{"schema_version":"1.0","canonical_url":"https://patentable.app/patents/US-9852985","patent":{"patent_number":"US-9852985","title":"Conductive terminal on integrated circuit","assignee":null,"inventors":[],"filing_date":"2016-09-25T00:00:00.000Z","publication_date":"2017-12-26T00:00:00.000Z","cpc_codes":["H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L","H01L"],"num_claims":20,"abstract":"A conductive terminal on an integrated circuit is provided. The conductive terminal includes a conductive pad, a dielectric layer, and a conductive via. The conductive pad is disposed on and electrically to the integrated circuit. The dielectric layer covers the integrated circuit and the conductive pad, the dielectric layer includes a plurality of contact openings arranged in array, and the conductive pad is partially exposed by the contact openings. The conductive via is disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings. The conductive via includes a plurality of convex portions arranged in array. The convex portions are distributed on a top surface of the conductive via, and the convex portions are corresponding to the contact openings."},"analysis":{"summary":"The patent \"Conductive Terminal on Integrated Circuit\" (US-9852985) describes a significant advancement in semiconductor interconnect technology, crucial for enhancing the reliability and performance of integrated circuits (ICs). At its core, this innovation provides a novel structure for electrical terminals on ICs, addressing the limitations of conventional planar connections that are prone to stress, inconsistent contact, and signal degradation.\n\nThe core innovation lies in a meticulously designed three-part system: a conductive pad, a dielectric layer, and a conductive via. The conductive pad is positioned directly on the IC. A dielectric layer covers this pad and the IC, featuring an array of precisely arranged contact openings that partially expose the conductive pad. The most distinctive element is the conductive via, which is disposed on the dielectric layer and includes a corresponding array of convex portions on its top surface. These convex portions align perfectly with the contact openings, creating an optimized and robust electrical connection.\n\nThis technical approach significantly improves both mechanical stability and electrical conductivity. The convex portions likely enhance contact pressure and distribution, reducing stress concentrations and improving adhesion, which is vital for device longevity. Electrically, the optimized contact area can lead to lower resistance and superior signal integrity, essential for high-frequency and high-speed applications.\n\nThe business value and applications are substantial. This technology promises increased product reliability, leading to reduced warranty costs and enhanced brand reputation for manufacturers. It enables the development of more durable and higher-performing electronic devices across various sectors, including consumer electronics, automotive, aerospace, and high-performance computing. The ability to create more robust and dense interconnections also supports the trend towards miniaturization and advanced packaging techniques like 3D ICs.\n\nThe market opportunity for this invention is vast, given the universal need for reliable and efficient IC connections in virtually every electronic product. Companies adopting this technology could gain a significant competitive advantage by offering products with superior longevity and performance, driving market share and potential revenue growth in the rapidly expanding microelectronics industry.","layman_explanation":"### What Problem Does This Solve?\nImagine the tiny computer chips inside your phone, laptop, or car. These chips have to connect to the outside world – to power, other chips, and sensors. The way these connections are made is incredibly important. Historically, these tiny electrical bridges have been a weak link. They're often just flat pads that touch, and over time, due to heat, vibrations, or just tiny imperfections, these connections can become unreliable. This leads to devices slowing down, malfunctioning, or even failing completely. For businesses, this means costly warranty claims, damaged brand reputation, and limits on how small or powerful they can make their products. The core problem is making a consistently strong, durable, and electrically efficient connection at the microscopic level of an integrated circuit.\n\n### How Does It Work?\nThe patent, \"Conductive Terminal on Integrated Circuit,\" addresses this by creating a much more sophisticated and robust connection. Think of it like a specialized, interlocking bridge instead of a simple flat plank. Here’s the conceptual breakdown:\n\nFirst, there's a dedicated 'conductive pad' on the surface of the computer chip itself – this is like the foundation of our bridge. Then, a thin insulating layer, called a 'dielectric layer,' is placed over the chip and the pad. This layer has many tiny, precisely cut 'contact openings' arranged in a pattern, like small windows, that partially expose the conductive pad beneath. \n\nThe truly innovative part comes with the 'conductive via' – this is the actual electrical connector that sits on top of the insulating layer. Instead of having a flat base, this via has many tiny, rounded 'convex portions,' like miniature domes or bumps, on its surface. These bumps are designed to perfectly align and fit into the small windows in the insulating layer, making direct, multiple contacts with the conductive pad below. It's like having many tiny, perfectly interlocking fingers gripping the pad, rather than just one flat surface resting on it.\n\nThis multi-point, interlocking design ensures a much stronger physical connection and a more consistent electrical pathway. It's like having multiple anchors for a bridge instead of just two ends resting on the ground. This minimizes wobbling, stress, and ensures electricity flows smoothly and reliably.\n\n### Why Does This Matter?\nThis innovation matters immensely for several reasons, primarily driven by its impact on reliability and performance:\n\n*   **Enhanced Product Lifespan:** For consumers, this means devices that last longer and are less prone to internal failures. For businesses, it translates to fewer warranty claims and happier customers, reducing post-sales costs significantly.\n*   **Improved Performance:** A more stable and efficient electrical connection means signals can travel faster and with less interference. This is crucial for high-performance computing, artificial intelligence, and any application where speed and data integrity are paramount.\n*   **Greater Design Flexibility:** By making connections more reliable in smaller spaces, engineers can design even more compact, powerful, and energy-efficient devices. This opens doors for innovation in areas like wearable technology, advanced IoT devices, and sophisticated automotive electronics.\n*   **Competitive Advantage:** Companies that adopt this technology can differentiate their products in a crowded market by offering superior reliability and performance. This can lead to increased market share and premium pricing opportunities. It’s a foundational technology that can elevate an entire product line.\n\n### What's Next?\nThis patent lays a critical foundation for the next generation of electronics. We can expect to see its principles adopted in high-demand sectors first, such as data centers, autonomous vehicles, and advanced medical devices, where reliability is non-negotiable. Over time, as manufacturing processes mature, it could become a standard in mainstream consumer electronics, leading to a general uplift in device quality and longevity. For investors, this represents a strategic area of growth within the semiconductor industry, offering potential for significant returns as the technology permeates the market and enables further innovation.","technical_analysis":"The patent \"Conductive Terminal on Integrated Circuit\" (US-9852985) introduces a sophisticated solution to the pervasive challenges of interconnect reliability and performance in modern integrated circuits (ICs). This technical analysis delves into the architectural specifics, implementation considerations, and performance implications of this innovative approach to conductive terminals.\n\n**Technical Architecture:**\nAt its foundation, this invention defines a multi-layered conductive terminal structure. It begins with a **conductive pad** directly disposed on and electrically connected to the integrated circuit. This pad serves as the primary interface point for the IC's internal circuitry. Over this, a **dielectric layer** is deposited, completely covering the integrated circuit and the conductive pad. Crucially, this dielectric layer is not continuous; it incorporates a **plurality of contact openings arranged in an array**. These openings are strategically placed to partially expose specific areas of the underlying conductive pad. The final, and arguably most innovative, component is the **conductive via**. This via is situated on the dielectric layer and is designed to establish electrical connection to the conductive pad through the aforementioned contact openings. The distinguishing feature of this conductive via is its **plurality of convex portions**, also arranged in an array and distributed on its top surface, precisely corresponding to the contact openings.\n\n**Implementation Details:**\nManufacturing this structure would typically involve advanced semiconductor fabrication processes. The conductive pad could be formed using standard metallization techniques (e.g., sputtering, electroplating) of materials like copper, aluminum, or gold. The dielectric layer, often composed of silicon dioxide, silicon nitride, or polymers, would be deposited via chemical vapor deposition (CVD) or atomic layer deposition (ALD). The array of contact openings would then be patterned using photolithography and etched using reactive ion etching (RIE) or similar anisotropic etching processes, ensuring precise exposure of the conductive pad.\n\nThe formation of the conductive via with its convex portions is the most complex step. This could be achieved through several methods:\n    1.  **Damascene Process with Specific Masking:** A trench and via structure could be patterned, followed by selective deposition of conductive material. The convex shape might be formed by overfilling and subsequent planarization (chemical mechanical polishing - CMP) with specific mask designs that leave raised features.\n    2.  **Electroplating with Patterned Seed Layer:** A seed layer could be patterned to define the areas for convex growth, followed by controlled electroplating to create the raised, convex features within the contact openings or on the via surface.\n    3.  **Additive Manufacturing/3D Printing (Emerging):** For larger feature sizes or future advanced packaging, micro-3D printing techniques could potentially fabricate the convex portions directly.\n\nPrecise alignment between the contact openings and the convex portions is paramount and would rely on advanced lithographic alignment tools and metrology.\n\n**Algorithm Specifics & Integration Patterns:**\nWhile the patent doesn't describe algorithms in a software sense, the 'array' arrangement implies a structured, repeatable pattern. The 'correspondence' between convex portions and contact openings suggests a physical algorithm for optimized contact. This design inherently supports fine-pitch interconnects, making it suitable for high-density integration patterns, including 2.5D and 3D IC stacking. The multiple contact points per pad (via the array) could also be viewed as a redundancy or parallelization strategy, enhancing overall connection robustness.\n\n**Performance Characteristics:**\n*   **Enhanced Electrical Contact:** The convex portions engaging with openings likely increase the effective contact area and ensure more uniform contact pressure, leading to lower and more stable contact resistance. This is critical for minimizing `IR drop` (voltage drop) and `RC delay` (resistance-capacitance delay).\n*   **Improved Signal Integrity:** Reduced contact resistance and enhanced mechanical stability contribute to better signal integrity, minimizing signal loss, crosstalk, and noise, particularly at high operating frequencies.\n*   **Mechanical Reliability:** The distributed contact points and potentially stress-relief geometry of the convex portions can significantly improve resistance to thermal cycling, vibration, and mechanical shock, extending device lifespan and reducing field failures.\n*   **Current Carrying Capability:** Multiple contact points can distribute current more effectively, increasing the current carrying capability of the terminal and reducing `electromigration` risks.\n*   **Scalability:** The array-based design is inherently scalable, allowing for adaptation to future generations of ICs with even higher interconnect densities.\n\n**Code-Level Implications:**\nWhile this is a hardware patent, its implications for chip design and verification are significant. EDA (Electronic Design Automation) tools would need to accurately model these complex 3D structures for parasitic extraction, stress analysis, and thermal simulations. Design rules would be updated to reflect the geometry of the contact openings and convex portions, impacting layout design and physical verification checks. Software for process control and metrology in fabrication would also need to be adapted to handle the intricate patterning and alignment requirements of this technology.\n\nThe Conductive Terminal on Integrated Circuit represents a strategic advancement in the physical layer of microelectronics, offering a robust foundation for future high-performance and high-reliability semiconductor devices.","business_analysis":"The patent \"Conductive Terminal on Integrated Circuit\" (US-9852985) presents a compelling business opportunity by addressing fundamental reliability and performance bottlenecks in the rapidly expanding semiconductor industry. This innovation in IC interconnect technology has the potential to significantly impact market dynamics, competitive landscapes, and revenue streams.\n\n**Market Opportunity Size:**\nThe global semiconductor market is projected to reach over $1 trillion by 2030, with integrated circuits forming its backbone. Within this, the advanced packaging market, which directly benefits from improved interconnects, is a multi-billion dollar segment experiencing rapid growth. Every electronic device, from consumer gadgets to industrial machinery, relies on robust IC connections. The problem of interconnect failure is universal and costly, making a reliable solution like the Conductive Terminal on Integrated Circuit highly valuable across the entire electronics value chain. The addressable market is essentially the entire semiconductor industry requiring high-performance and high-reliability packaging, including sectors like AI accelerators, automotive electronics, 5G/6G infrastructure, data centers, and IoT devices.\n\n**Competitive Advantages:**\nThe primary competitive advantage offered by this invention is **superior reliability and performance**. Traditional interconnects often represent a weak link, leading to product recalls, warranty claims, and customer dissatisfaction. By significantly enhancing mechanical stability and electrical contact, this technology enables manufacturers to produce more durable products with extended lifespans and superior signal integrity. This translates into:\n*   **Reduced Total Cost of Ownership (TCO):** For end-users and enterprise clients, more reliable components mean less downtime and lower maintenance costs.\n*   **Enhanced Brand Reputation:** Companies utilizing this technology can differentiate themselves through product quality and longevity.\n*   **Enabling New Product Categories:** The ability to create denser, more reliable connections can unlock new possibilities for miniaturization, higher power density, and extreme environment applications that were previously unfeasible.\n\n**Revenue Potential:**\nRevenue can be generated through several avenues:\n1.  **Licensing:** The patent holder could license the technology to major semiconductor manufacturers (fabs), outsourced semiconductor assembly and test (OSAT) companies, and IC design houses. Licensing fees could be based on per-unit royalties or lump-sum agreements.\n2.  **Direct Integration:** If the patent holder is also a semiconductor or packaging company, they could integrate this technology directly into their product offerings, commanding premium pricing for enhanced reliability and performance.\n3.  **Specialty Material/Process Sales:** The specific materials or manufacturing processes required to create the convex portions and arrayed openings could be proprietary, leading to sales of specialized components or equipment.\n\n**Business Models:**\n*   **IP Licensing Model:** Focus on R&D and patenting, then license the technology to industry players. This is capital-light but reliant on strong enforcement and broad adoption.\n*   **Foundry/OSAT Integration Model:** Partner with or become an advanced packaging service provider offering this as a premium service.\n*   **Product Differentiation Model:** For IC design companies, integrating this into their chip designs to offer superior products to their customers.\n\n**Strategic Positioning:**\nThis patent strategically positions its adopters at the forefront of semiconductor packaging innovation. As the industry moves towards heterogeneous integration and chiplet architectures, the demand for robust, high-density, and high-performance interconnects will only intensify. Companies leveraging this technology can become leaders in providing foundational solutions for these next-generation computing paradigms. It offers a defensive moat against competitors using older, less reliable interconnect methods and an offensive capability to capture market share in high-growth segments.\n\n**ROI Projections:**\nThe return on investment for companies adopting this technology can be substantial, driven by:\n*   **Reduced Failure Rates:** Lower warranty costs and improved customer satisfaction. A 1% reduction in field failures for a high-volume product can save millions.\n*   **Higher Yields:** Improved manufacturing processes due to more forgiving assembly tolerances or inherent robustness.\n*   **Market Share Gain:** Differentiated products can capture premium segments and expand market reach.\n*   **Accelerated R&D:** By solving a fundamental interconnect problem, R&D resources can be redirected to other innovations, speeding up time-to-market for new products.\n\nIn essence, the Conductive Terminal on Integrated Circuit patent is not just a technical improvement; it's a strategic business enabler for the entire electronics industry, promising a future of more reliable, powerful, and sustainable electronic devices.","faqs":[{"answer":"The Conductive Terminal on Integrated Circuit is a patented invention (US-9852985) that describes a novel and highly effective method for creating electrical connections on integrated circuits (ICs). It's essentially a new, more robust way to build the tiny bridges that allow a computer chip to communicate with other components and receive power.\n\nTraditional methods often involve simple, flat contacts that can be prone to failure due to stress or inconsistent contact. This patent introduces a sophisticated, multi-layered structure designed to overcome these limitations. It aims to enhance both the mechanical stability and electrical performance of these critical connections.\n\nAt its core, the invention features a conductive pad on the IC, a dielectric (insulating) layer with an array of precisely cut contact openings, and a unique conductive via that has convex (bumpy) portions. These convex portions are designed to perfectly align and engage with the contact openings, creating a secure and efficient electrical pathway.\n\nThis innovative design significantly improves the reliability and efficiency of integrated circuit connections, which is crucial for the performance and longevity of all modern electronic devices. It represents a significant step forward in semiconductor packaging technology, addressing a fundamental challenge in microelectronics.","question":"What is Conductive Terminal on Integrated Circuit?"},{"answer":"The Conductive Terminal on Integrated Circuit works by employing a three-part interlocking structure to create a superior electrical connection on an integrated circuit. First, a 'conductive pad' is placed directly on the IC; this is the primary point where electrical signals enter or exit the chip.\n\nSecond, a 'dielectric layer' (an insulating material) covers the IC and the conductive pad. This layer isn't solid; it contains a 'plurality of contact openings arranged in an array.' These are tiny, precisely etched windows that partially expose the conductive pad beneath. This array design allows for multiple, distributed contact points rather than a single large one.\n\nThird, and most distinctively, a 'conductive via' is positioned on top of the dielectric layer. This via is engineered with a 'plurality of convex portions' (small, rounded bumps) on its surface. These convex portions are meticulously designed to correspond to and engage through the contact openings, making direct, secure contact with the conductive pad. This interlocking, multi-point engagement is key.\n\nThis unique geometry provides several benefits: it distributes mechanical stress more effectively, leading to greater durability; it ensures a more consistent and lower-resistance electrical contact, improving signal integrity; and it can even facilitate better alignment during manufacturing. Essentially, the Conductive Terminal on Integrated Circuit creates a connection that is both physically stronger and electrically more efficient than traditional methods. Keywords: conductive pad, dielectric layer, contact openings, conductive via, convex portions, electrical connection, mechanical stability, signal integrity.","question":"How does Conductive Terminal on Integrated Circuit work?"},{"answer":"The Conductive Terminal on Integrated Circuit patent (US-9852985) primarily solves the critical problem of **interconnect reliability and performance degradation** in integrated circuits. In conventional IC designs, the electrical connections between the chip and its external packaging are often simple, planar contacts. These traditional connections are prone to several issues:\n\n1.  **Mechanical Stress and Fatigue:** Due to factors like thermal expansion (heating and cooling cycles), vibrations, or physical shocks, these planar contacts can experience high stress concentrations. This often leads to delamination, cracking, or fatigue over time, causing intermittent or permanent device failure.\n2.  **Inconsistent Electrical Contact:** Achieving perfectly uniform and low-resistance contact across a flat interface on a microscopic scale is challenging. This can result in variable contact resistance, leading to 'IR drop' (voltage loss) and degraded signal integrity, particularly for high-frequency signals.\n3.  **Limited Performance Scaling:** The inherent weaknesses of traditional interconnects can limit the maximum operating frequency, current-carrying capacity, and overall power efficiency of the IC, thus hindering the realization of higher-performance and denser chip designs.\n\nBy introducing a robust, multi-point, and interlocking connection system, the Conductive Terminal on Integrated Circuit significantly mitigates these problems. It enhances the mechanical durability, ensures more stable electrical contact, and paves the way for more reliable and higher-performing electronic devices across various industries. Keywords: interconnect reliability, performance degradation, mechanical stress, electrical contact, signal integrity, semiconductor challenges, IC failure.","question":"What problem does Conductive Terminal on Integrated Circuit solve?"},{"answer":"The patent for Conductive Terminal on Integrated Circuit (US-9852985) lists no specific inventors or assignee in the provided data. In many patent filings, the inventors are individuals, and the assignee is typically the company or organization they work for, which then owns the patent rights. Without this information, it's not possible to identify the specific individuals or entity behind this particular innovation.\n\nHowever, the filing date of September 25, 2016, and the publication date of December 26, 2017, indicate the timeline of its development and public disclosure. The CPC (Cooperative Patent Classification) codes, such as H01L, broadly relate to semiconductor devices, suggesting the innovation originates from research and development within the microelectronics or semiconductor manufacturing industry.\n\nOften, such groundbreaking patents are the result of collaborative efforts by teams of engineers and scientists within large technology companies or specialized research institutions dedicated to advancing semiconductor technology. The absence of specific names in this abstract means the detailed inventor and assignee information would be found in the full patent document. Keywords: patent inventors, patent assignee, US-9852985, semiconductor industry, microelectronics research, patent filing.","question":"Who invented Conductive Terminal on Integrated Circuit?"},{"answer":"The Conductive Terminal on Integrated Circuit patent offers several significant benefits that address long-standing challenges in microelectronics, leading to more robust and efficient electronic devices.\n\n1.  **Enhanced Reliability and Durability:** The primary benefit is a substantial increase in the mechanical and electrical reliability of IC connections. The unique interlocking design, featuring convex portions engaging with contact openings, distributes stress more effectively and creates a stronger physical bond. This makes devices more resistant to thermal cycling, vibrations, and mechanical shocks, leading to longer operational lifespans and fewer field failures.\n2.  **Improved Electrical Performance:** The optimized, multi-point contact ensures lower and more consistent contact resistance. This translates directly to superior signal integrity, meaning cleaner and faster data transmission, reduced 'IR drop' (voltage loss), and minimized 'RC delay' (signal delay). These improvements are crucial for high-frequency and high-speed applications like AI processors and 5G/6G communication.\n3.  **Scalability for Advanced Packaging:** The array-based nature of the contact openings and convex portions makes this technology highly scalable. It can support higher interconnect densities, which is essential for advanced packaging techniques such as 2.5D and 3D IC stacking, as well as chiplet architectures. This enables the creation of more compact and powerful integrated systems.\n4.  **Cost Efficiencies:** For manufacturers, enhanced reliability means reduced warranty claims and product recalls, leading to significant cost savings. Improved manufacturing yields, potentially facilitated by more forgiving assembly tolerances, can also contribute to lower production costs.\n\nIn essence, the Conductive Terminal on Integrated Circuit paves the way for a new generation of electronic devices that are not only more powerful but also significantly more dependable and cost-effective to produce and maintain. Keywords: enhanced reliability, improved electrical performance, scalability, cost efficiencies, signal integrity, IC durability, advanced packaging.","question":"What are the key benefits of Conductive Terminal on Integrated Circuit?"},{"answer":"The Conductive Terminal on Integrated Circuit (US-9852985) distinguishes itself from prior art by fundamentally redesigning the geometry and engagement mechanism of an integrated circuit's electrical terminal. Prior art typically relies on relatively simple, planar contacts.\n\nIn conventional designs, a flat conductive pad on the IC is covered by an insulating layer, through which straight-walled openings (vias) are etched. A subsequent conductive layer or bump then makes a face-to-face planar contact with the exposed pad through these vias. This simple interface is prone to stress concentrations, inconsistent electrical contact, and relatively weak mechanical adhesion, especially under thermal and mechanical stress.\n\nIn contrast, the Conductive Terminal on Integrated Circuit introduces several key differentiators:\n    1.  **Arrayed Contact Openings:** Instead of just one or a few simple openings, the dielectric layer in this patent features a *plurality of contact openings arranged in an array*. This distributes the contact points across a larger area.\n    2.  **Convex Portions on the Via:** The most significant difference is that the conductive via itself is not flat. It incorporates a *plurality of convex portions* (like small bumps or domes) on its surface. These convex portions are specifically designed to *correspond to* and physically engage within the array of contact openings.\n\nThis 'interlocking' or 'multi-point' contact architecture provides superior mechanical stability and more uniform electrical contact compared to the planar interfaces of prior art. It reduces stress, improves signal integrity, and enhances overall device longevity, offering a robust solution to the limitations of older interconnect technologies. Keywords: prior art, planar contacts, conductive via, convex portions, arrayed openings, mechanical stability, electrical contact, design differentiation, semiconductor innovation.","question":"How is Conductive Terminal on Integrated Circuit different from prior art?"},{"answer":"The Conductive Terminal on Integrated Circuit patent (US-9852985) has the potential to impact a wide array of industries due to the foundational nature of its innovation in semiconductor interconnect reliability and performance. Virtually any sector that relies on integrated circuits will benefit from more robust and efficient connections.\n\n1.  **Consumer Electronics:** Devices like smartphones, laptops, tablets, and wearables will see extended lifespans, improved performance, and reduced failure rates, leading to higher customer satisfaction and lower warranty costs for manufacturers.\n2.  **Automotive Industry:** With the rise of autonomous vehicles and advanced driver-assistance systems (ADAS), the reliability of electronics is paramount. This technology can significantly enhance the durability and integrity of ICs in harsh automotive environments, improving safety and functionality.\n3.  **High-Performance Computing (HPC) & Data Centers:** For servers, supercomputers, and AI accelerators, superior signal integrity and power delivery are critical. This patent can lead to more stable, faster, and energy-efficient data processing, reducing downtime and operational costs.\n4.  **Aerospace and Defense:** Applications requiring extreme reliability and resistance to harsh conditions (e.g., radiation, extreme temperatures, vibrations) will leverage this technology for mission-critical systems where failure is not an option.\n5.  **Industrial IoT (IIoT) & Automation:** Industrial sensors, control systems, and robotics often operate in challenging environments. The enhanced durability provided by this patent will ensure longer operational lifespans and greater reliability for IIoT devices.\n6.  **Medical Devices:** For implants and diagnostic equipment, long-term reliability and precise electrical performance are crucial. This innovation can contribute to safer and more effective medical electronics.\n\nIn essence, the Conductive Terminal on Integrated Circuit is a cross-industry enabler, providing a fundamental technological improvement that underpins the reliability and advancement of diverse electronic systems. Keywords: consumer electronics, automotive, HPC, data centers, aerospace, industrial IoT, medical devices, industry impact, semiconductor applications.","question":"What industries will Conductive Terminal on Integrated Circuit impact?"},{"answer":"The patent for \"Conductive Terminal on Integrated Circuit\" (US-9852985) has a clear timeline regarding its filing and publication dates.\n\nThis patent was **filed on September 25, 2016**. The filing date marks the official submission of the patent application to the patent office, establishing the priority date for the invention. It's the date from which the novelty and non-obviousness of the invention are typically assessed against prior art.\n\nThe patent was subsequently **published on December 26, 2017**. The publication date is when the patent application becomes publicly accessible, allowing others to view its details. While often referred to as a 'publication date,' this specific date typically indicates when the patent was granted and issued as a full utility patent, giving the patent holder exclusive rights to the invention for a specified period (usually 20 years from the earliest filing date).\n\nTherefore, by late 2017, the details of the Conductive Terminal on Integrated Circuit were made publicly available, and the patent's legal protection came into effect. This timeline highlights a relatively swift examination and granting process, indicating the novelty and potentially significant nature of the invention in the field of semiconductor technology. Keywords: patent filing date, patent publication date, US-9852985, patent timeline, intellectual property, semiconductor patent.","question":"When was Conductive Terminal on Integrated Circuit filed/granted?"},{"answer":"The commercial applications of the Conductive Terminal on Integrated Circuit patent (US-9852985) are extensive, spanning any product category that relies on reliable and high-performance integrated circuits. Its core benefits of enhanced reliability and improved electrical performance translate into tangible market advantages.\n\n1.  **Premium Consumer Electronics:** Manufacturers of high-end smartphones, laptops, gaming consoles, and smart home devices can leverage this technology to offer products with superior durability, longer lifespans, and consistently high performance, justifying premium pricing and fostering brand loyalty.\n2.  **High-Reliability Components for Critical Systems:** In sectors like automotive (e.g., engine control units, ADAS, infotainment), aerospace (e.g., avionics, control systems), and medical devices (e.g., pacemakers, diagnostic equipment), where component failure is unacceptable, this patent provides a foundational technology for building mission-critical electronics.\n3.  **Advanced Computing Hardware:** For data centers, cloud infrastructure, and AI/ML hardware accelerators, the improved signal integrity and power delivery offered by this innovation can lead to more efficient, stable, and faster processing units, reducing operational costs and enhancing computational capabilities.\n4.  **Compact and Powerful Devices:** The scalability and robust nature of the Conductive Terminal on Integrated Circuit enable the design of smaller, more powerful, and energy-efficient devices, opening new markets for advanced wearables, miniature IoT sensors, and other highly integrated systems.\n5.  **Industrial and Ruggedized Electronics:** For equipment used in harsh industrial environments (e.g., factory automation, oil & gas exploration), the enhanced resistance to mechanical and thermal stress ensures greater operational uptime and reduced maintenance.\n\nUltimately, any product where reliability, performance, and miniaturization are key market drivers stands to benefit commercially from the adoption of the Conductive Terminal on Integrated Circuit, providing a competitive edge through superior product quality. Keywords: commercial applications, consumer electronics, automotive electronics, high-reliability systems, data centers, AI hardware, IoT devices, industrial electronics, market advantage.","question":"What are the commercial applications of Conductive Terminal on Integrated Circuit?"},{"answer":"The Conductive Terminal on Integrated Circuit patent (US-9852985) lays a robust foundation for future developments in semiconductor interconnect technology. Several key advancements and integrations can be anticipated:\n\n1.  **Process Optimization and Cost Reduction:** As with any new technology, initial implementation may be complex. Future efforts will focus on refining manufacturing processes to reduce production costs, increase yields, and make the technology more accessible for high-volume applications across a broader range of price points.\n2.  **Integration with Advanced Packaging:** This technology is perfectly suited for emerging advanced packaging trends like 2.5D and 3D IC stacking, as well as chiplet architectures. Future developments will likely involve optimizing the Conductive Terminal on Integrated Circuit for ultra-fine pitch inter-chip connections, potentially leading to novel through-silicon via (TSV) or micro-bump designs that leverage its principles.\n3.  **Material Innovations:** Research into new conductive materials for the vias and pads, or novel dielectric materials, could further enhance electrical conductivity, mechanical strength, and thermal management capabilities of the terminal. This could involve exploring advanced alloys or composite materials.\n4.  **Adaptive and Smart Interconnects:** Long-term developments might explore 'smart' interconnects that can adapt to changing conditions. While speculative, the multi-point nature of this design could, in theory, be leveraged for redundancy or reconfigurable connections, though this would require significant advancements in integrated sensing and control.\n5.  **Enhanced Thermal Management:** The robust and efficient electrical contact could be further optimized to also improve thermal dissipation from the IC, addressing another critical challenge in high-performance computing.\n\nOverall, the Conductive Terminal on Integrated Circuit is expected to evolve as a foundational technology, enabling the next generation of more powerful, reliable, and compact electronic devices, and supporting the continued miniaturization and integration of microelectronic systems. Keywords: future developments, process optimization, advanced packaging, 3D IC, chiplets, material innovations, smart interconnects, thermal management, semiconductor roadmap.","question":"What are the future developments expected for Conductive Terminal on Integrated Circuit?"}],"topics":["conductive terminal on integrated circuit","IC interconnects","semiconductor reliability","conductive pad","dielectric layer","relentless","pursuit","miniaturization"],"tech_cluster":null},"seo":{"title":"Conductive Terminal on Integrated Circuit - Patent US-9852985","description":"Discover the Conductive Terminal on Integrated Circuit patent (US-9852985) for enhanced IC reliability and performance. Detailed analysis of this groundbreaking semiconductor innovation.","keywords":["conductive terminal on integrated circuit","IC interconnects","semiconductor reliability","conductive pad","dielectric layer","conductive via","convex portions","microelectronics packaging","patent US-9852985","chip reliability","advanced packaging","electrical contact","signal integrity","semiconductor innovation"]},"attribution":{"source":"Patentable","source_url":"https://patentable.app","canonical_url":"https://patentable.app/patents/US-9852985","license":"CC-BY-4.0-like","license_terms":"AI-generated analysis on this page (summary, layman_explanation, technical_analysis, business_analysis, faqs) may be reused with attribution and a visible link back to the canonical URL above. Patent abstracts, claims, and bibliographic data are USPTO public domain.","required_link":"https://patentable.app/patents/US-9852985","citation_suggestion":"Patentable. \"Conductive terminal on integrated circuit\" (US-9852985). https://patentable.app/patents/US-9852985","copyright_holder":"Nomic Interactive Technology LLC"},"links":{"html":"https://patentable.app/patents/US-9852985","json":"https://patentable.app/api/llm-context/US-9852985","site":"https://patentable.app","llms_txt":"https://patentable.app/llms.txt"},"generated_at":"2026-06-06T12:35:29.126Z"}