better thermal conductivity than traditional ceramic dielectrics, potentially aiding in heat dissipation from the embedded capacitor.\n*   **Robustness:** The flexible nature of polymeric films can impart improved mechanical shock and vibration resistance to the integrated package.\n\nWhile this patent primarily focuses on hardware architecture and manufacturing, its implications extend to the software and firmware layers. For instance, more stable power delivery networks enabled by this technology can lead to more reliable processor operation, potentially allowing for higher clock frequencies or lower voltage operation, which can be exploited by system-level software for performance optimization or power saving modes. Engineers designing power management ICs or high-speed data interfaces will need to account for the superior electrical characteristics provided by this approach, potentially simplifying decoupling strategies or enabling more aggressive signal transmission protocols. This invention represents a foundational advancement for hardware engineers, paving the way for next-generation electronic systems.","business_analysis":"The patent \"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips\" represents a significant leap in semiconductor packaging, holding substantial commercial potential and market implications. This innovation directly addresses critical industry demands for miniaturization, performance enhancement, and cost-effective manufacturing, positioning it to disrupt several key electronics sectors.\n\n**Market Opportunity Size:**\nThe global market for semiconductor packaging is immense, valued at hundreds of billions of dollars and growing steadily, driven by the proliferation of smart devices, IoT, AI, 5G, and automotive electronics. Within this, the segment for advanced packaging, particularly solutions that enable higher integration density and improved electrical performance, is experiencing accelerated growth. This technology directly targets this high-growth segment. The ability to embed high-density capacitors efficiently could capture a substantial share of the passive component integration market, especially in high-volume applications where space and performance are paramount. The market for embedded passives alone is projected to reach several billion dollars in the coming years.\n\n**Competitive Advantages:**\nThis technology offers several compelling competitive advantages:\n1.  **Superior Miniaturization:** By embedding capacitors directly within the electronic body, it significantly reduces the overall package footprint compared to discrete components or less efficient embedded solutions. This is a critical differentiator in markets demanding ultra-compact devices (e.g., wearables, medical implants, smartphones).\n2.  **Enhanced Performance:** The short, direct interconnects achieved through 'through-polymer vias' drastically reduce parasitic inductance and resistance. This leads to cleaner power delivery networks, improved signal integrity, and reduced electromagnetic interference, which translates to faster, more reliable device operation—a key selling point for high-performance computing, RF modules, and high-speed data applications.\n3.  **Cost Efficiency Potential:** While initial R&D and tooling may be significant, the streamlined integration process and potential for higher yields in mass production could lead to lower unit costs compared to complex multi-chip module assemblies or manual discrete component placement. Reduced component count and simplified board design can also contribute to overall system cost savings.\n4.  **Robustness and Reliability:** The use of polymeric films can offer improved mechanical flexibility and resistance to shock and vibration compared to brittle ceramic-based solutions, enhancing the overall reliability and lifespan of electronic products.\n\n**Revenue Potential and Business Models:**\nCompanies leveraging this patent could generate revenue through several models:\n*   **Licensing:** Patent holders can license the technology to semiconductor manufacturers, packaging houses, and OEM integrators.\n*   **Proprietary Product Development:** Develop and sell advanced semiconductor packages, SiPs (System-in-Package), or modules that incorporate this embedded capacitor technology.\n*   **Foundry Services:** Offer specialized manufacturing services for embedding capacitors using this process for other companies.\n*   **Material Sales:** Companies specializing in advanced polymeric films, dielectric skins, or conductive polymeric compounds could see increased demand for materials compatible with this integration method.\n\n**Strategic Positioning:**\nThis innovation allows companies to strategically position themselves at the forefront of advanced packaging. It enables the creation of next-generation products that are smaller, more powerful, and more energy-efficient, giving early adopters a significant lead. It aligns perfectly with industry trends towards heterogeneous integration and the 'More than Moore' paradigm, where value is added through sophisticated packaging rather than just transistor scaling.\n\n**ROI Projections:**\nInvestment in this technology promises a strong ROI due to its ability to address pervasive industry challenges. The reduction in product size and improvement in performance can command premium pricing in competitive markets. Furthermore, increased manufacturing efficiency and reliability can reduce warranty costs and improve customer satisfaction. For instance, a 10-15% reduction in package size or a 5-10% improvement in power efficiency could translate into billions in market share shifts and increased profitability for leading electronics brands. The long-term value lies in becoming an indispensable technology for future electronic architectures.","faqs":[{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips is a groundbreaking patent (US-9852979) that introduces an innovative method for embedding high-density capacitors directly within an electronic body, such as a semiconductor package. This technology aims to overcome the limitations of traditional capacitor integration, which often involves discrete components that consume valuable space and degrade electrical performance.\n\nAt its core, this invention describes a multi-layered structure where capacitors are built using specialized polymeric films and conductive materials. These layers are meticulously designed to maximize capacitance within a minimal footprint, providing a compact and efficient power management solution.\n\nThe key differentiator of this technology is the use of 'through-polymer vias' – tiny, metal-filled tunnels that pass through the polymeric layers to connect the embedded capacitor to the electronic body's terminal pads. These vias ensure robust, low-impedance electrical connections, which are crucial for high-performance electronic devices. This integrated approach allows for unprecedented miniaturization and improved electrical characteristics compared to conventional methods. Keywords: embedded capacitors, semiconductor packaging, through-polymer vias, high-density capacitors, US-9852979.","question":"What is Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips works by creating a sophisticated, layered structure directly within the electronic package. First, an insulating and adhesive polymeric film is applied to the electronic body, acting as a base layer and leaving terminal pads exposed.\n\nNext, a high-density capacitive sheet is formed on this film. This sheet consists of a metal foil (serving as one capacitor terminal), a thin dielectric skin (the insulating material of the capacitor), and a conductive polymeric compound (the second capacitor terminal). This sandwich-like structure provides the actual capacitance.\n\nCrucially, multiple sets of precisely engineered via holes are created through these layers. These 'through-polymer vias' connect to the metal foil, the conductive polymeric compound, and the electronic body's terminal pads. A second insulating polymeric film then lines the sidewalls of these vias and planarizes the surface. Finally, these insulated vias are filled with metal, forming robust, low-impedance conductive traces and attachment pads. This intricate process ensures the capacitor is seamlessly integrated and efficiently connected. Keywords: electronic system, polymeric film, metal foil, conductive polymeric compound, via holes, metal fill, integration process.","question":"How does Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips work?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips patent primarily solves the persistent problem of integrating high-performance capacitors into increasingly compact electronic devices without compromising performance or increasing manufacturing complexity.\n\nTraditional methods, such as using discrete surface-mount capacitors, consume significant board space, limiting device miniaturization. Moreover, the longer electrical pathways to these components introduce parasitic inductance and resistance, which degrade power delivery network (PDN) performance, cause voltage ripple, and reduce signal integrity, especially in high-speed applications. Earlier embedded capacitor solutions often struggled with achieving sufficient capacitance density, reliability, or cost-effective manufacturing.\n\nThis invention directly addresses these issues by enabling ultra-compact, high-density capacitor integration with minimal parasitic effects. It allows for significantly smaller device footprints, improved power stability, and enhanced signal quality, which are critical for the next generation of electronics. Keywords: miniaturization, parasitic inductance, power delivery network, signal integrity, electronic packaging, capacitor integration, performance degradation.","question":"What problem does Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips solve?"},{"answer":"The patent for Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips (US-9852979) does not list specific inventors or an assignee in the provided data. Patent documents typically credit the individual inventors who contributed to the conception of the invention, and often assign the rights to a company or organization (the assignee).\n\nWithout the specific names, it's impossible to identify the exact individuals or the entity that developed this innovative technology. However, such inventions are usually the result of extensive research and development efforts within semiconductor companies, academic institutions, or specialized R&D firms aiming to advance electronic packaging and integration techniques.\n\nFor precise information on the inventors and assignee, one would need to consult the full official patent document for US-9852979. Keywords: inventors, assignee, patent US-9852979, R&D, semiconductor companies, electronic packaging innovation.","question":"Who invented Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips offers several significant benefits that are crucial for modern electronics development.\n\nFirstly, it enables **unprecedented miniaturization**. By embedding high-density capacitors directly within the electronic package, it eliminates the need for bulky external components, leading to significantly smaller, thinner, and lighter devices. This is vital for wearables, smartphones, IoT sensors, and medical implants.\n\nSecondly, the technology delivers **superior electrical performance**. The use of 'through-polymer vias' creates ultra-short electrical paths, drastically reducing parasitic inductance and resistance. This translates to a cleaner, more stable power delivery network, improved signal integrity, and reduced electromagnetic interference (EMI), allowing devices to operate faster and more reliably.\n\nFinally, this approach offers **enhanced reliability and potential for cost efficiency**. The integrated, protected nature of the embedded components, combined with the robust polymeric materials, can improve the mechanical durability and lifespan of the electronic package. Furthermore, by streamlining component integration, it can lead to simplified assembly processes and higher manufacturing yields at scale, potentially reducing overall production costs. Keywords: miniaturization, electrical performance, power delivery, signal integrity, reliability, cost efficiency, embedded capacitors, through-polymer vias.","question":"What are the key benefits of Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips differentiates itself significantly from prior art in several key aspects of capacitor integration.\n\nCompared to **discrete surface-mount devices (SMDs)**, this invention eliminates the need for external components, dramatically reducing the device's footprint and the detrimental parasitic effects caused by longer interconnects. SMDs are inherently limited by their physical size and the routing complexity required to connect them.\n\nIn contrast to **earlier embedded passive technologies**, this patent introduces a more sophisticated and effective architecture. Many prior embedded solutions struggled with achieving high capacitance density in a thin form factor, or faced challenges with robust vertical interconnects. This invention utilizes a specific high-density capacitive sheet with unique material components (metal foil, dielectric skin, conductive polymeric compound) and, crucially, precisely engineered 'through-polymer vias' that connect these layers directly. The vias are meticulously lined with an insulating polymeric film and filled with metal, ensuring superior electrical isolation and low-impedance pathways.\n\nThis combination of high-density capacitor design, precise via formation, and robust polymeric insulation and planarization offers a level of integration, performance, and manufacturability that surpasses previous attempts at embedded capacitor technology. Keywords: prior art, discrete capacitors, embedded passives, high-density integration, through-polymer vias, parasitic effects, manufacturing, US-9852979.","question":"How is Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips different from prior art?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips patent is poised to have a transformative impact across a wide range of industries that rely on advanced electronics.\n\n**Consumer Electronics** will see significant benefits, enabling the creation of even thinner, lighter, and more powerful devices such as smartphones, smartwatches, augmented/virtual reality headsets, and other wearables. The enhanced power efficiency can also lead to longer battery life.\n\n**Internet of Things (IoT) and Edge AI** applications will thrive on this technology, allowing for the development of ultra-compact, robust, and energy-efficient sensors and processing units that can be seamlessly integrated into almost any environment or object. This is crucial for smart cities, industrial automation, and pervasive computing.\n\n**Automotive Electronics** will also be impacted, leading to more compact and reliable electronic control units (ECUs) for advanced driver-assistance systems (ADAS), infotainment systems, and autonomous driving platforms. In **Medical Devices**, the ability to miniaturize high-performance electronics will enable smaller, more sophisticated implantable devices and portable diagnostic tools. Furthermore, **High-Performance Computing (HPC)** and **5G Infrastructure** will benefit from improved power delivery networks and signal integrity, supporting faster data processing and communication. Keywords: consumer electronics, IoT, edge AI, automotive, medical devices, HPC, 5G, industry impact, electronic innovation.","question":"What industries will Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips impact?"},{"answer":"The patent for Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips, identified as US-9852979, has specific dates associated with its filing and publication.\n\nThe **filing date** for this patent was **October 31, 2016**. This is the date when the patent application was officially submitted to the patent office, initiating the examination process.\n\nThe **publication date** for this patent was **December 26, 2017**. This is the date when the patent was officially granted and published, making its details publicly accessible. The publication signifies that the invention has met the criteria for patentability, including novelty, non-obviousness, and utility, and that the patent holder has been granted exclusive rights to the invention for a specified period. Keywords: filing date, publication date, patent US-9852979, patent grant, patent timeline, intellectual property.","question":"When was Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips filed/granted?"},{"answer":"The commercial applications of the Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips are vast and varied, driven by its ability to deliver miniaturized, high-performance, and reliable electronic packages.\n\nIn **consumer electronics**, it will enable the next generation of ultra-thin laptops, high-resolution AR/VR headsets, and sophisticated wearables with extended battery life. For the **Internet of Things (IoT)**, this technology facilitates the creation of tiny, robust sensors and modules that can be embedded almost anywhere, from smart infrastructure to industrial equipment, expanding the reach of connected devices. **Automotive industry** applications include more compact and dependable electronic control units for advanced driver-assistance systems (ADAS) and electric vehicles, enhancing safety and performance.\n\nFurthermore, in **medical technology**, it allows for the development of smaller, less invasive implantable devices and more powerful portable diagnostic tools. For **high-performance computing (HPC)** and **telecommunications (5G)**, the improved power delivery and signal integrity offered by this patent are crucial for faster data processing, reduced latency, and more efficient network infrastructure. Any sector demanding high functionality in a compact, reliable form factor stands to benefit significantly from this innovation. Keywords: commercial applications, consumer electronics, IoT, automotive, medical technology, HPC, 5G, product development, market opportunities.","question":"What are the commercial applications of Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips?"},{"answer":"The Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips is a foundational technology, and its future developments are expected to build upon its core principles to achieve even greater integration and performance.\n\nOne key area of development will likely be in **advanced materials science**, exploring new polymeric films with higher dielectric constants, improved thermal conductivity, and enhanced mechanical properties. This could lead to even higher capacitance densities and greater reliability under extreme conditions. There may also be research into self-healing polymers to further improve device longevity.\n\nAnother significant development path is **multi-functional integration**. The 'through-polymer via' concept could be extended to embed other passive components like resistors and inductors, creating truly integrated passive devices (IPDs) within the package. This would further reduce component count and package size. Beyond passives, future iterations might explore integrating active components or even micro-electromechanical systems (MEMS) using similar advanced packaging techniques. Furthermore, **manufacturing process optimization** will continue, focusing on increasing yield, reducing costs, and enabling even finer feature sizes for the vias and layers. This continuous refinement will make the technology more accessible for mass production across a wider array of products. Keywords: future developments, advanced materials, multi-functional integration, IPDs, MEMS, manufacturing optimization, high-density packaging, electronic innovation, US-9852979.","question":"What are the future developments expected for Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips?"}],"topics":["Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips","US-9852979","embedded capacitors","semiconductor packaging","through-polymer vias","drive","increased","functionality"],"tech_cluster":null},"seo":{"title":"Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips - Patent US-9852979","description":"Discover the Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips patent, revolutionizing embedded capacitors for smaller, faster electronics.","keywords":["Conductive Through-polymer Vias for Capacitative Structures Integrated with Packaged Semiconductor Chips","US-9852979","embedded capacitors","semiconductor packaging","through-polymer vias","electronic miniaturization","high-density integration","power delivery network","signal integrity","advanced electronics patent"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852979","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852979","citation_suggestion":"Patentable. \"Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips\" (US-9852979). https://patentable.app/patents/US-9852979","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852979","json":"https://patentable.app/api/llm-context/US-9852979","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T15:30:45.434Z"}